ADG1611_1612_1613
更新时间:2023-08-21 07:47:01 阅读量: 高等教育 文档下载
- ADG1611芯片功能推荐度:
- 相关推荐
数字模拟开关
1 Ω Typical On Resistance, ±5 V, +12 V,+5 V, and +3.3 V Quad SPST Switches
FEATURES
1 Ω typical on resistance 0.2 Ω on resistance flatness
±3.3 V to ±8 V dual-supply operation 3.3 V to 16 V single-supply operation No VL supply required
3 V logic-compatible inputs Rail-to-rail operation
Continuous current per channel LFCSP package: 280 mA TSSOP package: 175 mA
16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
APPLICATIONS
Communication systems Medical systems Audio signal routing Video signal routing
Automatic test equipment Data acquisition systems Battery-powered systems Sample-and-hold systems Relay replacements
GENERAL DESCRIPTION
The ADG1611/ADG1612/ADG1613 contain four independent single-pole/single-throw (SPST) switches. The ADG1611 and ADG1612 differ only in that the digital control logic is inverted. The ADG1611 switches are turned on with Logic 0 on the appropriate control input, while Logic 1 is required for the ADG1612 switches. The ADG1613 has two switches with digital control logic similar to that of the ADG1611; the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
The ADG1613 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is the low charge injection for minimum transients when switching the digital inputs. The ultralow on resistance of these switches make them ideal solutions for data acquisition and gain switching applications
where low on resistance and distortion is critical. The on resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals. The CMOS construction ensures ultralow power dissipation, making them ideally suited for portable and battery-powered instruments.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
ADG1611/ADG1612/ADG1613
IN1
IN2
IN3
S4
IN4
1
0NOTES
0-181. SWITCHES SHOWN FOR A LOGIC 1 INPUT.
970Figure 1.
IN2
S3IN3
S4
IN4
330NOTES
-181. SWITCHES SHOWN FOR A LOGIC 1 INPUT.
970Figure 2.
S1
D1S2
IN2
D2S3IN3
D3S4
IN4
D4
4
30NOTES
-181. SWITCHES SHOWN FOR A LOGIC 1 INPUT.
970Figure 3.
PRODUCT HIGHLIGHTS
1. 1.6 Ω maximum on resistance over temperature. 2. Minimum distortion: THD + N = 0.007%.
3. 3 V logic-compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V. 4. No VL logic power supply required. 5. Ultralow power dissipation: <16 nW.
6.
16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
数字模拟开关
ADG1611/ADG1612/ADG1613
3.3 V Single Supply ........................................................................6 Continuous Current per Channel, S or D ..................................7 Absolute Maximum Ratings ............................................................8 ESD Caution...................................................................................8 Pin Configurations and Function Descriptions ............................9 Typical Performance Characteristics ........................................... 10 Test Circuits ..................................................................................... 13 Terminology .................................................................................... 15 Outline Dimensions ....................................................................... 16 Ordering Guide .......................................................................... 16
TABLE OF CONTENTS
Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagrams ............................................................... 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 ±5 V Dual Supply ......................................................................... 3 12 V Single Supply ........................................................................ 4 5 V Single Supply .......................................................................... 5
REVISION HISTORY
9/09—Rev. 0 to Rev. A
Changes to On Resistance (RON) Parameter, On Resistance Match Between Channels (ΔRON) Parameter, and On Resistance Flatness (RFLATON) Parameter, Table 4 ............................................................ 6 Changes to Figure 7 Caption ......................................................... 10
1/09—Revision 0: Initial Version
Rev. A | Page 2 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
SPECIFICATIONS
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = 5 V ± 10%, GND = 0 V, unless otherwise noted. Table 1.
