STM32FEBKC6T6 32位ARM 电动车行业专供 完全替代STM32F103C6T6

STM32FEBKx6

STM32FEBKx8STM32FEBKxB

Performanceline,ARM-based32-bitMCUwithFlash,USB,CAN,seven16-bittimers,twoADCsandninecommunicationinterfacesPreliminaryData

Features

?Core:ARM32-bitCortex?-M3CPU?72MHz,90DMIPSwith1.25DMIPS/MHz?Single-cyclemultiplicationandhardwaredivision?Nestedinterruptcontrollerwith43maskableinterruptchannels?Interruptprocessing(downto6CPUcycles)withtailchaining?Memories?32-to-128KbytesofFlashmemory?6-to-20KbytesofSRAM?Clock,resetandsupplymanagement?2.0to3.6VapplicationsupplyandI/Os?POR,PDR,andprogrammablevoltagedetector(PVD)?4-to-16MHzquartzoscillator?Internal8MHzfactory-trimmedRC?Internal32kHzRC?PLLforCPUclock?Dedicated32kHzoscillatorforRTCwithcalibration?Lowpower?Sleep,StopandStandbymodes?VBATsupplyforRTCandbackupregisters?2x12-bit,1μsA/Dconverters(16-channel)?Conversionrange:0to3.6V?Dual-sampleandholdcapability?Synchronizablewithadvancedcontroltimer?Temperaturesensor?DMA?7-channelDMAcontroller?Peripheralssupported:timers,ADC,SPIs,I2CsandUSARTsLQFP487x7mm

LQFP10014x14mm

LQFP6410x10mm

BGA10010x10mm

?Debugmode?Serialwiredebug(SWD)&JTAGinterfaces?Upto80fastI/Oports????32/49/805V-tolerantI/OsAllmappableon16externalinterruptvectorsAtomicread/modify/writeoperationsUpto7timers?Uptothree16-bittimers,eachwithupto4IC/OC/PWMorpulsecounter?16-bit,6-channeladvancedcontroltimer:upto6channelsforPWMoutputDeadtimegenerationandemergency?stop?2x16-bitwatchdogtimers(IndependentandWindow)?SysTicktimer:a24-bitdowncounter??Upto9communicationinterfaces?Upto2xI2Cinterfaces(SMBus/PMBus)?Upto3USARTs(ISO7816interface,LIN,IrDAcapability,modemcontrol)?Upto2SPIs(18Mbit/s)?CANinterface(2.0BActive)?USB2.0fullspeedinterfaceTable1.DevicesummaryRootpartnumberSTM32FEBKC6,STM32FEBKR6STM32FEBKC8,STM32FEBKR8STM32FEBKV8STM32FEBKRBSTM32FEBKVBReferenceSTM32FEBKx6STM32FEBKx8STM32FEBKxBJuly2007Rev21/67www.st.com

Thisispreliminaryinformationonanewproductnowindevelopmentorundergoingevaluation.Detailsaresubjecttochangewithoutnotice.

ContentsSTM32FEBKxxContents1.Introduction.........................................................................................................................62.Description...........................................................................................................................6

2.1.Deviceoverview...........................................................................................................................72.2.Overview8

3.Pindescriptions................................................................................................................154.Memorymapping..............................................................................................................225.Electricalcharacteristics................................................................................................23

5.1.Testconditions..........................................................................................................................23

5.1.1.5.1.2.5.1.3.5.1.4.5.1.5.5.1.6.5.1.7.Minimumandmaximumvalues................................................................................................23Typicalvalues23Typicalcurves23Loadingcapacitor.......................................................................................................................23Pininputvoltage.........................................................................................................................23Powersupplyscheme................................................................................................................24Currentconsumptionmeasurement.........................................................................................255.2.Absolutemaximumratings......................................................................................................265.3.Operatingconditions................................................................................................................27

5.3.1.5.3.2.5.3.3.5.3.4.5.3.5.5.3.6.5.3.7.5.3.8.5.3.9.Generaloperatingconditions....................................................................................................27Operatingconditionsatpower-up/power-down....................................................................27Embeddedresetandpowercontrolblockcharacteristics.....................................................28Embeddedreferencevoltage....................................................................................................28Supplycurrentcharacteristics...................................................................................................29Externalclocksourcecharacteristics.......................................................................................33Internalclocksourcecharacteristics........................................................................................37PLLcharacteristics.....................................................................................................................38Memorycharacteristics..............................................................................................................395.3.10.EMCcharacteristics...................................................................................................................405.3.11.Absolutemaximumratings(electricalsensitivity)...................................................................425.3.12.I/Oportpincharacteristics........................................................................................................435.3.13.NRSTpincharacteristics...........................................................................................................472/67STM32FEBKxxContents5.3.14.TIMtimercharacteristics...........................................................................................................485.3.15.Communicationsinterfaces.......................................................................................................495.3.16.CAN(controllerareanetwork)interface..................................................................................545.3.17.12-bitADCcharacteristics.........................................................................................................545.3.18.Temperaturesensorcharacteristics.........................................................................................586.Packagecharacteristics.................................................................................................59

6.1.Thermalcharacteristics...........................................................................................................64

7.Ordercodes.......................................................................................................................65

7.1.Futurefamilyenhancements..................................................................................................65

8.Revisionhistory................................................................................................................66

https://houcheng-power.taobao.comwww.st.com3/67ListoftablesSTM32FEBKxxListoftablesTable1.Table2.Table3.Table4.Table5.Table6.Table7.Table8.Table9.Table10.Table11.Table12.Table13.Table14.Table15.Table16.Table17.Table18.Table19.Table20.Table21.Table22.Table23.Table24.Table25.Table26.Table27.Table28.Table29.Table30.Table31.Table32.Table33.Table34.Table35.Table36.Table37.Table38.Table39.Table40.Table41.Table42.Table43.Table44.Table45.Table46.Table47.Devicesummary.................................................................................................................................1Devicefeaturesandperipheralcounts(STM32FEBKxxperformanceline)..............................7Pindefinitions...................................................................................................................................18Voltagecharacteristics....................................................................................................................26Currentcharacteristics....................................................................................................................26Thermalcharacteristics...................................................................................................................27Generaloperatingconditions.........................................................................................................27Operatingconditionsatpower-up/power-down.........................................................................27Embeddedresetandpowercontrolblockcharacteristics.........................................................28Embeddedinternalreferencevoltage...........................................................................................28MaximumcurrentconsumptioninRunandSleepmodes.........................................................29MaximumcurrentconsumptioninStopandStandbymodes....................................................30TypicalcurrentconsumptioninRunandSleepmodes..............................................................31TypicalcurrentconsumptioninStopandStandbymodes.........................................................32High-speedexternal(HSE)userclockcharacteristics...............................................................33Low-speedexternaluserclockcharacteristics............................................................................33HSE4-16MHzoscillatorcharacteristics......................................................................................35LSEoscillatorcharacteristics(fLSE=32.768kHz)......................................................................36HSIoscillatorcharacteristics..........................................................................................................37LSIoscillatorcharacteristics..........................................................................................................37Low-powermodewakeuptimings.................................................................................................38PLLcharacteristics..........................................................................................................................38Flashmemorycharacteristics........................................................................................................39Flashmemoryenduranceanddataretention..............................................................................39EMScharacteristics.........................................................................................................................40EMIcharacteristics..........................................................................................................................41ESDabsolutemaximumratings....................................................................................................42Electricalsensitivities......................................................................................................................42I/Ostaticcharacteristics..................................................................................................................43Outputvoltagecharacteristics........................................................................................................45I/OACcharacteristics.....................................................................................................................46NRSTpincharacteristics................................................................................................................47TIMxcharacteristics.........................................................................................................................48I2Ccharacteristics............................................................................................................................49SCLfrequency(fPCLK1=36MHz.,VDD=3.3V)..........................................................................50SPIcharacteristics...........................................................................................................................51USBDCelectricalcharacteristics..................................................................................................53USB:Fullspeedelectricalcharacteristics....................................................................................54ADCcharacteristics.........................................................................................................................54ADCaccuracy(fPCLK2=14MHz,fADC=14MHz,RAIN<10k?,VDDA=3.3V)....................55TScharacteristics............................................................................................................................58LFBGA100-lowprofilefinepitchballgridarraypackagemechanicaldata...........................59LQFP100?100-pinlow-profilequadflatpackagemechanicaldata........................................61LQFP64?64pinlow-profilequadflatpackagemechanicaldata............................................62LQFP48?48pinlow-profilequadflatpackagemechanicaldata............................................63Thermalcharacteristics...................................................................................................................64Ordercodes......................................................................................................................................65https://houcheng-power.taobao.com4/67www.st.comSTM32FEBKxxListoffiguresListoffiguresFigure1.Figure2.Figure3.Figure4.Figure5.Figure6.Figure7.Figure8.Figure9.Figure10.Figure11.Figure12.Figure13.Figure14.Figure15.Figure16.Figure17.Figure18.Figure19.Figure20.Figure21.Figure22.Figure23.Figure24.Figure25.Figure26.Figure27.Figure28.Figure29.Figure30.Figure31.STM32FEBKxxperformancelineblockdiagram.........................................................................14STM32FEBKxxperformancelineLQFP100pinout.....................................................................15STM32FEBKxxperformancelineLQFP64pinout.......................................................................16STM32FEBKxxperformancelineLQFP48pinout......................................................................16STM32FEBKxxperformancelineBGA100ballout......................................................................17Memorymap.....................................................................................................................................22Pinloadingconditions......................................................................................................................24Pininputvoltage...............................................................................................................................24Powersupplyscheme......................................................................................................................24Currentconsumptionmeasurementscheme...............................................................................25High-speedexternalclocksourceACtimingdiagram................................................................34Low-speedexternalclocksourceACtimingdiagram.................................................................34Typicalapplicationwitha8-MHzcrystal.......................................................................................35Typicalapplicationwitha32.768kHzcrystal..............................................................................36UnusedI/Opinconnection..............................................................................................................44I/OACcharacteristicsdefinition.....................................................................................................47RecommendedNRSTpinprotection.............................................................................................48I2CbusACwaveformsandmeasurementcircuit........................................................................50SPItimingdiagram-slavemodeandCPHA=0........................................................................52SPItimingdiagram-slavemodeandCPHA=11).....................................................................52SPItimingdiagram-mastermode................................................................................................53USBtimings:definitionofdatasignalriseandfalltime..............................................................54ADCaccuracycharacteristics.........................................................................................................56TypicalconnectiondiagramusingtheADC.................................................................................56Powersupplyandreferencedecoupling(VREF+notconnectedtoVDDA)...............................57Powersupplyandreferencedecoupling(VREF+connectedtoVDDA)......................................57LFBGA100-lowprofilefinepitchballgridarraypackageoutline............................................59RecommendedPCBdesignrules(0.80/0.75mmpitchBGA)...................................................60LQFP100?100-pinlow-profilequadflatpackageoutline.........................................................61LQFP64?64pinlow-profilequadflatpackageoutline..............................................................62LQFP48?48pinlow-profilequadflatpackageoutline..............................................................63https://houcheng-power.taobao.comwww.st.com5/67

