PS2861B规格书,Datasheet 资料
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DESCRIPTION
The PS2861B-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor.
The package has a shield effect to cut off ambient light, and is mounted in a Shrink SOP (Small Outline Package) for high density applications.
Due to the high isolation voltage between the input and output, the PS2861B-1 is suitable for interface and signal transfer circuits that require surface or high-density mounting.
FEATURES
? Operating ambient temperature: 110°C ? Isolation distance (0.4 mm MIN.)
? High isolation voltage (BV = 3 750 Vr.m.s.) ? Shrink SOP (Small Outline Package) type
? High-speed switching (t r = 4 μs TYP., t f
= 5 μs TYP.) ? Embossed tape product: PS2861B-1-F3: 3 500 pcs/reel ? Pb-Free product ? Safety standards
? UL approved: No. E72422
? CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) ? BSI approved: No. 8979/8980 ? SEMKO approved: No. 908508
? DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024453 (Option) APPLICATIONS
? Power supply
? Programmable logic controllers
PHOTOCOUPLER
PS2861B-1
4-PIN SSOP PHOTOCOUPLER
OPERATING AMBIENT TEMPERATURE 110°C
?NEPOC Series ?
Document No. PN10742EJ02V0DS (2nd edition) Date Published March 2010 NS
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PACKAGE DIMENSIONS (UNIT : mm)
PHOTOCOUPLER CONSTRUCTION
Parameter Unit (MIN.)
Air Distance 5.0 mm Creepage Distance 5.0 mm Isolation Distance
0.4 mm
MARKING EXAMPLE
Data Sheet PN10742EJ02V0DS
2
PS2861B-1
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ORDERING INFORMATION
Part Number
Order Number
Solder Plating Specification
etc.
Packing Style
Safety Standard
Approval
Application Part Number
*1
PS2861B-1 PS2861B-1Y-A Pb-Free and Magazine case 100 pcs Standard products PS2861B-1 PS2861B-1-F3 PS2861B-1Y-F3-A Halogen Free Embossed Tape 3 500 pcs/reel
(UL, CSA, BSI,
SEMKO approved) PS2861B-1-V PS2861B-1Y-V-A Magazine case 100 pcs DIN EN60747-5-2 PS2861B-1-V-F3 PS2861B-1Y-V-F3-A Embossed Tape 3 500 pcs/reel (VDE0884 Part2)
approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (T A = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode
Forward Current (DC)
I F 50 mA Reverse Voltage V R 6 V
Power Dissipation Derating
ΔP D /°C 0.6 mW/°C
Power Dissipation P D 60 mW Peak Forward Current1*1
I FP 1 2.5 A
Peak Forward Current2*2
I FP 2 1.0 Transistor Collector to Emitter Voltage V CEO 70 V
Emitter to Collector Voltage
V ECO 5 V Collector Current I C 50 mA
Power Dissipation Derating
ΔP C /°C 1.2 mW/°C
Power Dissipation P C 120 mW
Isolation Voltage *3
BV 3 750 Vr.m.s. Operating Ambient Temperature T A –55 to +110 °C Storage Temperature
T stg
–55 to +150
°C
*1 PW = 10 μs, Duty Cycle = 1% *2 PW = 100 μs, Duty Cycle = 1%
*3 AC voltage for 1 minute at T A = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10742EJ02V0DS
3
PS2861B-1
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ELECTRICAL CHARACTERISTICS (T A = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage
V F
I F = 5 mA 1.1 1.4 V
Reverse Current I R V R = 5 V
5 μA
Terminal Capacitance C t V = 0 V, f = 1 MHz 15 pF Transistor Collector to Emitter Dark
Current
I CEO
I F = 0 mA, V CE = 24 V
100
nA
I F = 5 mA, V CE = 5 V 50 150 300 % Coupled
Current Transfer Ratio
(I C /I F )*1
CTR I F = 1 mA, V CE = 5 V 10 50 Collector Saturation Voltage
V CE (sat)
I F = 10 mA, I C = 2 mA
0.3
V
Isolation Resistance R I-O V I-O = 1 kV DC 1011
Ω Isolation Capacitance C I-O V = 0 V, f = 1 MHz
0.4
pF
Rise Time *2
t r V CC = 5 V, I C = 2 mA, R L = 100 Ω
4 μs Fall Time *2
t f
5
*1 CTR rank
CTR Rank CTR (%) Conditions
100 to 300 I F = 5 mA, V CE = 5 V L
20 and larger
I F = 1 mA, V CE = 5 V 50 to 150 I F = 5 mA, V CE = 5 V M
10 and larger
I F = 1 mA, V CE = 5 V 50 to 300 I F = 5 mA, V CE = 5 V N
10 and larger
I F = 1 mA, V CE = 5 V
*2 Test circuit for switching time
Input
Output
90%
10%
V CC
V OUT
Pulse Input In monitor
μ
Data Sheet PN10742EJ02V0DS
4
PS2861B-1
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TYPICAL CHARACTERISTICS (T A = 25°C, unless otherwise specified)
Ambient Temperature T A (°C)D i o d e P o w e r D i s s i p a t i o
n P D (m W )
DIODE POWER DISSIPATION vs.AMBIENT TEMPERATURE
Ambient Temperature T A (°C)
T r a n s i s t o r P o w e r D i s s i p a t i o n P C (m W )
TRANSISTOR POWER DISSIPATION vs.AMBIENT TEMPERATURE
Collector to Emitter Voltage V CE (V)
C o l l e c t o r C u r r e n t I C (m A )
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
Ambient Temperature T A (°C)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
C o l l e c t o r t o E m i t t e r
D a r k C u r r e n t I C
E O (n A )
Collector Saturation Voltage V CE (sat) (V)
C o l l e c t o r C u r r e n t I C (m A )
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
204060120
10080200180160140120100806040200
25
50
75
100125
1.2 mW/°150
C
10 0000.1100
1 000101
V CE = 24 V
5
Forward Voltage V F (V)F o r w a r d C u r r e n t I F (m A )
FORWARD CURRENT vs.FORWARD VOLTAGE
Remark The graphs indicate nominal characteristics.
