京瓷高耐电压mlcc贴片电容规格书
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Multilayer Ceramic Chip Capacitors
Kyocera'sseriesofMultilayerCeramicChipCapacitorsaredesignedtomeetawidevarietyofneeds.Weofferacompleterangeofproductsforbothgeneralandspecializedapplications,includingthegeneral-purposeCMseries,thehigh-voltageCFseries,thelowprofileCTseries,andtheDMseriesforautomotiveuses.
Features
Wehavefactoriesworldwideinordertosupplyourglobalcustomerbasesquicklyandefficientlyandtomaintainourreputationasoneofthehighest-volumeproducersintheindustry.
Allourproductsarehighlyreliableduetotheirmonolithicstructureofhigh-purityandsuperfineuniformceramicsandtheirintegralinternalelectrodes.
Bycombiningsuperiormanufacturingtechnologyandmaterialswithhighdielectricconstants,weproduceextremelycompactcomponentswithexceptionalspecifications.
Ourstringentqualitycontrolineveryphaseofproductionfrommaterialprocurementtoshippingensuresconsistentmanufacturingandsuperquality.
Kyoceracomponentsareavailableinawidechoiceofdimensions,temperaturecharacteristics,ratedvoltages,andterminationstomeetspecificconfigurationalrequirements.
Structure
NickelBarrierTerminationProducts
Pd/AgorLayer
Highdielectricconstant:BariumTitanatefamily
TapeandReelBulkCassette
PleasecontactyourlocalAVX,Kyocerasalesofficeordistributorforspecificationsnotcoveredinthiscatalog.
Ourproductsarecontinuallybeingimproved.Asaresult,thecapacitancerangeofeachseriesissubjecttochangewithoutnotice.Pleasecontactansalesrepresentativetoconfirmcompatibilitywithyourapplication.
Multilayer Ceramic Chip Capacitors
KyoceraCeramicChipCapacitorsareavailablefordifferentapplicationsasclassifiedbelow:
Multilayer Ceramic Chip Capacitors
Dimensions
Electrode
Dimensions
Standardthicknessisshown
ontheappropriateproductpages. CAseries(pleasereferapplicablepage)
Note)RegardingsupportforBulkcases,pleasecontactusforfurtherinformation.
Multilayer Ceramic Chip CapacitorsOrdering Infomation
KYOCERAPARTNUMBER:SERIESCODE
CMCFCTDM
GeneralPurposeHighVoltageLowProfileAutomotive
CA
CapacitorArrays
SIZECODE
SIZEEIA(EIAJ)03 0201(0603)05 0402(1005)105 0603(1608)
F12 0508(1220)/4cap
SIZE21316324243
EIA(EIAJ) 0805(2012) 1206(3216) 1210(3225) 1808(4520) 1812(4532)
SIZE525355D11D12
EIA(EIAJ) 2208(5720) 2218(5732) 2220(5750)
0405(1012)/2cap 0508(1220)/2cap
DIELECTRICCODE
CODEEIACODECG C0G(NPO)X7S X7S(Option)X5R X5RX6S X6S(Option)X7R X7RY5V Y5VNegativedielectrictypesareavailableonrequest.
CAPACITANCECODE
CapacitanceexpressedinpF.2significantdigitsplusnumberofzeros.
ForValues 10pF,LetterRdenotesdecimalpoint,eg.100000pF 1041.5pF 1R5
0.1 F 1040.5pF R504700pF 472100 F 107
TOLERANCECODE
A 0.05pF(option)B 0.1pF(option)C 0.25pF
D 0.5pFF 1pFG 2%
J K M
5% 10% 20%
Z
20to 80%
VOLTAGECODE
04061016253550
4VDC6.3VDC10VDC16VDC25VDC35VDC50VDC
100250400630
100VDC250VDC400VDC630VDC
1000200030004000
1000VDC2000VDC3000VDC4000VDC
TERMINATIONCODE
A NickelBarrier
PACKAGINGCODE
B Bulk
C BulkCassette(option)
T 7"ReelTaping&4mmCavitypitch
L 13"ReelTaping&4mmCavitypitchH 7"ReelTaping&2mmCavitypitchN 13"ReelTaping&2mmCavitypitch
OPTION
ThicknessmaxvalueisindicatedinCTseriesEX.125 1.25mmmax.
095 0.95mmmax.
Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
TemperatureCompensationType
K 250ppm/°C,J 120ppm/°C,H 60ppm/°C,G 30ppm/°Ce.g.CG 0 30ppm/°C
Note:Allpartswillbemarkedas"CG"butwillconformtotheabovetable.
Dielectricmaterials,capacitancevaluesandtolerancesareavailableinthefollowingcombinationsonly:
AvailableTolerancesNote:
1Nominalvaluesbelow10pFareavailableinthestandardvaluesof0.5pF,1.0pF,1.5pF,2.0pF,3.0pF,4.0pF,5.0pF,6.0pF,7.0pF,8.0pF,9.0pF 2J 5%forX7R(X5R)isavailableonrequest. 3option
CF Series
High Voltage Applications Nickel Barrier Terminations
[RoHS Compliant Products]
Features
Performlessthan1fitfailureratiobyhighvoltagedurabilityandhighreliabilitywhichhasoptimizedinternalelectrodestructurebasedondesigningofsafety.
Mid-voltagerange(Straightstructure)
Enoughbreak-downvoltagemarginbytakingsuitabledielectricthicknessforinpidualratedvoltage.
Realizehighvoltageperformancebyseriesconnectionoftwomulti-layercapacitorunitsinaMLCCtopideappliedvoltageintotwo.Highdurabilitytosurgingvoltageisguaranteed.
Mid-voltagerange(Triple-nodestructure)
Realizehighvoltageperformancebyseriesconnectionofthreemulti-layercapacitorunitsinaMLCCtopideappliedvoltageintothree.Enoughsafetyissecured.
Themulti-nodstructureisasafetydesigntoavoidshortcircuitfailure.
Applications
Softmodem/Isolationcircuit(Satisfiedsafetycapacitor) Camera/Strobecircuit,SergeKilling,TriggerCircuit
LCDBacklightInverter,BallastCapacitor
PowerCircuit/DC-DCConverter,SnubberCircuit
Specialspecificationforinpidualapplication
Asuitableguaranteeingspecificationwillbeexaminedtosatisfycustomer'sapplication,suchasforACvoltageapplication.*Informationofusageconditionwillbenecessarytobeexamined.
Customspecificationwillbeavailableaccordingtoyourrequest.Ex.SpecificationrelaitingtoACvoltage.*Usingconditionshallbeconfirmed.
E12series:Option
CF Series
High Voltage Applications Nickel Barrier Terminations
[RoHS Compliant Products]
Tapingdenotesthequantitypackagedperreel(kpmeans1000pcs.).P8inparenthesisdenotes8mmwidthpapertape;E8denotes8-mmwidthplastictape;E12denotes12-mmwidthplastictape.
SafetyRegulationsSatisfiedCapacitorsFeatures
Guarantee2.5kVimpulse(Y3),and5.0kVimpulse(Y2).
Realizesmallerandlowerprofileones,comparingconventionalleadedcapacitors.
Applications
SoftModem/Isolation
CLASSY2
TemperatureCompensationDielectric
X7RDielectric
CLASSY3(+2.5kVImpulse)
TemperatureCompensationDielectricX7RDielectric
Thicknessandpackagequantity
Tapingdenotesthequantitypackagedperreel(kpmeans1000pcs.).P8inparenthesisdenotes8mmwidthpapertape;E8denotes8-mmwidthplastictape;E12denotes12-mmwidthplastic
tape.
Multilayer Ceramic Chip CapacitorsElectrical Characteristics
Capacitance-Temperature(temperaturecompensation)
10
DCapacitance(%)
5
0C
-5
U
-10
-60
-40
-20
20
40
60
80
100
120
Temperature(°C)
Impedance-Frequency
1007R0
.01
X1000
pF
C
Impedance( )
100.1 10.1
F
F
10
1p0.01
0.001
0.1
1101001,00010,000
Frequency(MHz)
Pleaseverifyinpidualcharacteristicsatthedesignstagetoensuretotalsuitability
Multilayer Ceramic Chip CapacitorsTest Conditions and Standards
5
Thechargeanddischargecurrentofthecapacitormustnotexceed50mA.
2 3theratedvoltageexceeds630V.2Nat0201Size
Apply500Vfor1miniteincasetheratedvoltageis1000Vorhigher.
Multilayer Ceramic Chip CapacitorsTest Conditions and Standards
*11*12*13*14*15*16*17
*2*3*4*5*6*7*8*9
ExceptCFseries.
ApplytoX5R10Vtype.