IntroductionSTM32FEBKxx1.Introduction

ThisdatasheetprovidestheSTM32FEBKxxperformancelineorderinginformationandmechanicaldevicecharacteristics.Forinformationonprogramming,erasingandprotectionoftheinternalFlashmemorypleaserefertotheSTM32F10xxxFlashprogrammingreferencemanual,pm0042,availablefromwww.st.com.ForinformationontheCortex-M3corepleaserefertotheCortex-M3TechnicalReferenceManual.2.Description

TheSTM32FEBKxxperformancelinefamilyincorporatesthehigh-performanceARMCortex-M332-bitRISCcoreoperatingata72MHzfrequency,high-speedembeddedmemories(Flashmemoryupto128KbytesandSRAMupto20Kbytes),andanextensiverangeofenhancedI/OsandperipheralsconnectedtotwoAPBbuses.Alldevicesoffertwo12-bitADCs,threegeneralpurpose16-bittimersplusonePWMtimer,aswellasstandardandadvancedcommunicationinterfaces:uptotwoI2CsandSPIs,threeUSARTs,anUSBandaCAN.TheSTM32FEBKxxperformancelinefamilyoperatesinthe-40to+105°Ctemperaturerange,froma2.0to3.6Vpowersupply.Acomprehensivesetofpower-savingmodeallowstodesignlow-powerapplications.ThecompleteSTM32FEBKxxperformancelinefamilyincludesdevicesin4differentpackagetypes:from48pinsto100pins.Dependingonthedevicechosen,differentsetsofperipheralsareincluded,thedescriptionbelowgivesanoverviewofthecompleterangeofperipheralsproposedinthisfamily.ThesefeaturesmaketheSTM32FEBKxxperformancelinemicrocontrollerfamilysuitableforawiderangeofapplications:?Motordriveandapplicationcontrol????MedicalandhandheldequipmentPCperipheralsgamingandGPSplatformsIndustrialapplications:PLC,inverters,printers,andscannersAlarmsystems,Videointercom,andHVACFigure1showsthegeneralblockdiagramofthedevicefamily.https://houcheng-power.taobao.com

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STM32FEBKxxDescription2.1DeviceoverviewTable2.PeripheralFlash-KbytesSRAM-KbytesTimersGeneralpurposeAdvancedControlSPICommunicationI2CUSARTUSBCAN1121132synchronizedNumberof210channels72MHz2.0to3.6V-40to+85°C/-40to+105°CLQFP48LQFP64LQFP100,BGA100Devicefeaturesandperipheralcounts(STM32FEBKxxperformanceline)STM32FEBKCx321021223111121164203STM32FEBKRx32102312231149216channels2231180642031128STM32FEBKVx6420128GPIOs12-bitADCchannelsCPUfrequencyOperatingvoltageOperatingtemperaturePackages7/67https://houcheng-power.taobao.comwww.st.comDescriptionSTM32FEBKxx2.2Overview

ARM?CortexTM-M3corewithembeddedFlashandSRAM

TheARMCortex-M3processoristhelatestgenerationofARMprocessorsforembeddedsystems.Ithasbeendevelopedtoprovidealow-costplatformthatmeetstheneedsofMCUimplementation,withareducedpincountandlow-powerconsumption,whiledeliveringoutstandingcomputationalperformanceandanadvancedsystemresponsetointerrupts.TheARMCortex-M332-bitRISCprocessorfeaturesexceptionalcode-efficiency,deliveringthehigh-performanceexpectedfromanARMcoreinthememorysizeusuallyassociatedwith8-and16-bitdevices.TheSTM32FEBKxxperformancelinefamilyhavinganembeddedARMcore,isthereforecompatiblewithallARMtoolsandsoftware.Figure1showsthegeneralblockdiagramofthedevicefamily.EmbeddedFlashmemory

?Upto128KbytesofembeddedFlashisavailableforstoringprogramsanddata.EmbeddedSRAM

Upto20KbytesofembeddedSRAMaccessed(read/write)atCPUclockspeedwith0waitstates.Nestedvectoredinterruptcontroller(NVIC)

TheSTM32FEBKxxperformancelineembedsaNestedVectoredInterruptControllerabletohandleupto43maskableinterruptchannels(notincludingthe16interruptlinesofCortex-M3)and16prioritylevels.?CloselycoupledNVICgiveslowlatencyinterruptprocessing???????InterruptentryvectortableaddresspasseddirectlytothecoreCloselycoupledNVICcoreinterfaceAllowsearlyprocessingofinterruptsProcessingoflatearrivinghigherpriorityinterruptsSupportfortail-chainingProcessorstateautomaticallysavedInterruptentryrestoredoninterruptexitwithnoinstructionoverheadThishardwareblockprovidesflexibleinterruptmanagementfeatureswithminimalinterruptlatency.Externalinterrupt/eventcontroller(EXTI)

Theexternalinterrupt/eventcontrollerconsistsof19edgedetectorslinesusedtogenerateinterrupt/eventrequests.Eachlinecanbeindependentlyconfiguredtoselectthetriggerevent(risingedge,fallingedge,both)andcanbemaskedindependently.Apendingregistermaintainsthestatusoftheinterruptrequests.TheEXTIcandetectexternallinewithpulsewidthlowerthantheInternalAPB2clockperiod.Upto80GPIOsareconnectedtothe16externalinterruptlines.8/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxDescriptionClocksandstartup

Systemclockselectionisperformedonstartup,howevertheinternalRC8MHzoscillatorisselectedasdefaultCPUclockonreset.Anexternal4-16MHzclockcanbeselectedandismonitoredforfailure.Duringsuchascenario,itisdisabledandsoftwareinterruptmanagementfollows.Similarly,fullinterruptmanagementofthePLLclockentryisavailablewhennecessary(forexamplewithfailureofanindirectlyusedexternaloscillator).SeveralprescalersallowtheconfigurationoftheAHBfrequency,theHighSpeedAPB(APB2)andthelowSpeedAPB(APB1)domains.ThemaximumfrequencyoftheAHBandtheHighSpeedAPBdomainsis72MHz.ThemaximumallowedfrequencyoftheLowSpeedAPBdomainis36MHz.Bootmodes

