京瓷高耐电压mlcc贴片电容规格书

Multilayer Ceramic Chip Capacitors

Kyocera'sseriesofMultilayerCeramicChipCapacitorsaredesignedtomeetawidevarietyofneeds.Weofferacompleterangeofproductsforbothgeneralandspecializedapplications,includingthegeneral-purposeCMseries,thehigh-voltageCFseries,thelowprofileCTseries,andtheDMseriesforautomotiveuses.

Features

Wehavefactoriesworldwideinordertosupplyourglobalcustomerbasesquicklyandefficientlyandtomaintainourreputationasoneofthehighest-volumeproducersintheindustry.

Allourproductsarehighlyreliableduetotheirmonolithicstructureofhigh-purityandsuperfineuniformceramicsandtheirintegralinternalelectrodes.

Bycombiningsuperiormanufacturingtechnologyandmaterialswithhighdielectricconstants,weproduceextremelycompactcomponentswithexceptionalspecifications.

Ourstringentqualitycontrolineveryphaseofproductionfrommaterialprocurementtoshippingensuresconsistentmanufacturingandsuperquality.

Kyoceracomponentsareavailableinawidechoiceofdimensions,temperaturecharacteristics,ratedvoltages,andterminationstomeetspecificconfigurationalrequirements.

Structure

NickelBarrierTerminationProducts

Pd/AgorLayer

Highdielectricconstant:BariumTitanatefamily

TapeandReelBulkCassette

PleasecontactyourlocalAVX,Kyocerasalesofficeordistributorforspecificationsnotcoveredinthiscatalog.

Ourproductsarecontinuallybeingimproved.Asaresult,thecapacitancerangeofeachseriesissubjecttochangewithoutnotice.Pleasecontactansalesrepresentativetoconfirmcompatibilitywithyourapplication.

Multilayer Ceramic Chip Capacitors

KyoceraCeramicChipCapacitorsareavailablefordifferentapplicationsasclassifiedbelow:

Multilayer Ceramic Chip Capacitors

Dimensions

Electrode

Dimensions

Standardthicknessisshown

ontheappropriateproductpages. CAseries(pleasereferapplicablepage)

Note)RegardingsupportforBulkcases,pleasecontactusforfurtherinformation.

Multilayer Ceramic Chip CapacitorsOrdering Infomation

KYOCERAPARTNUMBER:SERIESCODE

CMCFCTDM

GeneralPurposeHighVoltageLowProfileAutomotive

CA

CapacitorArrays

SIZECODE

SIZEEIA(EIAJ)03 0201(0603)05 0402(1005)105 0603(1608)

F12 0508(1220)/4cap

SIZE21316324243

EIA(EIAJ) 0805(2012) 1206(3216) 1210(3225) 1808(4520) 1812(4532)

SIZE525355D11D12

EIA(EIAJ) 2208(5720) 2218(5732) 2220(5750)

0405(1012)/2cap 0508(1220)/2cap

DIELECTRICCODE

CODEEIACODECG C0G(NPO)X7S X7S(Option)X5R X5RX6S X6S(Option)X7R X7RY5V Y5VNegativedielectrictypesareavailableonrequest.

CAPACITANCECODE

CapacitanceexpressedinpF.2significantdigitsplusnumberofzeros.

ForValues 10pF,LetterRdenotesdecimalpoint,eg.100000pF 1041.5pF 1R5

0.1 F 1040.5pF R504700pF 472100 F 107

TOLERANCECODE

A 0.05pF(option)B 0.1pF(option)C 0.25pF

D 0.5pFF 1pFG 2%

J K M

5% 10% 20%

Z

20to 80%

VOLTAGECODE

04061016253550

4VDC6.3VDC10VDC16VDC25VDC35VDC50VDC

100250400630

100VDC250VDC400VDC630VDC

1000200030004000

1000VDC2000VDC3000VDC4000VDC

TERMINATIONCODE

A NickelBarrier

PACKAGINGCODE

B Bulk

C BulkCassette(option)

T 7"ReelTaping&4mmCavitypitch

L 13"ReelTaping&4mmCavitypitchH 7"ReelTaping&2mmCavitypitchN 13"ReelTaping&2mmCavitypitch

OPTION

ThicknessmaxvalueisindicatedinCTseriesEX.125 1.25mmmax.

095 0.95mmmax.

Multilayer Ceramic Chip Capacitors

Temperature Characteristics and Tolerance

TemperatureCompensationType

K 250ppm/°C,J 120ppm/°C,H 60ppm/°C,G 30ppm/°Ce.g.CG 0 30ppm/°C

Note:Allpartswillbemarkedas"CG"butwillconformtotheabovetable.