Applyto25VseriesofCM105Y5V154over,CM21Y5V105over,316Y5V155over.Measurementcondition1kHz,1VrmsforY5V,C<47 Ftype.
Thecharge/dischargecurrentofthecapacitormustnotexceed50mA.2Nat0201Size
ApplytoX5R4Vand6.3Vtype.
Use1.2timeswhentheratedvoltageis630Vorover.X7R16V/25Vtype.
ApplytoX5R16V/25Vtype,X7R6.3V/10Vtype.
ApplytoY5V16Vtype,CM32Y5V335to106(25VType).
ApplytoY5V6.3V/10Vtype.Apply16%toCM21Y5V106/CM316Y5V226.ExcludeCTserieswiththicknessoflessthan0.66mmandCAseries.
Use1.5timeswhentheratedvoltageis4V/6.3V/10V/250Vand100V(32X7R474/43X7R105/55X7R105).Use1.2timeswhentheratedvoltageis630Vorover.
Keepspecimenat150°C 0/ 10°Cforonehour,leavespecimenatroomambientfor48 4hours.Applythesametestconditionforonehour,thenleavethespecimenatroomambientfor48 4hours.
Multilayer Ceramic Chip CapacitorsPackaging Options
Reel
Tape
(Unit:mm)
W2:18.4mmmax.
F 2mm(03,05,105Type)
(Unit:mm)
(Unit:mm)
05Type:0.75max.105Type:1.1max.
F 4mm(105,D11,D12,F12,21,316,32,42,52Type)
(Plastic)
(Paper)
F 8mm(43,53,55Type)
(Plastic)
Multilayer Ceramic Chip CapacitorsPrecautions
CircuitDesign
1.Onceapplicationandassemblyenvironmentshavebeenchecked,eexceedingthatwhichisspecifiedmayresultininferiorperformanceorcauseashort,open,smoking,orflamingtooccur,etc.2.Pleaseconsultthemanufacturerinadvancewhenthecapacitorisusedindevicessuchas:deviceswhichdealwithhumanlife,i.e.medicaldevices;deviceswhicharehighlypublicorientated;anddeviceswhichdemandahighstandardofliability.
Accidentormalfunctionofdevicessuchasmedicaldevices,spaceequipmentanddeviceshavingtodowithatomicpowercouldgenerategraveconsequencewithrespecttohumanlivesor,possibly,aportionofthepublic.Capacitorsusedinthesedevicesmayrequirehighreliabilitydesigndifferentfromthatofgeneralpurposecapacitors.3.Pleaseusethecapacitorsinconformancewiththeoperatingtemperatureprovidedinboththecatalogandthespecifications.
Beespeciallycautiousnottoexceedthemaximumtemperature.Inthesituationthemaximumtemperaturesetforthinboththecatalogandspecificationsisexceeded,thecapacitor'sinsulationresistancemaydeteriorate,powermaysuddenlysurgeandshort-circuitmayoccur.
Thecapacitorhasaloss,andmayself-heatduetoequivalentseriesresistancewhenalternatingelectriccurrentispassedtherethrough.Asthiseffectbecomesespeciallypronouncedinhighfrequencycircuits,pleaseexercisecaution.
Whenusingthecapacitorina(self-heating)circuit,pleasemakesurethesurfaceofthecapacitorremainsunderthemaximumtemperatureforusage.Also,pleasemakecertaintemperaturerisesremainbelow20°C.4.Pleasekeepvoltageundertheratedvoltagewhichisappliedtothecapacitor.Also,pleasemakecertainthepeakvoltageremainsbelowtheratedvoltagewhenACvoltageissuper-imposedtotheDCvoltage.
InthesituationwhereACorpulsevoltageisemployed,ensureaveragepeakvoltagedoesnotexceedtheratedvoltage.
Exceedingtheratedvoltageprovidedinbothcatalogandspecificationsmayleadtodefectivewithstandingvoltageor,inworstcasesituations,maycausethecapacitortosmokeorflame.5.Whenthecapacitoristobeemployedinacircuitinwhichthereiscontinuousapplicationofahighfrequencyvoltageorasteeppulsevoltage,eventhoughitiswithintheratedvoltage,pleaseinquiretothemanufacturer.