Atstartup,bootpinsareusedtoselectoneofthreebootoptions:???BootfromUserFlashBootfromSystemMemoryBootfromSRAMThebootloaderislocatedinSystemMemory.ItisusedtoreprogramtheFlashmemorybyusingtheUSART.Powersupplyschemes

???VDD=2.0to3.6V:externalpowersupplyforI/Osandtheinternalregulator.ProvidedexternallythroughVDDpins.VSSA,VDDA=2.0to3.6V:externalanalogpowersuppliesforADC,Resetblocks,RCsandPLL.InVDDrange(ADCislimitedat2.4V).VBAT=1.8to3.6V:powersupplyforRTC,externalclock32kHzoscillatorandbackupregisters(throughpowerswitch)whenVDDisnotpresent.Powersupplysupervisor

ThedevicehasanintegratedPowerOnReset(POR)/PowerDownReset(PDR)circuitry.Itisalwaysactive,andensuresproperoperationstartingfrom/downto2V.ThedeviceremainsinresetmodewhenVDDisbelowaspecifiedthreshold,VPOR/PDR,withouttheneedforanexternalresetcircuit.Thedevicefeaturesanembeddedprogrammablevoltagedetector(PVD)thatmonitorstheVDDpowersupplyandcomparesittotheVPVDthreshold.AninterruptcanbegeneratedwhenVDDdropsbelowtheVPVDand/orwhenVDDishigherthantheVPVDthreshold.Theinterruptserviceroutinecanthengenerateawarningmessageand/orputtheMCUintoasafestate.ThePVDisenabledbysoftware.RefertoTable9:EmbeddedresetandpowercontrolblockcharacteristicsforthevaluesofVPOR/PDRandVPVD.https://houcheng-power.taobao.comwww.st.com9/67STM32FEBKxxDescriptionVoltageregulator

Theregulatorhasthreeoperationmodes:main(MR),lowpower(LPR)andpowerdown.???MRisusedinthenominalregulationmode(Run)LPRisusedintheStopmodes.PowerdownisusedinStandbyMode:theregulatoroutputisinhighimpedance:thekernelcircuitryispowered-down,inducingzeroconsumption(butthecontentsoftheregistersandSRAMarelost)Thisregulatorisalwaysenabledafterreset.ItisdisabledinStandbyMode,providinghighimpedanceoutput.Low-powermodes

TheSTM32FEBKxxperformancelinesupportsthreelow-powermodestoachievethebestcompromisebetweenlowpowerconsumption,shortstartuptimeandavailablewakeupsources:?SleepmodeInSleepmode,onlytheCPUisstopped.AllperipheralscontinuetooperateandcanwakeuptheCPUwhenaninterrupt/eventoccurs.?StopmodeStopmodeallowstoachievethelowestpowerconsumptionwhileretainingthecontentofSRAMandregisters.Allclocksinthe1.8Vdomainarestopped,thePLL,theHSIandtheHSERCoscillatorsaredisabled.Thevoltageregulatorcanalsobeputeitherinnormalorinlowpowermode.ThedevicecanbewokenupfromStopmodebyanyoftheEXTIline.TheEXTIlinesourcecanbeoneofthe16externallines,thePVDoutput,theRTCalarmortheUSBwakeup.?StandbymodeTheStandbymodeallowstoachievethelowestpowerconsumption.Theinternalvoltageregulatorisswitchedoffsothattheentire1.8Vdomainispoweredoff.ThePLL,theHSIandtheHSERCoscillatorsarealsoswitchedoff.AfterenteringStandbymode,SRAMandregisterscontentarelostexceptforregistersintheBackupdomainandStandbycircuitry.ThedeviceexitsStandbymodewhenanexternalreset(NRSTpin),aIWDGreset,arisingedgeontheWKUPpin,oranRTCalarmoccurs.Note:TheRTC,theIWDG,andthecorrespondingclocksourcesarenotstoppedbyenteringStoporStandbymode.DMA

Theflexible7-channelgeneral-purposeDMAisabletomanagememory-to-memory,peripheral-to-memoryandmemory-to-peripheraltransfers.TheDMAcontrollersupportscircularbuffermanagementavoidingthegenerationofinterruptswhenthecontrollerreachestheendofthebuffer.EachchannelisconnectedtodedicatedhardwareDMArequests,withsupportforsoftwaretriggeroneachchannel.Configurationismadebysoftwareandtransfersizesbetweensourceanddestinationareindependent.TheDMAcanbeusedwiththemainperipherals:SPI,I2C,USART,generalpurposeandadvancedcontroltimersTIMxandADC.10/67https://houcheng-power.taobao.comwww.st.com

STM32FEBKxxDescriptionRTC(real-timeclock)andbackupregisters

TheRTCandthebackupregistersaresuppliedthroughaswitchthattakespowereitheronVDDsupplywhenpresentorthroughtheVBATpin.Thebackupregisters(ten16-bitregisters)canbeusedtostoredatawhenVDDpowerisnotpresent.Thereal-timeclockprovidesasetofcontinuouslyrunningcounterswhichcanbeusedwithsuitablesoftwaretoprovideaclockcalendarfunction,andprovidesanalarminterruptandaperiodicinterrupt.Itisclockedbyanexternal32.768kHzoscillator,theinternallowpowerRCoscillatorortheHighSpeedExternalclockdividedby128.TheinternallowpowerRChasatypicalfrequencyof32kHz.TheRTCcanbecalibratedusinganexternal512Hzoutputtocompensateforanynaturalquartzdeviation.TheRTCfeaturesa32-bitprogrammablecounterforlongtermmeasurementusingtheCompareregistertogenerateanalarm.A20-bitprescalerisusedforthetimebaseclockandisbydefaultconfiguredtogenerateatimebaseof1secondfromaclockat32.768kHz.Independentwatchdog

Theindependentwatchdogisbasedona12-bitdowncounterand8-bitprescaler.Itisclockedfromanindependent32kHzinternalRCandasitoperatesindependentlyfromthemainclock,itcanoperateinStopandStandbymodes.Itcanbeusedeitherasawatchdogtoresetthedevicewhenaproblemoccurs,orasafreerunningtimerforapplicationtimeoutmanagement.Itishardwareorsoftwareconfigurablethroughtheoptionbytes.Thecountercanbefrozenindebugmode.Windowwatchdog

Thewindowwatchdogisbasedona7-bitdowncounterthatcanbesetasfreerunning.Itcanbeusedasawatchdogtoresetthedevicewhenaproblemoccurs.Itisclockedfromthemainclock.Ithasanearlywarninginterruptcapabilityandthecountercanbefrozenindebugmode.SysTicktimer

ThistimerisdedicatedforOS,butcouldalsobeusedasastandarddowncounter.Itfeatures:?A24-bitdowncounter???AutoreloadcapabilityMaskablesysteminterruptgenerationwhenthecounterreaches0.ProgrammableclocksourceGeneralpurposetimers(TIMx)

Thereareupto3synchronizablestandardtimersembeddedintheSTM32FEBKxxperformancelinedevices.Thesetimersarebasedona16-bitauto-reloadup/downcounter,a16-bitprescalerandfeature4independentchannelseachforinputcapture/outputcompare,PWMoronepulsemodeoutput.Thisgivesupto12inputcaptures/outputcompares/PWMsonthelargestpackages.TheycanworktogetherwiththeAdvancedControlTimerviatheTimerLinkfeatureforsynchronizationoreventchaining.Thecountercanbefrozenindebugmode.AnyofthestandardtimerscanbeusedtogeneratePWMoutputs.EachofthetimershasindependentDMArequestgenerations.11/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxDescriptionAdvancedcontroltimer(TIM1)

Theadvancedcontroltimer(TIM1)canbeseenasathree-phasePWMmultiplexedon6channels.Itcanalsobeseenasacompletegeneral-purposetimer.The4independentchannelscanbeusedfor?????InputCaptureOutputComparePWMgeneration(edgeorcenter-alignedmodes)OnePulseModeoutputComplementaryPWMoutputswithprogrammableinserteddead-times.Ifconfiguredasastandard16-bittimer,ithasthesamefeaturesastheTIMxtimer.Ifconfiguredasthe16-bitPWMgenerator,ithasfullmodulationcapability(0-100%).Thecountercanbefrozenindebugmode.ManyfeaturesaresharedwiththoseofthestandardTIMtimerswhichhavethesamearchitecture.TheadvancedcontroltimercanthereforeworktogetherwiththeTIMtimersviatheTimerLinkfeatureforsynchronizationoreventchaining.I2Cbus

UptotwoI2Cbusinterfacescanoperateinmulti-masterandslavemodes.Theycansupportstandardandfastmodes.Theysupportdualslaveaddressing(7-bitonly)andboth7/10-bitaddressinginmastermode.AhardwareCRCgeneration/verificationisembedded.TheycanbeservedbyDMAandtheysupportSMBus2.0/PMBus.Universalsynchronous/asynchronousreceivertransmitter(USART)