Dielectricmaterials,capacitancevaluesandtolerancesareavailableinthefollowingcombinationsonly:

AvailableTolerancesNote:

1Nominalvaluesbelow10pFareavailableinthestandardvaluesof0.5pF,1.0pF,1.5pF,2.0pF,3.0pF,4.0pF,5.0pF,6.0pF,7.0pF,8.0pF,9.0pF 2J 5%forX7R(X5R)isavailableonrequest. 3option

CF Series

High Voltage Applications Nickel Barrier Terminations

[RoHS Compliant Products]

Features

Performlessthan1fitfailureratiobyhighvoltagedurabilityandhighreliabilitywhichhasoptimizedinternalelectrodestructurebasedondesigningofsafety.

Mid-voltagerange(Straightstructure)

Enoughbreak-downvoltagemarginbytakingsuitabledielectricthicknessforinpidualratedvoltage.

Realizehighvoltageperformancebyseriesconnectionoftwomulti-layercapacitorunitsinaMLCCtopideappliedvoltageintotwo.Highdurabilitytosurgingvoltageisguaranteed.

Mid-voltagerange(Triple-nodestructure)

Realizehighvoltageperformancebyseriesconnectionofthreemulti-layercapacitorunitsinaMLCCtopideappliedvoltageintothree.Enoughsafetyissecured.

Themulti-nodstructureisasafetydesigntoavoidshortcircuitfailure.

Applications

Softmodem/Isolationcircuit(Satisfiedsafetycapacitor) Camera/Strobecircuit,SergeKilling,TriggerCircuit

LCDBacklightInverter,BallastCapacitor

PowerCircuit/DC-DCConverter,SnubberCircuit

Specialspecificationforinpidualapplication

Asuitableguaranteeingspecificationwillbeexaminedtosatisfycustomer'sapplication,suchasforACvoltageapplication.*Informationofusageconditionwillbenecessarytobeexamined.

Customspecificationwillbeavailableaccordingtoyourrequest.Ex.SpecificationrelaitingtoACvoltage.*Usingconditionshallbeconfirmed.

E12series:Option

CF Series

High Voltage Applications Nickel Barrier Terminations

[RoHS Compliant Products]

Tapingdenotesthequantitypackagedperreel(kpmeans1000pcs.).P8inparenthesisdenotes8mmwidthpapertape;E8denotes8-mmwidthplastictape;E12denotes12-mmwidthplastictape.

SafetyRegulationsSatisfiedCapacitorsFeatures

Guarantee2.5kVimpulse(Y3),and5.0kVimpulse(Y2).

Realizesmallerandlowerprofileones,comparingconventionalleadedcapacitors.

Applications

SoftModem/Isolation

CLASSY2

TemperatureCompensationDielectric

X7RDielectric

CLASSY3(+2.5kVImpulse)

TemperatureCompensationDielectricX7RDielectric

Thicknessandpackagequantity

Tapingdenotesthequantitypackagedperreel(kpmeans1000pcs.).P8inparenthesisdenotes8mmwidthpapertape;E8denotes8-mmwidthplastictape;E12denotes12-mmwidthplastic

tape.

Multilayer Ceramic Chip CapacitorsElectrical Characteristics

Capacitance-Temperature(temperaturecompensation)

10

DCapacitance(%)

5

0C

-5

U

-10

-60

-40

-20

20

40

60

80

100

120

Temperature(°C)

Impedance-Frequency

1007R0

.01

X1000

pF

C

Impedance( )

100.1 10.1

F

F

10

1p0.01

0.001

0.1

1101001,00010,000

Frequency(MHz)

Pleaseverifyinpidualcharacteristicsatthedesignstagetoensuretotalsuitability

Multilayer Ceramic Chip CapacitorsTest Conditions and Standards

5

Thechargeanddischargecurrentofthecapacitormustnotexceed50mA.

2 3theratedvoltageexceeds630V.2Nat0201Size

Apply500Vfor1miniteincasetheratedvoltageis1000Vorhigher.

Multilayer Ceramic Chip CapacitorsTest Conditions and Standards

*11*12*13*14*15*16*17

*2*3*4*5*6*7*8*9

ExceptCFseries.

ApplytoX5R10Vtype.

Applyto25VseriesofCM105Y5V154over,CM21Y5V105over,316Y5V155over.Measurementcondition1kHz,1VrmsforY5V,C<47 Ftype.

Thecharge/dischargecurrentofthecapacitormustnotexceed50mA.2Nat0201Size

ApplytoX5R4Vand6.3Vtype.

Use1.2timeswhentheratedvoltageis630Vorover.X7R16V/25Vtype.

ApplytoX5R16V/25Vtype,X7R6.3V/10Vtype.

