UMTC Substrate Process Flow Intro

更新时间:2023-04-09 12:57:01 阅读量: 实用文档 文档下载

说明:文章内容仅供预览,部分内容可能不全。下载后的文档,内容与下面显示的完全一致。下载之前请确认下面内容是否您想要的,是否完整无缺。

World Class Quality CONFIDENTIAL

Unimicron 7bc0fe8f05087632311212bd Introduction of Detail Substrate Manufacturing Process

Prepared by Unimicron

CSP Product

Surface Finish CONFIDENTIAL

2L Subtractive Process Flow

World Class Quality CONFIDENTIAL Unimicron

3

CSP Product

Surface Finish CONFIDENTIAL

Manufacturing Process of 2L STD DesignDrilling Drilling
Cu Plating
Pretreatment
Electroless Copper Plating
Electrolytic Copper Plating
Lithography
Pretreatment
D/F Laminate
Exposuring
Developing
Etching
Stripping
AOI
AOI/VRS
Solder Mask
Pretreatment
S/M Printing
Precure
Exposuring
Developing
Postcure
Ni/Au Plating
Pretreatment
Nickel Plating
Strike Au Plating
Au Plating
Cleaning
Routing
Routing
Visual Inspection
Final Clean
Visual Inspection
Packaging/Storage
Packaging
Storage
Ship to customer
World Class Quality
CONFIDENTIAL
5
Unimicron

CCL Glass Fiber Cloth

World Class Quality CONFIDENTIAL Unimicron

6

World Class Quality CONFIDENTIAL Unimicron

7

Panel Plating - PretreatmentPanel Release
Pretreatment
Electroless Copper Plating
Electrolytic Copper Plating
Mechanical Drill
Panel Plating
Lithography
AOI
Refer to P. 49Solder Mask
Electrolytic Ni / Au Plating
Desmear
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
8
Unimicron

Panel PlatingPanel Release
Pretreatment
Electroless Copper Plating
Electrolytic Copper Plating
Mechanical Drill
Plating CuPanel Plating Lithography
Cu foilRefer to P. 49
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Electroless Cu
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
9
Unimicron

Lithography – PretreatmentPanel Release
Pretreatment
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Microroughness
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
10
Unimicron

Lithography – Dry film laminatePretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Photo Resist
Panel Plating
Lithography
AOI
Refer to P. 50Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
Trace Pitch 60/60 50/50 40/40
Dry film type Thicker Medium Thinner11
World Class Quality
CONFIDENTIAL
Unimicron

Lithography – Mask coveredPretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Mask
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
MaskCONFIDENTIAL
World Class Quality
12
Unimicron

Lithography – ExposurePretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
UV LightMechanical Drill Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
13
Unimicron

Lithography – DevelopingPretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Cured Photo resist
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
14
Unimicron

Lithography – EtchingPretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Space (Etched)
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
15
Unimicron

Lithography – StrippingPretreatmentPanel Release
D/F Laminate
Exposuring
Developing
Etching
Stripping
Mechanical Drill
Bond finger & trace
Capture pad
Panel Plating
Lithography
AOI
Refer to P. 51Solder Mask
Electrolytic Ni / Au Plating
Routing
Solder ball pad
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
16
Unimicron

AOI – Auto Optical InspectionPanel Release
Illumination
CCD Camera
Illumination
Mechanical Drill
Reflection
Panel Plating
Lithography
AOI
Refer to P. 52Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
17
Unimicron

Open

Short

Scratch Protrusion

Void

Solder mask – Pretreatment (MEC Etch)PretreatmentPanel Release
S/M Printing
Precure
Exposuring
Developing
Mechanical Drill
CZ Solution
Panel Plating
Lithography
AOI
Refer to P. 53Solder Mask
Electrolytic Ni / Au Plating
CZ Solution
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
19
Unimicron

Solder mask - PrintingPretreatmentPanel Release
S/M Printing
Precure
Exposuring
Developing
Mechanical Drill
Solder mask
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
20
Unimicron

Solder mask – Mask and exposurePretreatmentPanel Release
S/M Printing
Precure
Exposuring
Developing
Mechanical Drill
Mask
Panel Plating
Lithography
AOI
Solder Mask
Electrolytic Ni / Au Plating
Routing
Final Visual Inspection & FQC
World Class Quality
CONFIDENTIAL
21
Unimicron

本文来源:https://www.bwwdw.com/article/o0bl.html

Top