OneoftheUSARTinterfacesisabletocommunicateatspeedsofupto4.5Mbit/s.Theotheravailableinterfacescommunicateatupto2.25Mbit/s.TheyprovidehardwaremanagementoftheCTSandRTSsignals,IrDASIRENDECsupport,areISO7816compliantandhaveLINMaster/Slavecapability.AllUSARTinterfacescanbeservedbytheDMAcontroller.Serialperipheralinterface(SPI)

UptotwoSPIsareabletocommunicateupto18Mbits/sinslaveandmastermodesinfull-duplexandsimplexcommunicationmodes.The3-bitprescalergives8mastermodefrequenciesandtheframeisconfigurablefrom8-bitto16-bit.ThehardwareCRCgeneration/verificationsupportsbasicSDCard/MMCmodes.BothSPIscanbeservedbytheDMAcontroller.Controllerareanetwork(CAN)

TheCANiscompliantwithspecifications2.0AandB(active)withabitrateupto1Mbit/s.Itcanreceiveandtransmitstandardframeswith11-bitidentifiersaswellasextendedframeswith29-bitidentifiers.Ithasthreetransmitmailboxes,tworeceiveFIFOswith3stagesand14scalablefilterbanks.12/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxDescriptionUniversalserialbus(USB)

TheSTM32FEBKxxperformancelineembedsaUSBdeviceperipheralcompatiblewiththeUSBFull-speed12Mbs.TheUSBinterfaceimplementsafullspeed(12Mbit/s)functioninterface.Ithassoftwareconfigurableendpointsettingandsuspend/resumesupport.Thededicated48MHzclocksourceisgeneratedfromtheinternalmainPLL.GPIOs(general-purposeinputs/outputs)

EachoftheGPIOpinscanbeconfiguredbysoftwareasoutput(push-pulloropen-drain),asinput(withorwithoutpull-uporpull-down)orasperipheralalternatefunction.MostoftheGPIOpinsaresharedwithdigitaloranalogalternatefunctions.AllGPIOsarehighcurrent-capable.TheI/OsalternatefunctionconfigurationcanbelockedifneededfollowingaspecificsequenceinordertoavoidspuriouswritingtotheI/Osregisters.I/OsonAPB2withupto18MHztogglingspeedADC(analogtodigitalconverter)

Two12-bitAnalogtoDigitalConvertersareembeddedintoSTM32FEBKxxperformancelinedevicesandeachADCsharesupto16externalchannels,performingconversionsinsingle-shotorscanmodes.Inscanmode,automaticconversionisperformedonaselectedgroupofanaloginputs.AdditionallogicfunctionsembeddedintheADCinterfaceallow:???SimultaneoussampleandholdInterleavedsampleandholdSingleshuntTheADCcanbeservedbytheDMAcontroller.Ananalogwatchdogfeatureallowsveryprecisemonitoringoftheconvertedvoltageofone,someorallselectedchannels.Aninterruptisgeneratedwhentheconvertedvoltageisoutsidetheprogrammedthresholds.Theeventsgeneratedbythestandardtimers(TIMx)andtheAdvancedControltimer(TIM1)canbeinternallyconnectedtotheADCstarttrigger,injectiontrigger,andDMAtriggerrespectively,toallowtheapplicationtosynchronizeA/Dconversionandtimers.Temperaturesensor

Thetemperaturesensorhastogeneratealinearvoltagewithanyvariationintemperature.Theconversionrangeisbetween2V

TheARMSWJ-DPInterfaceisembedded.andisacombinedJTAGandserialwiredebugportthatenableseitheraserialwiredebugoraJTAGprobetobeconnectedtothetarget.TheJTAGTMSandTCKpinsaresharedrespectivelywithSWDIOandSWCLKandaspecificsequenceontheTMSpinisusedtoswitchbetweenJTAG-DPandSW-DP.13/67https://houcheng-power.taobao.comwww.st.comDescriptionFigure1.STM32FEBKxxperformancelineblockdiagramSTM32FEBKxxJTAG&SWDJNTRSTJTDIJTCKISWCLKJTMSISWDIOJTDOasAFpbusIbusTraceC。ntr。ller。POWERVOLT.REG.3.3VTO1.8V@VDDVDD=2t。3.6VVSSCORTEXM3CPUFmax:72MHzDbusFLASH128KB64bitBusMatrixNVICSystemflashblSRAM20KBPCLK1PCLK2HCLKFCLKRC8MHzRC32kHz@VDDA@VBATAHB2APB1PLL&CLOCKMANAGT@VDDXTALOSC4-16MHzOSCINOSCOUTGPDMAAHB:Fmax=48I72MHz7channelsIWDGStandbyinterfaceVBATOSC32INOSC32OUTANTITAMP@VDDANRSTVDDAVSSASUPPLYSUPERVISIONPORIPDRPVDEXTIWAKEUPGPIOAGPIOBGPIOCGPIODGPIOEAPB2:Fmax=48I72MHzRstIntAHB2APB2XTAL32kHzRTCAWUBackupreg80AFPA[15:0]PB[15:0]PC[15:0]PD[15:0]PE[15:0]BackupinterfaceTIM2TIM3APB1:Fmax=24I36MHzTIM4USART2USART32x(8x16bit)SPI24Channels4Channels8ChannelsRX,TX,CTS,RTS,SmartCardasAFRX,TX,CTS,RTS,SmartCardasAFMOSI,MISO,SCK,NSSasAFSCL,SDA,SMBALasAFSCL,SDAasAFUSBDPICANTXUSBDMICANRX4Channels3c。mpl.ChannelsBrkinputMOSI,MISO,SCK,NSSasAFRX,TX,CTS,RTS,SmartCardasAFTIM1SPI1USART1@VDDAI2C1I2C2bxCANUSB2.0FS16AFVREF+VREF-12bitADC1IFSRAM512B12bitADC2IFWWDGTempsens。rai143901.2.

TA=–40°Cto+105°C(junctiontemperatureupto125°C).AF=alternatefunctiononI/Oportpin.

14/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxPindescriptions3Pindescriptions

Figure2.STM32FEBKxxperformancelineLQFP100pinoutVDD_3VSS_3PE1PE0PB9PB8BOOT0PB7PB6PB5PB4PB3PD7PD6PD5PD4PD3PD2PD1PD0PC12PC11PC10PA15PA14PE2PE3PE4PE5PE6VBATPC13-ANTI_TAMPPC14-OSC32_INPC15-OSC32_OUTVSS_5VDD_5OSC_INOSC_OUTNRSTPC0PC1PC2PC3VSSAVREF-VREF+VDDAPA0-WKUPPA1PA21234567891011121314151617181920212223242510099989796959493929190898887868584838281807978777675747372717069686766656463626160595857565554535251LQFP100VDD_2VSS_2NCPA13PA12PA11PA10PA9PA8PC9PC8PC7PC6PD15PD14PD13PD12PD11PD10PD9PD8PB15PB14PB13PB12PA3VSS_4VDD_4PA4PA5PA6PA7PC4PC5PB0PB1PB2PE7PE8PE9PE10PE11PE12PE13PE14PE15PB10PB11VSS_1VDD_126272829303132333435363738394041424344454647484950ai14391https://houcheng-power.taobao.comwww.st.com15/67

PindescriptionsFigure3.STM32FEBKxxperformancelineLQFP64pinoutVDD_3VSS_3PB9PB8BOOT0PB7PB6PB5PB4PB3PD2PC12PC11PC10PA15PA14STM32FEBKxxVBATPC13-ANTI_TAMPPC14-OSC32_INPC15-OSC32_OUTPD0OSC_INPD1OSC_OUTNRSTPC0PC1PC2PC3VSSAVDDAPA0-WKUPPA1PA212345678646362616059585756555453525150494847464544434241LQFP64409391038113712361335143415331617181920212223242526272829303132PA3VSS_4VDD_4PA4PA5PA6PA7PC4PC5PB0PB1PB2PB10PB11VSS_1VDD_1VDD_2VSS_2PA13PA12PA11PA10PA9PA8PC9PC8PC7PC6PB15PB14PB13PB12ai14392Figure4.STM32FEBKxxperformancelineLQFP48pinoutVDD_3VSS_3PB9PB8BOOT0PB7PB6PB5PB4PB3PA15PA14VBATPC13-ANTI_TAMPPC14-OSC32_INPC15-OSC32_OUTPD0OSC_INPD1OSC_OUTNRSTVSSAVDDAPA0-WKUPPA1PA2148474645444342414039383736353433323130292827262523456LQFP48789101112131415161718192021222324VDD_2VSS_2PA13PA12PA11PA10PA9PA8PB15PB14PB13PB12PA3PA4PA5PA6PA7PB0PB1PB2PB10PB11VSS_1VDD_1ai14393https://houcheng-power.taobao.com16/67www.st.comSTM32FEBKxxFigure5.1PindescriptionsSTM32FEBKxxperformancelineBGA100ballout2345678910?PC14-PC13-OSC32_INANTI_TAMPPE2PB9PB7PB4PB3PA15PA14APA13?PC15-OSC32_OUTVBATPE3PB8PB6PD5PD2PC11PC10PA12?OSC_INVSS_5PE4PE1PB5PD6PD3PC12PA9PA11?OSC_OUTVDD_5PE5PE0BOOT0PD7PD4PD0PA8PA10?NRSTPCDPE6VSS_4VSS_3VSS_2VSS_1PD1PC9PC7?PC0PC1PC3VDD_4VDD_3VDD_2VDD_1NCPC8PC6?VSSAPA0-WKUPPA4PC4PB2PE10PE14PB15PD11PD15?VREF–PA1PA5PC5PE7PE11PE15PB14PD10PD146VREF+PA2PA6PB0PE8PE12PB10PB13PD9PD137VDDAPA3PA7PB1PE9PE13PB11PB12PD8PD12AI16001