ApplytoY5V16Vtype,CM32Y5V335to106(25VType).

ApplytoY5V6.3V/10Vtype.Apply16%toCM21Y5V106/CM316Y5V226.ExcludeCTserieswiththicknessoflessthan0.66mmandCAseries.

Use1.5timeswhentheratedvoltageis4V/6.3V/10V/250Vand100V(32X7R474/43X7R105/55X7R105).Use1.2timeswhentheratedvoltageis630Vorover.

Keepspecimenat150°C 0/ 10°Cforonehour,leavespecimenatroomambientfor48 4hours.Applythesametestconditionforonehour,thenleavethespecimenatroomambientfor48 4hours.

Multilayer Ceramic Chip CapacitorsPackaging Options

Reel

Tape

(Unit:mm)

W2:18.4mmmax.

F 2mm(03,05,105Type)

(Unit:mm)

(Unit:mm)

05Type:0.75max.105Type:1.1max.

F 4mm(105,D11,D12,F12,21,316,32,42,52Type)

(Plastic)

(Paper)

F 8mm(43,53,55Type)

(Plastic)

Multilayer Ceramic Chip CapacitorsPrecautions

CircuitDesign

1.Onceapplicationandassemblyenvironmentshavebeenchecked,eexceedingthatwhichisspecifiedmayresultininferiorperformanceorcauseashort,open,smoking,orflamingtooccur,etc.2.Pleaseconsultthemanufacturerinadvancewhenthecapacitorisusedindevicessuchas:deviceswhichdealwithhumanlife,i.e.medicaldevices;deviceswhicharehighlypublicorientated;anddeviceswhichdemandahighstandardofliability.

Accidentormalfunctionofdevicessuchasmedicaldevices,spaceequipmentanddeviceshavingtodowithatomicpowercouldgenerategraveconsequencewithrespecttohumanlivesor,possibly,aportionofthepublic.Capacitorsusedinthesedevicesmayrequirehighreliabilitydesigndifferentfromthatofgeneralpurposecapacitors.3.Pleaseusethecapacitorsinconformancewiththeoperatingtemperatureprovidedinboththecatalogandthespecifications.

Beespeciallycautiousnottoexceedthemaximumtemperature.Inthesituationthemaximumtemperaturesetforthinboththecatalogandspecificationsisexceeded,thecapacitor'sinsulationresistancemaydeteriorate,powermaysuddenlysurgeandshort-circuitmayoccur.

Thecapacitorhasaloss,andmayself-heatduetoequivalentseriesresistancewhenalternatingelectriccurrentispassedtherethrough.Asthiseffectbecomesespeciallypronouncedinhighfrequencycircuits,pleaseexercisecaution.

Whenusingthecapacitorina(self-heating)circuit,pleasemakesurethesurfaceofthecapacitorremainsunderthemaximumtemperatureforusage.Also,pleasemakecertaintemperaturerisesremainbelow20°C.4.Pleasekeepvoltageundertheratedvoltagewhichisappliedtothecapacitor.Also,pleasemakecertainthepeakvoltageremainsbelowtheratedvoltagewhenACvoltageissuper-imposedtotheDCvoltage.

InthesituationwhereACorpulsevoltageisemployed,ensureaveragepeakvoltagedoesnotexceedtheratedvoltage.

Exceedingtheratedvoltageprovidedinbothcatalogandspecificationsmayleadtodefectivewithstandingvoltageor,inworstcasesituations,maycausethecapacitortosmokeorflame.5.Whenthecapacitoristobeemployedinacircuitinwhichthereiscontinuousapplicationofahighfrequencyvoltageorasteeppulsevoltage,eventhoughitiswithintheratedvoltage,pleaseinquiretothemanufacturer.

InthesituationthecapacitoristobeemployedusingahighfrequencyACvoltageoraextremelyfastrisingpulsevoltage,eventhoughitiswithintheratedvoltage,itispossiblecapacitorreliabilitywilldeteriorate.6.Itisacommonphenomenonofhigh-dielectricproductstohaveadeterioratedamountofstaticelectricityduetotheapplicationofDCvoltage.Duecautionisnecessaryasthedegreeofdeteriorationvariesdependingonthequalityofcapacitormaterials,capacity,aswellastheloadvoltageatthetimeofoperation.7.Donotusethecapacitorinanenvironmentwhereitmighteasilyexceedtherespectiveprovisionsconcerningshockandvibrationspecifiedinthecatalogandspecifications.

Inaddition,itisacommonpiezophenomenonofhighdielectricproductstohavesomeVoltageduetovibrationortohavenoiseduetoVoltagechange.Pleasecontactsalesinsuchcase.8.Iftheelectrostaticcapacityvalueofthedeliveredcapacitoriswithinthespecifiedtolerance,pleaseconsiderthiswhendesigningtherespectiveproductinorderthattheassembledproductfunctionappropriately.9.Pleasecontactusuponusingconductiveadhesives.