40°C to 40°C to
+85°C Test Conditions/Comments ANALOG SWITCH Analog Signal Range VDD to VSS On Resistance (RON) 1 VS = ±4.5 V, IS = 10 mA; see Figure 24 1.2 VDD = ±4.5 V, VSS = ±4.5 V On Resistance Match Between Channels ( RON0.04 VS = ±4.5 V, IS = 10 mA On Resistance Flatness (RFLAT(ON)) 0.2 VS = ±4.5 V, IS = 10 mA 0.25 LEAAGE CURRENTS VDD = +5.5 V, VSS = 5.5 V Source Off Leakage, IS (Off) ±0.1 nA typ VS = ±4.5 V, VD = 4.5 V; see Figure 25
Drain Off Leakage, ID (Off)
±0.3 ±0.1 nA typ VS = ±4.5 V, VD = 4.5 V; see Figure 25
K ±0.3
Channel On Leakage, ID, IS (On) ±0.2 nA typ VS = VD = ±4.5 V; see Figure 26 DIGITAL INPUTS Input High Voltage, VINH 2.0 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINHVIN = VGND or VDD Digital Input Capacitance, CIN 5 DYNAMIC CHARACTERISTICS1 tON 165 RL = 300 Ω, CL = 35 pF 212 VS = 2.5 V; see Figure 31 tOFF 105 RL = 300 Ω, CL = 35 pF 137 VS = 2.5 V; see Figure 31 Break-Before-Make Time Delay, tD 25 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 2.5 V; see Figure 32 Charge Injection 140 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33 Off Isolation 70 RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 27
Channel-to-Channel Crosstalk 110 RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 28
Total Harmonic Distortion + Noise (THD + N) 0.007 % typ RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
3 dB Bandwidth 42 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29 CS (Off) 63 pF typ VS = 0 V, f = 1 MHz CD (Off) 63 pF typ VS = 0 V, f = 1 MHz CD, CS (On) 154 pF typ VS = 0 V, f = 1 MHz POWER REQUIREMENTS VDD = +5.5 V, VSS = 5.5 V IDD 0.001 μA typ Digital inputs = 0 V or VDD 1.0 μA max VDD/VSS
1
Guaranteed by design, not subject to production test.
Rev. A | Page 3 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2.
40°C to 40°C to
+85°C Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD On Resistance (RONVS = 0 V to 10 V, IS = 10 mA; see Figure 24 VDD = 10.8 V, VSS = 0 V On Resistance Match Between Channels ( RON Ω typ VS = 0 V to 10 V, IS = 10 mA On Resistance Flatness (RFLAT(ON) VS = 0 V to 10 V, IS = 10 mA LEAKAGE CURRENTS VDD = 13.2 V, VSS = 0 V Source Off Leakage, IS (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V, see Figure 25 Drain Off Leakage, ID (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V see Figure 25 Channel On Leakage, ID, IS (On) ±0.2 nA typ VS = VD = 1 V or 10 V; see Figure 26 DIGITAL INPUTS Input High Voltage, VINH 2.0 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINHVIN = VGND or VDD Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS1
tONRL = 300 Ω, CL = 35 pF VS = 8 V; see Figure 31 tOFFRL = 300 Ω, CL = 35 pF VS = 8 V; see Figure 31 Break-Before-Make Time Delay, tD (ADG1613 Only) 35 ns typ RL = 300 Ω, CL = 35 pF VS1 = VS2 = 8 V; see Figure 32 Charge Injection 170 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF; see Figure 33 Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 27 Channel-to-Channel Crosstalk 110 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 Total Harmonic Distortion + Noise 0.012 % typ RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz;
see Figure 30
3 dB Bandwidth 38 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29 CS (Off) 60 pF typ VS = 6 V, f = 1 MHz CD (Off) 60 pF typ VS = 6 V, f = 1 MHz CD, CS (On) 154 pF typ VS = 6 V, f = 1 MHz POWER REQUIREMENTS VDD = 12 V IDD 0.001 μA typ Digital inputs = 0 V or VDD 1 μA max IDD 320 μA typ Digital inputs = 5 V 480 μA max VDD
1
Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
5 V SINGLE SUPPLY
VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 3.