https://houcheng-power.taobao.comwww.st.com17/67PindescriptionsTable3.PinsType(1)LQFP100BGA100LQFP48LQFP64PinnameSTM32FEBKxxPindefinitionsI/OLevel(2)DefaultalternatefunctionsMainfunction(3)(afterreset)PE2PE3PE4PE5PE6VBATPC13PC14-OSC32_INPC15-OSC32_OUTVSS_5VDD_5OSC_INOSC_OUTNRSTPC0PC1PC2PC3VSSAVREF-VREF+VDDAPA0A3B3C3D3E3B2A2A1B1C2D2C1D1E1F1F2E2F3G1H1J1K1G2-----1234--567----8--910-----1234--56789101112--13141234567891011121314151617181920212223PE2/TRACECKPE3/TRACED0PE4/TRACED1PE5/TRACED2PE6/TRACED3VBAT

PC13-ANTI_TAMP(4)PC14-OSC32_IN(4)PC15-OSC32_OUT(4)

VSS_5VDD_5OSC_INOSC_OUTNRSTPC0/ADC_IN10PC1/ADC_IN11PC2/ADC_IN12PC3/ADC_IN13VSSAVREF-VREF+VDDA

PA0-WKUP/USART2_CTS/ADC_IN0/TIM2_CH1_ETRPA1/USART2_RTS/ADC_IN1/TIM2_CH2PA2/USART2_TX/ADC_IN2/TIM2_CH3PA3/USART2_RX/ADC_IN3/TIM2_CH4VSS_4VDD_4

I/OI/OI/OI/OI/OSI/OI/OI/OSSIOI/OI/OI/OI/OI/OSSSSI/OFTFTFTFTFT

TRACECKTRACED0TRACED1TRACED2TRACED3ANTI_TAMPADC_IN10ADC_IN11ADC_IN12ADC_IN13WKUP/USART2_CTS(6)/ADC_IN0/TIM2_CH1_ETR(6)USART2_RTS(6)/ADC_IN1/TIM2_CH2(6)USART2_TX(6)/ADC_IN2/TIM2_CH3(6)USART2_RX(6)/ADC_IN3/TIM2_CH4(6)

H2111524I/OPA1J2K2E4F41213--1617181925262728I/OI/OSSPA2PA3VSS_4VDD_4

https://houcheng-power.taobao.com18/67www.st.comSTM32FEBKxxTable3.PinsLQFP100BGA100LQFP48LQFP64PindescriptionsPindefinitions(continued)I/OLevel(2)Type(1)PinnamePA4/SPI1_NSS/USART2_CK/ADC_IN4PA5/SPI1_SCK/ADC_IN5PA6/SPI1_MISO/ADC_IN6/TIM3_CH1PA7/SPI1_MOSI/ADC_IN7/TIM3_CH2PC4/ADC_IN14PC5/ADC_IN15PB0/ADC_IN8/TIM3_CH3PB1/ADC_IN9/TIM3_CH4PB2/BOOT1PE7PE8PE9PE10PE11PE12PE13PE14PE15PB10/I2C2_SCL/USART3_TXPB11/I2C2_SDA/USART3_RXVSS_1VDD_1

PB12/SPI2_NSS/I2C2_SMBAl/USART3_CK/TIM1_BKINPB13/SPI2_SCK/USART3_CTS/TIM1_CH1NPB14/SPI2_MISO/USART3_RTS/TIM1_CH2NMainfunction(3)(afterreset)PA4PA5PA6PA7PC4PC5PB0PB1DefaultalternatefunctionsSPI1_NSS(6)/USART2_CK(6)/ADC_IN4SPI1_SCK(6)/ADC_IN5SPI1_MISO(6)/ADC_IN6/TIM3_CH1(6)SPI1_MOSI(6)/ADC_IN7/TIM3_CH2(6)

ADC_IN14ADC_IN15ADC_IN8/TIM3_CH3(6)ADC_IN9/TIM3_CH4(6)

G3H3J3K3G4H4J4K4G5H5J5K5G6H6J6K6G7H7J7K7E7F714151617--181920---------21222324202122232425262728---------2930313229303132333435363738394041424344454647484950I/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OSSFTFTFTFTFTFTFTFTFTFTFTFTPB2/BOOT1PE7PE8PE9PE10PE11PE12PE13PE14PE15PB10PB11VSS_1VDD_1

SPI2_NSS(5)/I2C2_SMBAl(5)/USART3_CK(5)(6)/TIM1_BKIN(6)

SPI2_SCK(5)/USART3_CTS(5)(6)/TIM1_CH1N(6)SPI2_MISO(5)/USART3_RTS(5)(6)

TIM1_CH2N(6)I2C2_SCL/USART3_TX(5)(6)I2C2_SDA/USART3_RX(5)(6)

K8253351I/OFTPB12J8263452I/OFTPB13H8273553I/OFTPB14https://houcheng-power.taobao.comwww.st.com19/67PindescriptionsTable3.PinsLQFP100BGA100LQFP48LQFP64PinnamePB15/SPI2_MOSITIM1_CH3NPD8PD9PD10PD11PD12PD13PD14PD15PC6PC7PC8PC9PA8/USART1_CK/TIM1_CH1/MCOSTM32FEBKxxPindefinitions(continued)I/OLevel(2)Type(1)Mainfunction(3)

(afterreset)DefaultalternatefunctionsSPI2_MOSI(5)/TIM1_CH3N(6)

G8K9J9H9G9K10J10H10G10F10E10F9E9D9C9D10C10B10A10F8E6F6A9A8B9B8C828---------36--------3738395455565758596061626364656667I/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OFTFTFTFTFTFTFTFTFTFTFTFTFTFTFTFTPB15PD8PD9PD10PD11PD12PD13PD14PD15PC6PC7PC8PC9PA8PA9PA10-29303140414243USART1_CK/TIM1_CH1(6)/MCOUSART1_TX(6)/TIM1_CH2(6)USART1_RX(6)/TIM1_CH3(6)USART1_CTS/CANRX(6)/TIM1_CH4(6)/USBDMUSART1_RTS/CANTX(6)/TIM1_ETR(6)/USBDPPA1368PA9/USART1_TX/TIM1_CH2PA10/USART1_RX/TIM1_CH369PA11/USART1_CTS/CANRX/USBDM/TIM1_CH4PA12/USART1_RTS/CANTX/USBDP/TIM1_ETRPA13/JTMS/SWDIO324470I/OFTPA113334-35363738---4546-4748495051525371727374757677787980I/OI/OFTFTPA12JTMS/SWDIONotconnectedVSS_2VDD_2

PA14/JTCK/SWCLKPA15/JTDIPC10PC11PC12SSI/OI/OI/OI/OI/OFTFTFTFTFTVSS_2VDD_2JTCK/SWCLKJTDIPC10PC11PC12PA14PA15https://houcheng-power.taobao.com20/67www.st.com

STM32FEBKxxTable3.PinsLQFP100BGA100LQFP48LQFP64PindescriptionsPindefinitions(continued)I/OLevel(2)Type(1)PinnamePD0PD1PD2/TIM3_ETRPD333PD4PD5PD6PD7PB3/JTDO/TRACESWOPB4/JNTRSTPB5/I2C1_SMBAlPB6/I2C1_SCL/TIM4_CH1PB7/I2C1_SDA/TIM4_CH2BOOT0PB8/TIM4_CH3PB9/TIM4_CH4PE0/TIM4_ETRPE1VSS_3VDD_3

Mainfunction(3)(afterreset)OSC_IN(7)OSC_OUT(7)

PD2PD3PD4PD5PD6PD7JTDOJNTRSTPB5DefaultalternatefunctionsD8E8B7C7D7B6C6D6A7A6C5B5A5D5B4A4D4C4E5F556565481828384858687888990919293949596979899100I/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OII/OI/OI/OI/OSSFTFTFTFTFTFTFTFTFTFTTIM3_ETR-----3940414243444546--4748-----5556575859606162--6364PB3/TRACESWOPB4I2C1_SMBAlI2C1_SCL(6)/TIM4_CH1(5)(6)I2C1_SDA(6)/TIM4_CH2(5)(6)TIM4_CH3(5)TIM4_CH4(5)

(6)(6)

FTFTPB6PB7BOOT0FTFTFTFTPB8PB9PE0PE1VSS_3VDD_3

TIM4_ETR(5)

1.I=input,O=output,S=supply,HiZ=highimpedance.2.FT=5Vtolerant.

