SMT制程专业术语

1 露底材 Base material expose 2 偏位 Shift 3 短路/连锡 Short 4 少锡 Insufficient solder 5 多锡/包焊 Excess solder 6 漏印 Missing print 7 反白 Upside down 8 少件 Missing component 9 反向 Wrong orientation 10 错件 Wrong component 11 多件/残件 Extra component 12 破损 Damaged 13 空焊 No solder 14 立碑 Tombstoning 15 锡珠 Solder balls 16 侧立 Side termination 17 零件氧化 Parts oxidation 18 锡尖 Solder projection 19 浮高 Float 20 翘脚 Lifted lead

21 PAD不上锡 PAD discoloration 22 针洞 Pinholes 23 压件 Cover component 24 残异物 Residues

25 助焊剂残留 Flux residues 26 少胶 Insufficient glue 27 溢胶 Overflow glue 28 误判 No Fail 29 其它 Other

30 印刷不良 Print Defect

31 上盖脱落/断裂 Top cover missing/crack 32 掉件/撞件 Drop component

33 内PIN翘起（缺PIN/短PIN/翘PIN） Lifted inside-pin 34 版本混装 Mixed edition 35 线路偏移 Circuit shift 36 错位 Error position

37 脚歪/变形 Lead deformed/deformation 38 混料 Mixed material

39 胶未固化 Glue not be solidified 40 烫伤 Scald

41 堵孔 Obstacle on via

42 PCB白化/分层 PCB Delamination 43 漏洞 Exposed copper 44 无极性 Missing polarity 45 压伤 Crush 46 漏点胶 Missing glue 47 气泡 Air bubble

48 屏蔽架变形 Shield Deformation

49 屏蔽架毛刺 Shield Burr 50 刮伤 Scraped 51 弹片翘起 Spring lifted 52 弹片失效 Spring failure

53 弹片无法复位Spring can’t replace 54 零件沾锡 Solder on parts

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