40°C to 40°C to
+85°C Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD On Resistance (RONVS = 0 V to 4.5 V, IS = 10 mA; see Figure 24 VDD = 4.5 V, VSS = 0 V On Resistance Match Between Channels ( RON Ω typ VS = 0 V to 4.5 V, IS = 10 mA On Resistance Flatness (RFLAT(ON) VS = 0 V to 4.5 V, IS = 10 mA LEAKAGE CURRENTS VDD = 5.5 V, VSS = 0 V Source Off Leakage, IS (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 25 Drain Off Leakage, ID (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 25 ±0.3 ±1 ±6 nA max Channel On Leakage, ID, IS (On) ±0.15 nA typ VS = VD = 1 V or 4.5 V; see Figure 26 DIGITAL INPUTS Input High Voltage, VINH 2.0 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINHVIN = VGND or VDD ±0.1 μA max Digital Input Capacitance, CIN 5 pF typ DYNAMIC CHARACTERISTICS1
tONRL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 tOFFRL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 Break-Before-Make Time Delay, tD (ADG1613 Only) 35 ns typ RL = 300 Ω, CL = 35 pF VS1 = VS2 = 2.5 V; see Figure 32 Charge Injection 80 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33 Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 27
Channel-to-Channel Crosstalk 110 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 28
Total Harmonic Distortion + Noise 0.093 % typ RL = 110 Ω, f = 20 Hz to 20 kHz,
VS = 3.5 V p-p; see Figure 30
3 dB Bandwidth 42 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29 CS (Off) 72 pF typ VS = 2.5 V, f = 1 MHz CD (Off) 72 pF typ VS = 2.5 V, f = 1 MHz CD, CS (On) 160 pF typ VS = 2.5 V, f = 1 MHz POWER REQUIREMENTS VDD = 5.5 V IDD 0.001 μA typ Digital inputs = 0 V or VDD 1 μA max VDD
1
Guaranteed by design, not subject to production test.
Rev. A | Page 5 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
3.3 V SINGLE SUPPLY
VDD = 3.3 V, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 4.
40°C to 40°C to
+85°C Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD On Resistance (RONVS = 0 V to VDD, IS = 10 mA, VDD = 3.3 V,
VSS = 0 V; see Figure 24
On Resistance Match Between Channels ( RON0.07 0.08 Ω typ VS = 0 V to VDD, IS = 10 mA On Resistance Flatness (RFLAT(ON)1.3 VS = 0 V to VDD, IS = 10 mA LEAKAGE CURRENTS VDD = 3.6 V, VSS = 0 V Source Off Leakage, IS (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 25 ±0.3 ±1 ±6 nA max Drain Off Leakage, ID (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 25 ±0.3 ±1 ±6 nA max Channel On Leakage, ID, IS (On) ±0.1 nA typ VS = VD = 0.6 V or 3 V; see Figure 26 ±0.4 ±1.5 ±10 nA max DIGITAL INPUTS Input High Voltage, VINH 2.0 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINHVIN = VGND or VDD ±0.1 μA max Digital Input Capacitance, CIN 3 pF typ DYNAMIC CHARACTERISTICS1 tON 350 ns typ RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 31 tOFF 190 ns typ RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 31 Break-Before-Make Time Delay, tD (ADG1613 Only) 25 ns typ RL = 300 Ω, CL = 35 pF VS1 = VS2 = 1.5 V; see Figure 32 Charge Injection 50 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 33 Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 27
Channel-to-Channel Crosstalk 110 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 28
Total Harmonic Distortion + Noise 0.18 % typ RL = 110 Ω, f = 20 Hz to 20 kHz,
VS = 2 V p-p; see Figure 30
3 dB Bandwidth 52 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29 CS (Off) 76 pF typ VS = 1.5 V, f = 1 MHz CD (Off) 76 pF typ VS = 1.5 V, f = 1 MHz CD, CS (On) 160 pF typ VS = 1.5 V, f = 1 MHz POWER REQUIREMENTS VDD = 3.6 V IDD 0.001 μA typ Digital inputs = 0 V or VDD 1.0 1.0 μA max VDD
1
Guaranteed by design, not subject to production test.
Rev. A | Page 6 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
CONTINUOUS CURRENT PER CHANNEL, S OR D
Table 5.
Parameter
CONTINUOUS CURRENT, S OR D VDD = +5 V, VSS = 5 V
TSSOP (θJA = 150.4°C/W) LFCSP (θJA = 48.7°C/W) VDD = 12 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) LFCSP (θJA = 48.7°C/W) VDD = 5 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) LFCSP (θJA = 48.7°C/W) VDD = 3.3 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) LFCSP (θJA = 48.7°C/W)
175 119 70 280 175 95 206 135 84 336 203 108 140 91 63 220 140 84 140 98 70 228 150 91
Unit
mA maximum mA maximum
mA maximum mA maximum
mA maximum mA maximum
mA maximum mA maximum
Rev. A | Page 7 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Table 6.