3.Functionavailabilitydependsonthechosendevice.RefertoTable2onpage7.

4.PC13,PC14andPC15aresuppliedthroughthepowerswitch,andsotheiruseinouptutmodeislimited:theycanbeusedonlyinoutput2MHzmodewithamaximumloadof30pFandonlyonepincanbeputinoutputmodeatatime.5.AvailableonlyondeviceswithaFlashmemorydensityequalorhigherthan64Kbytes.

6.Thisalternatefunctioncanberemappedbysoftwaretosomeotherportpins(ifavailableontheusedpackage).Formoredetails,refertotheAlternatefunctionI/OanddebugconfigurationsectionintheSTM32F10xxxreferencemanual,UM0306,availablefromtheSTMicroelectronicswebsite:www.st.com.7.FortheLQFP48andLQFP64packages,thepinsnumber5and6areconfiguredasOSC_IN/OSC_OUTafterreset,howeverthefunctionalityofPD0andPD1canberemappedbysoftwareonthesepins.

21/67https://houcheng-power.taobao.comwww.st.comMemorymappingSTM32FEBKxx4Memorymapping

ThememorymapisshowninFigure6.Figure6.MemorymapAPBmemoryspace0xFFFFFFFF0xE01000000x600000000x400234000xFFFFFFFF0xFFFFF0000x400230000x400224000x40022000reservedreservedreservedreservedreservedFlashInterfacereservedRCCreservedDMA4Kbits1Kbit3Kbits1Kbit3Kbits1Kbit3Kbits1Kbit1Kbit1Kbit1Kbit1Kbit1Kbit1Kbit70xE01000000xE0000000Cortex-M3InternalPeripherals0x400214000x400210000x400204000x4002000060xC0000000reserved0x40013C000x400138000x400134000x40013000USART1reservedSPTIADC2ADreserved50xA00000000x40012C000x400128000x40012400(1)(2)1Kbit1Kbit1Kbit1Kbit1Kbit1Kbit1Kbit35Kbits1Kbit1Kbit1Kbit1Kbit1Kbit1Kbit1KbitKbitKbits0x40011C00PortEPortPortPortPortEXTIAFreserved40x800000000x1FFFFFFF0x1FFFF9FF0x40011800reservedOPTIONBYTES0x400114000x400110000x40010C000x400108000x1FFFF80030x600000000x1FFFF000SYSTEMMEMORY0x400104000x400100000x4000740020x40000000PERIPHERALS0x400070000x40006C00PWBKPreservedbxCANshared512byteUSB/CANUSBRegistersI2C2I2C1reserved0x400068000x400064000x4000600010x20000000SRAM0x0801FFFF0x40005C000x400058000x400054001.2.1KbitKbitKbitsreserved0x40004C00USART3USART2reserved00x00000000CODE0x08000000FLASH0x400048000x400044001.2.1Kbit1Kbit1Kbit1Kbit1Kbit7Kbits1Kbit1Kbit1KbitKbitKbits0x40003C000x400038000x400034000x40003000SPI2reservedIWDGWWDGRTCreservedReserved0x40002C000x400028000x40000C000x400008000x400004000x40000000TITITIai1439422/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxElectricalcharacteristics5

5.1.

5.1.1

Electricalcharacteristics

Testconditions

Unlessotherwisespecified,allvoltagesarereferredtoVSS.Minimumandmaximumvalues

Unlessotherwisespecifiedtheminimumandmaximumvaluesareguaranteedintheworstconditionsofambienttemperature,supplyvoltageandfrequenciesbytestsinproductionon100%ofthedeviceswithanambienttemperatureatTA=25°CandTA=TAmax(givenbytheselectedtemperaturerange).Databasedoncharacterizationresults,designsimulationand/ortechnologycharacteristicsareindicatedinthetablefootnotesandarenottestedinproduction.Basedoncharacterization,theminimumandmaximumvaluesrefertosampletestsandrepresentthemeanvalueplusorminusthreetimesthestandarddeviation(mean±3Σ).5.1.2Typicalvalues

Unlessotherwisespecified,typicaldataarebasedonTA=25°C,VDD=3.3V(forthe2V≤VDD≤3.6Vvoltagerange).Theyaregivenonlyasdesignguidelinesandarenottested.TypicalADCaccuracyvaluesaredeterminedbycharacterizationofabatchofsamplesfromastandarddiffusionlotoverthefulltemperaturerange,where95%ofthedeviceshaveanerrorlessthanorequaltothevalueindicated(mean±2Σ).

5.1.3

Typicalcurves

Unlessotherwisespecified,alltypicalcurvesaregivenonlyasdesignguidelinesandarenottested.5.1.4Loadingcapacitor

TheloadingconditionsusedforpinparametermeasurementareshowninFigure7.5.1.5Pininputvoltage

TheinputvoltagemeasurementonapinofthedeviceisdescribedinFigure8.23/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxElectricalcharacteristicsFigure7.PinloadingconditionsFigure8.PininputvoltageSTM32FEBKxxpinC=50pFVINSTM32FEBKxxpinai14141ai141425.1.6Powersupplyscheme

Figure9.PowersupplyschemeVBAT3.3VPowerswitch1.8-3.6VBackupcircuitry(OSC32K,RTC,Wake-uplogicBackupregisters)LevelshifterOUTGPI/OsINIOLogicKernellogic(CPU,Digital&Memories)VDDVDD1/2/3/4/5VSS1/2/3/4/5Regulator5×100nF+1×10μFVDDVREF3.3VVDDAVREF+VREF-VSSAai1412510nF+1μF10nF+1μFADCAnalog:RCs,PLL,...https://houcheng-power.taobao.com24/67www.st.comSTM32FEBKxxElectricalcharacteristics5.1.7Currentconsumptionmeasurement

Figure10.CurrentconsumptionmeasurementschemeIDD_VBATVBATIDDVDDVDDAai14126https://houcheng-power.taobao.comwww.st.com25/67

ElectricalcharacteristicsSTM32FEBKxx5.2Absolutemaximumratings

StressesabovetheabsolutemaximumratingslistedinTable4:Voltagecharacteristics,Table5:Currentcharacteristics,andTable6:Thermalcharacteristicsmaycausepermanentdamagetothedevice.Thesearestressratingsonlyandfunctionaloperationofthedeviceattheseconditionsisnotimplied.Exposuretomaximumratingconditionsforextendedperiodsmayaffectdevicereliability.Table4.SymbolVDD–VSS

VIN|?VDDx||VSSX-VSS|VoltagecharacteristicsRatingsExternal3.3Vsupplyvoltage(includingVDDAandVDD)(1)

Inputvoltageonfivevolttolerantpin(2)Inputvoltageonanyotherpin(2)

Min–0.3VSS-0.3VSS-0.35050Max4.0+5.5VDD+0.35050UnitVVariationsbetweendifferentpowerpinsVariationsbetweenallthedifferentgroundpinsElectrostaticdischargevoltage(humanbodymodel)mVVESD(HBM)

seeSection5.3.11:Absolutemaximumratings(electricalsensitivity)1.All3.3Vpower(VDD,VDDA)andground(VSS,VSSA)pinsmustalwaysbeconnectedtotheexternal3.3V

supply.2.IINJ(PIN)mustneverbeexceeded(seeTable5:Currentcharacteristics).ThisisimplicitlyinsuredifVIN

maximumisrespected.IfVINmaximumcannotberespected,theinjectioncurrentmustbelimitedexternallytotheIINJ(PIN)value.ApositiveinjectionisinducedbyVIN>VDDwhileanegativeinjectionisinducedbyVIN

Table5.SymbolIVDDIVSSIIO

CurrentcharacteristicsRatingsTotalcurrentintoVDDpowerlines(source)(1)TotalcurrentoutofVSSgroundlines(sink)(1)OutputcurrentsunkbyanyI/OandcontrolpinOutputcurrentsourcebyanyI/OsandcontrolpinInjectedcurrentonNRSTpin(2)(3)

Max.151525-±5±5±5±25UnitmAIINJ(PIN)

InjectedcurrentonHSEOSC_INandLSEOSC_INpinsInjectedcurrentonanyotherpin(4)

ΣIINJ(PIN)(2)

Totalinjectedcurrent(sumofallI/Oandcontrolpins)(4)

1.All3.3Vpower(VDD,VDDA)andground(VSS,VSSA)pinsmustalwaysbeconnectedtotheexternal3.3V

supply.2.IINJ(PIN)mustneverbeexceeded.ThisisimplicitlyinsuredifVINmaximumisrespected.IfVINmaximum

cannotberespected,theinjectioncurrentmustbelimitedexternallytotheIINJ(PIN)value.ApositiveinjectionisinducedbyVIN>VDDwhileanegativeinjectionisinducedbyVIN

characteristics.