Storage

1.Ifthecomponentisstoredinminimalpackaging(aheat-sealedorchuck-typeplasticbag),thebagshouldbekeptclosed.Oncethebaghasbeenopened,resealitorstoreitinadesiccator.2.Keepstorageplacetemperature+5to+35degreeC,humidity45to70%RH.

3.Thestorageatmospheremustbefreeofgascontainingsulfurandchlorine.Also,avoidexposingtheproducttosalinemoisture.Iftheproductisexposedtosuchatmospheres,theterminalswilloxidizeandsolderabilitywillbeeffected.4.Precautions1)-3)applytochipcapacitorspackagedincarriertapesandbulkcases.

5.Thesolderabilityisassuredfor12monthsfromourshippingdate(sixmonthsforsilverpalladium)iftheabovestorageprecautionsarefollowed.

6.Chipcapacitorsmaycrackifexposedtohydrogen(H2)gaswhilesealedorifcoatedwithsilicon,whichgenerateshydrogengas.

(Unit:mm)

Whenmountingthecapacitortothesubstrate,itisimportanttoconsidercarefullythattheamountofsolder(sizeoffillet)usedhasadirecteffectuponthecapacitoronceitismounted.

a)Thegreatertheamountofsolder,thegreaterthestresstotheelements.Asthismaycausethesubstratetobreakorcrack,itisimportanttoestablishtheappropriatedimensionswithregardtotheamountofsolderwhendesigningthelandofthesubstrate.b)Inthesituationwheretwoormoredevicesaremountedontoacommonland,separatethedeviceintoexclusivepadsbyusingsolderingresist

(Unit:mm)

Multilayer Ceramic Chip CapacitorsSurface Mounting Information

MountingDesign

ThechipcouldcrackifthePCBwarpsduringprocessingafterthechiphasbeensoldered.

RecommendedchippositiononPCBtominimizestressfromPCBwarpage

(Notrecommended)

(Ideal)

ActualMounting

1)Ifthepositionofthevacuumnozzleistoolow,alargeforcemaybeappliedtothechipcapacitorduringmounting,resultingincracking.2)Duringmounting,setthenozzlepressuretoastaticloadof100to300gf.

3)Tominimizetheshockofthevaccumnozzle,provideasupportpinonthebackofthePCBtominimizePCBflexture.

4)Bottompositionofpickupnozzleshouldbeadjustedtothetopsurfaceofasubstratewhichcamberiscorrected.5)Toreducethepossibilityofchippingandcracks,minimizevibrationtochipsstoredinabulkcase.

6)Thedischargepressuremustbeadjustedtothepartsize.Verifythepressureduringsetuptoavoidfracturingorcrackingthechipscapacitors.

ResinMold

1)Ifalargeamountofresinisusedformoldingthechip,cracksmayoccurduetocontractionstressduringcuring.Toavoidsuchcracks,usealowshrinkageresin.

2)ealowmoistureabsorptionresin.

3)Checkcarefullythattheresindoesnotgenerateadecompositiongasorreactiongasduringthecuringprocessorduringnormalstorage.Suchgasesmaycrackthechipcapacitorordamagethedeviceitself.

Multilayer Ceramic Chip CapacitorsSurface Mounting Information

SolderingMethod

1)Ceramiciseasilydamagedbyrapidheatingorcooling.Ifsomeheatshockisunavoidable,preheatenoughtolimitthetemperaturedifference(DeltaT)towithin130degreeCelsius.

2)Theproductsize1.0 0.5mmto3.2 1.6mmcanbeusedinreflowandwavesoldering,andtheproductsizeofover3.2 2.5mm,0.6 0.3mm,andcapacitorarrayscanbeusedinreflow.

Circuitshortageandsmokingcanbecreatedbyusingcapacitorswhichareusedneglectingtheabovecaution.3)Pleaseseeourrecommendedsolderingconditions.

Pleasecontactusifyouuseleadfreesolderbecausethepeaktemperatureofleadfreeisdifferentfromnon-leadfree.

Soderingiron

1)Temperatureofironchip2)Wattage

3)Tipshapeofsolderingiron4)SolderingTime

380°Cmax.80Wmax. 3.0mmmax.3sec.max.

5)Cautions

a)Pre-heatingisnecessaryRapidheatingmustbeavoided.

DeltaT 150°C.

b)Avoiddirecttouchingtocapacitors.

c)Avoidrapidcoolingaftersoldering.Naturalcoolingisrecommended.

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