VDD to VSSV VDD to GND 0.3 V to +18 V VSS to GND +0.3 V to 18 V Analog Inputs1 VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
1
Digital Inputs GND 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D 630 mA (pulsed at 1 ms,
10% duty-cycle maximum)
Continuous Current, S or D2 Data + 15% Operating Temperature Range Industrial (Y Version) 40°C to +125°C Storage Temperature Range 65°C to +150°C Junction Temperature 150°C
150.4°C/W 16-Lead TSSOP, θJA Thermal
Impedance (2-Layer Board)
48.7°C/W 16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
260°C Reflow Soldering Peak
Temperature, Pb free
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. 2
See Table 5.
1
ESD CAUTION
Rev. A | Page 8 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
15IN116D1
14IN2
IN1D1
IN2D2S2VDDNCS3D3
07981-002
S1VSSGNDS413D2
S1VSSGNDS4D4
12S211VDD10NC9S3
IN4NC = NO CONNECT
IN3
IN37
IN46
D38
D45
Figure 4. 16-Lead TSSOP Pin Configuration
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
Figure 5. 16-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
16-Lead TSSOP 16-Lead LFCSP 1 15 IN1 Logic Control Input. 2 16 D1 Drain Terminal. This pin can be an input or output. 3 1 S1 Source Terminal. This pin can be an input or output. VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal. This pin can be an input or output. 7 5 D4 Drain Terminal. This pin can be an input or output. 8 6 IN4 Logic Control Input. 9 7 IN3 Logic Control Input. 10 8 D3 Drain Terminal. This pin can be an input or output. 11 9 S3 Source Terminal. This pin can be an input or output. No Connection. VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal. This pin can be an input or output. 15 13 D2 Drain Terminal. This pin can be an input or output. 16 14 IN2 Logic Control Input. N/A 17 (EPAD) EP (EPAD) Exposed Pad. Tied to substrate, VSS.
Table 8. ADG1611/ADG1612 Truth Table
ADG1611 INx 0 1
ADG1612 INx 1 0
Switch Condition On Off
Table 9. ADG1613 Truth Table
Logic (INx) 0 1
Switch 1, Switch 4 Off On
Switch 2, Switch 3 On Off
Rev. A | Page 9 of 16
07981-003
数字模拟开关
ADG1611/ADG1612/ADG1613
1.4
TYPICAL PERFORMANCE CHARACTERISTICS
1.4
1.21.2ON RESISTANCE ( )
ON RESISTANCE ( )
1.0
1.0
0.80.8
0.6
0.6
07981-013
–6–4–202468024681012
VS OR VD VOLTAGE (V)
Figure 6. On Resistance as a Function of VD (VS) for Dual Supply
3.5
Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures,
12 V Single Supply
2.5
VS OR VD VOLTAGE (V)
3.0
ON RESISTANCE ( )
ON RESISTANCE ( )
2.5
2.0
2.0
1.5
1.5
1.0
1.0
00.51.01.52.02.53.03.54.04.55.0
VS OR VD VOLTAGE (V)
VS OR VD VOLTAGE (V)
Figure 7. On Resistance as a Function of VD (VS) for Single Supply
1.4
Figure 10. On Resistance as a Function of VD (VS) for Different Temperatures,
5 V Single Supply
4.0
1.2ON RESISTANCE ( )
ON RESISTANCE ( )
3.5
1.03.0
0.82.5
0.6
07981-011
–4–2024600.51.01.52.02.53.03.5
VS OR VD VOLTAGE (V)
VS OR VD VOLTAGE (V)
Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures,
±5 V Dual Supply
Figure 11. On Resistance as a Function of VD (VS) for Different Temperatures,
3.3 V Single Supply
Rev. A | Page 10 of 16
07981-006
0.4–6
2.0
1.5
07981-012
024681012
1416
07981-014
0.5
07981-010
0.4–8
0.4
数字模拟开关
20
15
1816
ADG1611/ADG1612/ADG1613
14
LEAKAGE CURRENT (nA)
LEAKAGE CURRENT (nA)
10
121086420–2
50–5–10–15
20
40
60
80
100
120
07981-030
TEMPERATURE (°C)
07981-032
–4
TEMPERATURE (°C)
Figure 12. Leakage Currents as a Function of Temperature, ±5 V Dual Supply
252015
Figure 15. Leakage Currents as a Function of Temperature,
3.3 V Single Supply
600500400300
LEAKAGE CURRENT (nA
)
1050–5–10–15
IDD (µA)
2001000–100
2
4
6LOGIC (V)
8
10
12