Data Sheet PN10742EJ02V0DS
5
PS2861B-1
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–––––Ambient Temperature T A (°C)NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
N o r m a l i z e d C u r r e n t T r a n s f e r R a t i o C T R
Load Resistance R L (Ω)SWITCHING TIME vs.
LOAD RESISTANCE
S w i t c h i n g T i m e t ( s )
μLoad Resistance R L (k Ω)
SWITCHING TIME vs.LOAD RESISTANCE
S w i t c h i n g T i m e t ( s )
μFrequency f (kHz)
N o r m a l i z e d G a i n G V
FREQUENCY RESPONSE
Forward Current I F (mA)
C u r r e n t T r a n s f e r R a t i o C T R (%)
CURRENT TRANSFER RATIO vs.FORWARD CURRENT
Ambient Temperature T A (°C)
NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
N o r m a l i z e d C u r r e n t T r a n s f e r R a t i o C T R
Remark The graphs indicate nominal characteristics.
Data Sheet PN10742EJ02V0DS
6
PS2861B-1
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PS2861B-1 TAPING SPECIFICATIONS (UNIT : mm)
Data Sheet PN10742EJ02V0DS 7 芯天下--f85c9c2631126edb6f1a106c/
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
Remark All dimensions in this figure must be evaluated before use.
Data Sheet PN10742EJ02V0DS
8 PS2861B-1
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NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
? Peak reflow temperature
260°C or below (package surface temperature) ? Time of peak reflow temperature
10 seconds or less ? Time of temperature higher than 220°C
60 seconds or less ? Time to preheat temperature from 120 to 180°C 120±30 s
? Number of reflows
Three ? Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
P a c k a g e S u r f a c e T e m p e r a t u r e T (°C )Time (s)Recommended Temperature Profile of Infrared Reflow
(2) Wave soldering
? Temperature
260°C or below (molten solder temperature) ? Time
10 seconds or less ? Preheating conditions
120°C or below (package surface temperature) ? Number of times
One (Allowed to be dipped in solder including plastic mold portion.) ? Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
? Peak temperature (lead part temperature)
350°C or below ? Time (each pins)
3 seconds or less ? Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. Data Sheet PN10742EJ02V0DS 9
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(4) Cautions
? Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between corrector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according to product.
When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10742EJ02V0DS
10 PS2861B-1
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SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol
Spec.
Unit Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test) U pr = 1.5 × U IORM, P d< 5 pC U IORM
U pr
710
1 065
V peak
V peak
Test voltage (partial discharge test, procedure b for all devices) U pr = 1.875 × U IORM, P d< 5 pC U pr 1
331 V peak
Highest permissible overvoltage U TR 6
000 V peak Degree of pollution (DIN EN 60664-1 VDE0110Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range T stg–55 to +150 °C Operating temperature range T A–55 to +110 °C Isolation resistance, minimum value
V IO = 500 V dc at T A = 25°C
V IO = 500 V dc at T A MAX. at least 100°C Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve)
Package temperature
Current (input current I F, Psi = 0)
Power (output or total power dissipation) Isolation resistance
V IO = 500 V dc at T A = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
Data Sheet PN10742EJ02V0DS 11
PS2861B-1
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The information in this document is current as of March, 2010. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application.
(Note)
??????M8E0904E (1)(2)"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":"Special":"Specific":
Data Sheet PN10742EJ02V0DS
12 PS2861B-1
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PS2861B-1
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