4.Whenseveralinputsaresubmittedtoacurrentinjection,themaximumΣIINJ(PIN)istheabsolutesumofthe

positiveandnegativeinjectedcurrents(instantaneousvalues).TheseresultsarebasedoncharacterizationwithΣIINJ(PIN)maximumcurrentinjectiononfourI/Oportpinsofthedevice.

26/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxTable6.ThermalcharacteristicsRatingsStoragetemperaturerangeElectricalcharacteristicsSymbolTSTGTJ

Value–65to+150Unit°CMaximumjunctiontemperature(seeThermalcharacteristics)5.3

5.3.1

Operatingconditions

Generaloperatingconditions

Table7.SymbolfHCLKfPCLK1fPCLK2VDDVBATTA

GeneraloperatingconditionsParameterInternalAHBclockfrequencyInternalAPB1clockfrequencyInternalAPB2clockfrequencyStandardoperatingvoltageBackupoperatingvoltageAmbienttemperaturerange0021.8-40ConditionsMin0Max7236723.63.6105VV°CMHzUnit5.3.2Operatingconditionsatpower-up/power-down

TheparametersgiveninTable8arederivedfromtestsperformedundertheambienttemperatureconditionsummarizedinTable7.Table8.SymboltVDD

Operatingconditionsatpower-up/power-downParameterVDDrise/falltimerateConditionsMin2020TypMaxUnitμs/Vms/Vhttps://houcheng-power.taobao.comwww.st.com27/67ElectricalcharacteristicsSTM32FEBKxx5.3.3Embeddedresetandpowercontrolblockcharacteristics

TheparametersgiveninTable9arederivedfromtestsperformedunderambienttemperatureandVDDsupplyvoltageconditionssummarizedinTable7.Table9.SymbolEmbeddedresetandpowercontrolblockcharacteristicsParameterConditionsPLS[2:0]=000(risingedge)PLS[2:0]=000(fallingedge)PLS[2:0]=001(risingedge)PLS[2:0]=001(fallingedge)PLS[2:0]=010(risingedge)PLS[2:0]=010(fallingedge)ProgrammablevoltagedetectorlevelselectionPLS[2:0]=011(risingedge)PLS[2:0]=011(fallingedge)PLS[2:0]=100(risingedge)PLS[2:0]=100(fallingedge)PLS[2:0]=101(risingedge)PLS[2:0]=101(fallingedge)PLS[2:0]=110(risingedge)PLS[2:0]=110(fallingedge)PLS[2:0]=111(risingedge)PLS[2:0]=111(fallingedge)Min2.122.192.092.282.182.382.282.472.372.572.472.662.562.762.66Typ2.182.082.282.182.382.282.482.382.582.482.682.582.782.682.882.78100FallingedgeRisingedge1.81.841.881.924012.54.51.962.0Max2.262.162.372.272.482.382.582.482.692.592.792.692.92.832.9UnitVVVVVVVVVVVVVVVVmVVVmVmSVPVD

VPVDhystVPOR/PDRVPDRhystTRSTTEMPO

PVDhysteresisPoweron/powerdownresetthresholdPDRhysteresisResettemporization5.3.4Embeddedreferencevoltage

TheparametersgiveninTable10arederivedfromtestsperformedunderambienttemperatureandVDDsupplyvoltageconditionssummarizedinTable7.Table10.SymbolVREFINT

EmbeddedinternalreferencevoltageParameterInternalreferencevoltageConditions-45°C

ThecurrentconsumptionismeasuredasdescribedinFigure10:Currentconsumptionmeasurementscheme.Maximumcurrentconsumption

TheMCUisplacedunderthefollowingconditions:???AllI/OpinsareininputmodewithastaticvalueatVDDorVSS(noload)AllperipheralsaredisabledexceptifitisexplicitlymentionedTheFlashaccesstimeisadjustedtofHCLKfrequency(0waitstatefrom0to24MHz,1waitstatefrom24to48MHzand2waitstatesabove)TheparametersgiveninTable11arederivedfromtestsperformedunderambienttemperatureandVDDsupplyvoltageconditionssummarizedinTable7.Table11.SymbolMaximumcurrentconsumptioninRunandSleepmodes(1)

Max(3)

ParameterConditionsFHCLK72MHz48MHz36MHz24MHzTyp(2)36302221TA=85°CTBDTBDTBDTBDTA=105°CTBDTBDTBDTBDUnitExternalclockwithPLL,coderunningfromFlash,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

Externalclock,PLLstopped,coderunningfromFlash,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

SupplycurrentinRunmodeExternalclockwithPLL,coderunningfromRAM,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

Externalclock,PLLstopped,coderunningfromRAM,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

ExternalclockwithPLL,coderunningfromRAMorFlash,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

Externalclock,PLLstopped,coderunningfromRAMorFlash,allperipheralsenabled(seeRCCregisterdescription):fPCLK1=fHCLK/2,fPCLK2=fHCLK

8MHz72MHz48MHz36MHz24MHz1032221311TBD45311815TBD47332017mAIDD

8MHz72MHz48MHz36MHz24MHz4.522141310TBD35232217TBD37252419mASupplycurrentinSleepmode8MHz3.5TBDTBD1.TBDstandsfortobedetermined.

2.TypicalvaluesaremeasuredatTA=25°C,andVDD=3.3V

3.Databasedoncharacterizationresults,testedinproductionatVDmax,fHCLKmax.TAmax,andcodeexecutedfromRAM.

29/67https://houcheng-power.taobao.comwww.st.comElectricalcharacteristicsTable12.MaximumcurrentconsumptioninStopandStandbymodes(1)

Typ(2)SymbolParameterConditionsVDD/VBAT=2.4VVDD/VBAT=3.3VSTM32FEBKxxMax(3)TA=85°CTA=105°CUnitSupplycurrentinStopmodeIDDRegulatorinRunmode,Low-speedandhigh-speedinternalRCoscillatorsandhigh-speedoscillatorOFF(noindependentwatchdog)TBD24TBDTBDRegulatorinLowPowermode,Low-speedandhigh-speedinternalRCoscillatorsandhigh-speedoscillatorOFF(noindependentwatchdog)TBD(4)14(4)TBD(4)TBD(4)μASupplycurrentinStandbymode(5)IDD_VBATBackupdomainsupplycurrentLow-speedinternalRCoscillatorandindependentwatchdogOFF,low-speedoscillatorandRTCOFFLow-speedoscillatorandRTCONTBD(4)2(4)TBD(4)TBD(4)1(4)14(4)TBD(4)TBD(4)1.TBDstandsfortobedetermined.

2.TypicalvaluesaremeasuredatTA=25°C,VDD=3.3V,unlessotherwisespecified.

3.Databasedoncharacterizationresults,testedinproductionatVDDmax,fHCLKmax.andTAmax(forothertemperature.4.Valuesexpectedfornextsiliconrevision.

5.TohavetheStandbyconsumptionwithRTCON,addIDD_VBAT(Low-speedoscillatorandRTCON)toIDDStandby(whenVDDispresenttheBackupDomainispoweredbyVDDsupply).