07981-00507981-009
TEMPERATURE (°C)
07981-031
–20
Figure 13. Leakage Currents as a Function of Temperature,
12 V Single Supply
20
300
Figure 16. IDD vs. Logic Level
15LEAKAGE CURRENT (nA)
250
CHARGE INJECTION (pC)
200
10
150
5
100
–4
–2
2
4VS (V)
6
8
10
12
14
20
40
60
80
100
120
07981-019
50
–5
0–6
TEMPERATURE (°C)
Figure 14. Leakage Currents as a Function of Temperature,
5 V Single Supply
Figure 17. Charge Injection vs. Source Voltage (VS)
Rev. A | Page 11 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
500450400350
–1
INSERTION LOSS (dB)
07981-018
TIME (ns)
300250200150100500–60
–2
–3
–4
–5
–40
–20
20
40
60
TEMPERATURE (°C)
80
100
120
140
10k100k1M10M100M1G
FREQUENCY (Hz)
07981-00407981-016
–61k
Figure 18. tON/tOFF
Times vs. Temperature Figure 21. On Response vs. Frequency
OFF ISOLATION (dB)
–10–15–20–25–30
–5
–20
10k100k
FREQUENCY (Hz)
1M10M
FREQUENCY (Hz)
Figure 19. Off Isolation vs. Frequency
0–20–40
0.200.180.160.14
Figure 22. ACPSRR vs. Frequency
CROSSTALK (dB)
–60–80–100–120–140
THD + N (%)
0.120.100.080.060.040.02
07981-017
05k10k15k20k25k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 20. Crosstalk vs. Frequency
Figure 23. THD + N vs. Frequency
Rev. A | Page 12 of 16
07981-008
10k100k1M10M100M1G
07981-007
–35–40–45–50–55–60–65–70–75–80–85
1k
–40
ACPSRR (dB)
–60
–80
–100
–120
1k
数字模拟开关
TEST CIRCUITS
IV0
20-18970
Figure 24. On Resistance
VS
1
20-189
70Figure 25. Off Leakage
2
20-18970
Figure 26. On Leakage
ADG1611/ADG1612/ADG1613
OFF ISOLATION = 20 log
6
2V0S
-1
8970Figure 27. Off Isolation
L
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V7
2V0S
-
18970Figure 28. Channel-to-Channel Crosstalk
V8
20INSERTION LOSS = 20 log
-1V8OUTWITHOUT SWITCH
970Figure 29. Bandwidth
Rev. A | Page 13 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
07981-029
Figure 30. THD + Noise
VVIN
VS
VIN
VOUT
07981-023
Figure 31. Switching Times
VIN
0V
50%
50%
VV
OUT1
VOUT1
VOUT2
07981-024
Figure 32. Break-Before-Make Time Delay
VINADG1612
ON
OFF
VINVOUT
07981-025
Figure 33. Charge Injection
Rev. A | Page 14 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
tON
The delay between applying the digital control input and the output switching on. See Figure 31.
tOFF
The delay between applying the digital control input and the output switching off. See Figure 31.
Charge Injection
A measure of the glitch impulse transferred from the digital input to the analog output during switching. See Figure 33. Off Isolation
A measure of unwanted signal coupling through an off switch. See Figure 27.
Crosstalk
A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. See Figure 28.
Bandwidth
The frequency at which the output is attenuated by 3 dB. See Figure 29.
On Response
The frequency response of the on switch. Insertion Loss
The loss due to the on resistance of the switch.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to the fundamental. See Figure 30.
AC Power Supply Rejection Ratio (ACPSRR)
The ratio of the amplitude of signal on the output to the amplitude of the modulation. This is a measure of the ability of the part to avoid coupling noise and spurious signals that appear on the supply voltage pin to the output of the switch. The dc voltage on the device is modulated by a sine wave of 0.62 V p-p.
TERMINOLOGY
IDD
The positive supply current. ISS
The negative supply current.
VD (VS)
The analog voltage on Terminal D and Terminal S. RON
The ohmic resistance between Terminal D and Terminal S. RFLAT(ON)
Flatness that is defined as the difference between the maximum and minimum value of on resistance measured over the specified analog signal range.
