数字温度测量系统 - 图文

毕业设计说明书

基于单片机的果园环境温度检

测报警系统设计

专业 自动化 孙炳全 B自动化092 0910603219 林萍 2013年6月5日

学生姓名 班学

级 号

指导教师 完成日期

基于单片机的果园环境温度检测报警系统设计

毕业设计说明书（毕业论文）

独创性声明

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盐城工学院本科生毕业设计说明书(2013)

基于单片机的果园环境温度检测报警系统设计

摘 要：温度是人们在农业生产中经常需要测量和控制的一个量，而基于单片机的果

园环境温度测量和报警系统使得温度测量与报警更加的直观、准确，它具有使用方便、性能可靠的优点。主要讨论了在果园的环境下的温度测量及报警的处理方法和系统构成。基于数字传感器DS18B20的性能特点，利用单片机和简单的接口电路组成一个温度测量及报警系统，通过键盘和LED显示数码管对温度进行显示和对温度报警上下限进行设置。给出了相关的应用电路和软件程序。该系统的温度的测量范围在－55℃- +100℃之间，它的测量的精度为0.1℃。这个系统完全满足了果园的温度测量及报警需求。

随着单片机技术和半导体技术的发展，这种智能化的温度测量及报警技术将会慢慢取代传统的温度测量技术，使得温度测量技术朝着更加智能化和自动化的方向发展。

关键字：果园环境；单片机；温度传感器DS18B20；温度测量及报警

基于单片机的果园环境温度检测报警系统设计

The Design of Based on Single-chip Orchard Ambient

Temperature Detection and Alarm System

Abstract: Temperature is that people in agricultural production often need to measure and

control an amount, and microcontroller-based orchard ambient temperature measurement and temperature measurement alarm and alarm system makes more intuitive, accurate, and it is easy to use, reliable performance advantages. mainly discusses the orchard environment temperature measurement and alarm processing method and system configuration. Based on the performance characteristics of digital sensor DS18B20, using SCM and simple interface circuit a temperature measurement and alarm system, through the keyboard and LED display digital temperature display and temperature alarm limit settings. There gives the relevant application circuit and software programs. The system temperature measuring range -55 ℃ - +100 ℃ between, its measurement accuracy of 0.1 ℃. The system fully meets the orchard temperature measurement and alarm requirements.

With chip technology and development of semiconductor technology, this intelligent temperature measurement and alarm technology will gradually replace the traditional temperature measurement technology, making the temperature measurement and automation technology towards more intelligent direction.

Key Words: Orchard environment；Microcontroller；Temperature sensor DS18B20；Temperature measurement and alarm

盐城工学院本科生毕业设计说明书(2013)

目 录

1 课题概述 .............................................................................................................................. 1 1.1 课题背景和意义 ............................................................................................................ 1 1.2 课题研究的内容及要求 ................................................................................................ 1 2 整体方案的论证与设计 ...................................................................................................... 3 2.1 系统的基本设计思想 .................................................................................................... 3 2.2 系统模块结构论证 ........................................................................................................ 3 3 系统硬件设计 ...................................................................................................................... 5 3.1 单片机STC89C52 ......................................................................................................... 5 3.2 温度传感器 .................................................................................................................... 6 3.3系统概述 ........................................................................................................................ 8 3.4模块化系统设计 ............................................................................................................ 9 4 软件设计 ............................................................................................................................ 14 4.1 程序设计流程 .............................................................................................................. 14 4.2 程序编写 ...................................................................................................................... 17 5 硬件调试 ............................................................................................................................ 18 5.1 静态检查 ...................................................................................................................... 18 5.2 通电检查 ...................................................................................................................... 18 5.3软件调试及软硬件联调 .............................................................................................. 18 5.4硬件实物图 .................................................................................................................. 18 6 结束语 ................................................................................................................................ 19 参考文献 ................................................................................................................................ 20 致 谢 .................................................................................................................................... 21 附 录 .................................................................................................................................... 22 附录1：程序清单 ............................................................................................................. 22 附录2：电路原理图 ......................................................................................................... 34 附录3：PCB布线图 ......................................................................................................... 35 附录4：Proteus仿真图 .................................................................................................... 36 附录5：实物图 ................................................................................................................. 37 附录6：元器件清单 ......................................................................................................... 39

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