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ElectricalcharacteristicsSTM32FEBKxxInput/outputACcharacteristics

Thedefinitionandvaluesofinput/outputACcharacteristicsaregiveninFigure16andTable31,respectively.Unlessotherwisespecified,theparametersgiveninTable31arederivedfromtestsperformedunderambienttemperatureandVDDsupplyvoltageconditionssummarizedinTable7.Table31.I/Omode(1)

I/OACcharacteristics(1)

Symbolfmax(IO)o

utParameterMaximumfrequency(2)

Outputhightolowlevelfalltime(3)Outputlowtohighlevelrisetime(3)Maximum

frequency(2)Outputhightolowlevelfalltime(3)Outputlowtohighlevelrisetime(3)Maximumfrequency(2)

ConditionsCL=50pF,VDD=2Vto3.6VMin

Max2125UnitMHz10tf(IO)outtr(IO)outfmax(IO)o

utCL=50pF,VDD=2Vto3.6Vns125CL=50pF,VDD=2Vto3.6V1025MHz01tf(IO)outtr(IO)out

CL=50pF,VDD=2Vto3.6Vns25CL=30pF,VDD=2.7Vto3.6VCL=50pF,VDD=2.7Vto3.6VCL=50pF,VDD=2Vto2.7V5030205812581210MHzMHzMHzFmax(IO)o

ut

11tf(IO)out

Outputhightolowlevelfalltime(3)

CL=30pF,VDD=2.7Vto3.6VCL=50pF,VDD=2.7Vto3.6VCL=50pF,VDD=2Vto2.7Vtr(IO)out

Outputlowtohighlevelrisetime(3)

CL=30pF,VDD=2.7Vto3.6VCL=50pF,VDD=2.7Vto3.6VCL=50pF,VDD=2Vto2.7Vns-tEXTIpw

PulsewidthofexternalsignalsdetectedbytheEXTIcontroller

ns1.RefertotheReferenceusermanualUM0306foradescriptionofGPIOPortconfigurationregister.2.ThemaximumfrequencyisdefinedinFigure16.

3.Valuesbasedondesignsimulationandvalidatedonsilicon,nottestedinproduction.

46/67https://houcheng-power.taobao.comwww.st.comSTM32FEBKxxFigure16.I/OACcharacteristicsdefinitionElectricalcharacteristics90P%EXTERNALOUTPUTON50pFtr(IO)out10P?%tr(IO)outTMaximumfrequencyisachievedif(tr+tf)￡2/3)Tandifthedutycycleis(45-55%)whenloadedby50pFai141315.3.13NRSTpincharacteristics

TheNRSTpininputdriverusesCMOStechnology.Itisconnectedtoapermanentpull-upresistor,RPU(seeTable29).Unlessotherwisespecified,theparametersgiveninTable32arederivedfromtestsperformedunderambienttemperatureandVDDsupplyvoltageconditionssummarizedinTable7.Table32.SymbolVIL(NRST)VIH(NRST)Vhys(NRST)RPUVF(NRST)VNF(NRST)

NRSTpincharacteristics(1)

ParameterNRSTInputlowlevelvoltageNRSTInputhighlevelvoltageNRSTSchmittvoltagehysteresistriggerVIN=VSS30ConditionsMin–0.522004050100300k?nsμsTypMax0.8VDD+0.5UnitVWeakpull-upequivalentresistor(2)NRSTInputfilteredpulse(3)NRSTInputnotfilteredpulse(3)

1.TBDstandsfortobedetermined.

2.Thepull-upisdesignedwithatrueresistanceinserieswithaswitchablePMOS.ThisPMOScontribution

totheseriesresistancemustbeminimum(~10%order).3.Valuesguaranteedbydesign,nottestedinproduction.

47/67https://houcheng-power.taobao.comwww.st.comElectricalcharacteristicsFigure17.RecommendedNRSTpinpr。tecti。nVDDNRST0.1μFRPUFILTERInternalResetSTM32FEBKxxExternalresetcircuitSTM32F101xxai14132b1.Theresetnetworkprotectsthedeviceagainstparasiticresets.

2.TheusermustensurethatthelevelontheNRSTpincangobelowtheVIL(NRST)maxlevelspecifiedin

Table32.Otherwisetheresetwillnotbetakenintoaccountbythedevice.

5.3.14TIMtimercharacteristics

Unlessotherwisespecified,theparametersgiveninTable33arederivedfromtestsperformedunderambienttemperature,fPCLKxfrequencyandVDDsupplyvoltageconditionssummarizedinTable7.RefertoSection5.3.12:I/Oportpincharacteristicsfordetailsontheinput/outputalternatefunctioncharacteristics(outputcompare,inputcapture,externalclock,PWMoutput).Table33.Symboltres(TIM)

TIMx(1)characteristicsParameterTimerresolutiontimeTimerexternalclockfrequencyonCH1toCH4Timerresolution16-bitcounterclockperiodwheninternalclockisselectedMaximumcountpossiblefTIMxCLK=72MHz1fTIMxCLK=72MHz0.0139ConditionsMin1fTIMxCLK=72MHz13.90fTIMxCLK=72MHz0fTIMxCLK/236166553691065536×6553659.6MaxUnittTIMxCLKnsMHzMHzbittTIMxCLKμstTIMxCLKsfEXTResTIMtCOUNTER

tMAX_COUNT

?

TIMxisusedasageneraltermtorefertotheTIM1,TIM2,TIM3andTIM4timers.

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I2Cinterfacecharacteristics

Unlessotherwisespecified,theparametersgiveninTable34arederivedfromtestsperformedunderambienttemperature,fPCLK1frequencyandVDDsupplyvoltageconditionssummarizedinTable7.2

TheSTM32FEBKxxperformancelineICinterfacemeetstherequirementsofthestandard2

ICcommunicationprotocolwiththefollowingrestrictions:theI/OpinsSDAandSCLaremappedtoarenot“true”open-drain.Whenconfiguredasopen-drain,thePMOSconnectedbetweentheI/OpinandVDDisdisabled,butisstillpresent.Inaddition,thereisaprotectiondiodebetweentheI/OpinandVDD.Asaconsequence,whenmultiplemasterdevicesare22

connectedtotheICbus,itisnotpossibletopowerofftheSTM32FEBKxxwhileanotherICmasternoderemainspoweredon.Otherwise,theSTM32FEBKxxwouldbepoweredbytheprotectiondiode.TheICcharacteristicsaredescribedinTable34.ReferalsotoSection5.3.12:I/Oportpincharacteristicsformoredetailsontheinput/outputalternatefunctioncharacteristics(SDAandSCL).Table34.I2CcharacteristicsStandardI2C(1)Min4.74.02500(3)

10003004.04.74.04.7400modeMaxFastmodeI2C(1)(2)Min1.30.61000(4)

20+0.1Cb20+0.1Cb0.60.60.61.3400μsμsμspF900(3)300nsSDAandSCLfalltimeStartconditionholdtimeRepeatedStartconditionsetuptimeStopconditionsetuptimeStoptoStartconditiontime(busfree)Capacitiveloadforeachbusline300μsMaxUnit2

Symboltw(SCLL)tw(SCLH)tsu(SDA)th(SDA)tr(SDA)tr(SCL)tf(SDA)tf(SCL)th(STA)tsu(STA)tsu(STO)tw(STO:STA)Cb

ParameterSCLclocklowtimeSCLclockhightimeSDAsetuptimeSDAdataholdtimeSDAandSCLrisetime1.ValuesbasedonstandardI2Cprotocolrequirement,nottestedinproduction.

2.fPCLK1mustbehigherthan2MHztoachievethemaximumstandardmodeI2Cfrequency.Itmustbehigherthan4MHztoachievethemaximumfastmodeI2Cfrequency.3.ThemaximumholdtimeoftheStartconditionhasonlytobemetiftheinterfacedoesnotstretchthelowperiodofSCLsignal.4.Thedevicemustinternallyprovideaholdtimeofatleast300nsfortheSDAsignalinordertobridgetheundefinedregionofthefallingedgeofSCL.

https://houcheng-power.taobao.comwww.st.com49/67ElectricalcharacteristicsFigure18.I2CbusACwaveformsandmeasurementcircuitVDD4.7k?I2CbusVDD4.7k?STM32FEBKxxSDASCLSTM32FEBKxx100?100?STARTREPEATEDSTARTtsu(STA)SDAtf(SDA)th(STA)SCLtw(SCKH)tr(SCK)tf(SCK)tsu(STO)ai14149bSTARTtr(SDA)tw(SCKL)tsu(SDA)th(SDA)STOPtsu(STA:STO)1.MeasurementpointsaredoneatCMOSlevels:0.3VDDand0.7VDD.

Table35.SCLfrequency(fPCLK1=36MHz.,VDD=3.3V)(1)(2)(3)

I2C_CCRvaluefSCL(kHz)RP=4.7k?4003002001005020TBDTBDTBDTBDTBDTBD1.TBD=tobedetermined.

2.RP=Externalpull-upresistance,fSCL=I2Cspeed,

3.Forspeedsaround200kHz,thetoleranceontheachievedspeedisof±5%.Forotherspeedranges,the

toleranceontheachievedspeed±2%.Thesevariationsdependontheaccuracyoftheexternalcomponentsusedtodesigntheapplication.

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