IS (Off)
The source leakage current with the switch off. ID (Off)
The drain leakage current with the switch off. ID, IS (On)
The channel leakage current with the switch on. VINL
The maximum input voltage for Logic 0. VINH
The minimum input voltage for Logic 1. IINL (IINH)
The input current of the digital input.
CS (Off)
The off switch source capacitance, which is measured with reference to ground.
CD (Off)
The off switch drain capacitance, which is measured with reference to ground.
CD, CS (On)
The on switch capacitance, which is measured with reference to ground. CIN
The digital input capacitance.
Rev. A | Page 15 of 16
数字模拟开关
ADG1611/ADG1612/ADG1613
OUTLINE DIMENSIONS
0.150.05
COPLANARITY
0.10
1.20COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.500.40FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDFUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1.000.850.80COMPLIANTTOJEDEC STANDARDS MO-220-VGGC.
031006-A
0.18
COPLANARITY
0.08
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
Dimensions shown in millimeters
ORDERING GUIDE
Package Description
1
ADG1611BRUZ 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BRUZ-REEL7 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1611BCPZ-REEL 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1611BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1612BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] ADG1612BRUZ-REEL71 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1612BCPZ- REEL 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1612BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1613BRUZ-REEL 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
ADG1613BRUZ-REEL7 40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] ADG1613BCPZ-REEL1 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
ADG1613BCPZ-REEL7 40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1
Package Option
RU-16 RU-16 RU-16 CP-16-13CP-16-13RU-16 RU-16 CP-16-13CP-16-13RU-16 RU-16 CP-16-13CP-16-13
Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07981-0-9/09(A)
Rev. A | Page 16 of 16
正在阅读:
ADG1611_1612_161308-21
我喜欢可爱的小白兔作文500字07-14
哈工大物理期末试卷04-06
一张卡片作文700字07-02
马鞍池公园作文350字07-12
春天真好作文500字07-15
一句迟到的谢谢作文800字06-19
联合租赁业务合作规范04-15
医院感染管理专兼职人员职责05-01
一年级奥林匹克数学题10-19
- 2012诗歌鉴赏讲座 师大附中张海波
- 2012-2013学年江苏省苏州市五市三区高三(上)期中数学模拟试卷(一)
- 市政基础设施工程竣工验收资料
- 小方坯连铸机专用超越离合器(引锭杆存放用)
- 荀子的学术性质之我见
- 氩弧焊管轧纹生产线操作说明
- 小学科学六年级上册教案
- (商务)英语专业大全
- 外汇储备的快速增长对我国经济发展的影响
- 幼儿园中班优秀语言教案《小猴的出租车》
- 第七章 仪表与显示系统
- 身份证号码前6位行政区划与籍贯对应表
- 单位(子单位)工程验收通知书
- 浅谈地铁工程施工的项目成本管理
- 沉积学知识点整理
- 前期物业管理中物业服务企业的法律地位
- 2014微量养分营养试卷
- 地质专业校内实习报告范文(通用版)
- 内部审计视角下我国高校教育经费支出绩效审计研究
- 高次插值龙格现象并作图数值分析实验1
- 1612
- 1611
- 1613
- ADG
- 2016年1—5月半月谈时事政治
- 2013-8-6深圳证券交易所规则 2013年修订 稿与 2012 年修订稿条文对照表
- 光网络基础——光纤、光缆、光连接器
- 最新江苏省交通建设工程工地试验室管理实施细则
- 东北证券:关于警惕假冒东北证券网站进行诈骗的提示性公告 2010-12-31
- 粤 传 媒:公司独立董事黄挺先生2009年度述职报告 2010-03-30
- 机械原理课程设计汽车风窗刮水器
- 控制系统仿真与CAD chapter 9
- flash动作脚本教程
- 上海市静安区2010年中考数学第二次模拟试卷及答案静安区数学
- 高考语文语病复习资料大全
- 口袋妖怪复刻版凯西好不好 凯西属性详解
- 教你怎样看懂化验单
- 铰链四杆机构的组成和分类
- 扫黑除恶工作情况汇报范文
- 南阳师院学前教育专业男生专业认同感的研究
- 三级物流师考试日常练习题(7)-物流师考试.doc
- 仰拱施工方案
- 2014年陕西省初级商务策划师考试技巧重点
- 夏米尔火花机纹与益新纹出模角度对照表