InthesituationthecapacitoristobeemployedusingahighfrequencyACvoltageoraextremelyfastrisingpulsevoltage,eventhoughitiswithintheratedvoltage,itispossiblecapacitorreliabilitywilldeteriorate.6.Itisacommonphenomenonofhigh-dielectricproductstohaveadeterioratedamountofstaticelectricityduetotheapplicationofDCvoltage.Duecautionisnecessaryasthedegreeofdeteriorationvariesdependingonthequalityofcapacitormaterials,capacity,aswellastheloadvoltageatthetimeofoperation.7.Donotusethecapacitorinanenvironmentwhereitmighteasilyexceedtherespectiveprovisionsconcerningshockandvibrationspecifiedinthecatalogandspecifications.
Inaddition,itisacommonpiezophenomenonofhighdielectricproductstohavesomeVoltageduetovibrationortohavenoiseduetoVoltagechange.Pleasecontactsalesinsuchcase.8.Iftheelectrostaticcapacityvalueofthedeliveredcapacitoriswithinthespecifiedtolerance,pleaseconsiderthiswhendesigningtherespectiveproductinorderthattheassembledproductfunctionappropriately.9.Pleasecontactusuponusingconductiveadhesives.
Storage
1.Ifthecomponentisstoredinminimalpackaging(aheat-sealedorchuck-typeplasticbag),thebagshouldbekeptclosed.Oncethebaghasbeenopened,resealitorstoreitinadesiccator.2.Keepstorageplacetemperature+5to+35degreeC,humidity45to70%RH.
3.Thestorageatmospheremustbefreeofgascontainingsulfurandchlorine.Also,avoidexposingtheproducttosalinemoisture.Iftheproductisexposedtosuchatmospheres,theterminalswilloxidizeandsolderabilitywillbeeffected.4.Precautions1)-3)applytochipcapacitorspackagedincarriertapesandbulkcases.
5.Thesolderabilityisassuredfor12monthsfromourshippingdate(sixmonthsforsilverpalladium)iftheabovestorageprecautionsarefollowed.
6.Chipcapacitorsmaycrackifexposedtohydrogen(H2)gaswhilesealedorifcoatedwithsilicon,whichgenerateshydrogengas.
(Unit:mm)
Whenmountingthecapacitortothesubstrate,itisimportanttoconsidercarefullythattheamountofsolder(sizeoffillet)usedhasadirecteffectuponthecapacitoronceitismounted.
a)Thegreatertheamountofsolder,thegreaterthestresstotheelements.Asthismaycausethesubstratetobreakorcrack,itisimportanttoestablishtheappropriatedimensionswithregardtotheamountofsolderwhendesigningthelandofthesubstrate.b)Inthesituationwheretwoormoredevicesaremountedontoacommonland,separatethedeviceintoexclusivepadsbyusingsolderingresist
(Unit:mm)
Multilayer Ceramic Chip CapacitorsSurface Mounting Information
MountingDesign
ThechipcouldcrackifthePCBwarpsduringprocessingafterthechiphasbeensoldered.
RecommendedchippositiononPCBtominimizestressfromPCBwarpage
(Notrecommended)
(Ideal)
ActualMounting
1)Ifthepositionofthevacuumnozzleistoolow,alargeforcemaybeappliedtothechipcapacitorduringmounting,resultingincracking.2)Duringmounting,setthenozzlepressuretoastaticloadof100to300gf.
3)Tominimizetheshockofthevaccumnozzle,provideasupportpinonthebackofthePCBtominimizePCBflexture.
4)Bottompositionofpickupnozzleshouldbeadjustedtothetopsurfaceofasubstratewhichcamberiscorrected.5)Toreducethepossibilityofchippingandcracks,minimizevibrationtochipsstoredinabulkcase.
6)Thedischargepressuremustbeadjustedtothepartsize.Verifythepressureduringsetuptoavoidfracturingorcrackingthechipscapacitors.
ResinMold
1)Ifalargeamountofresinisusedformoldingthechip,cracksmayoccurduetocontractionstressduringcuring.Toavoidsuchcracks,usealowshrinkageresin.
2)ealowmoistureabsorptionresin.
3)Checkcarefullythattheresindoesnotgenerateadecompositiongasorreactiongasduringthecuringprocessorduringnormalstorage.Suchgasesmaycrackthechipcapacitorordamagethedeviceitself.
Multilayer Ceramic Chip CapacitorsSurface Mounting Information
SolderingMethod
1)Ceramiciseasilydamagedbyrapidheatingorcooling.Ifsomeheatshockisunavoidable,preheatenoughtolimitthetemperaturedifference(DeltaT)towithin130degreeCelsius.
2)Theproductsize1.0 0.5mmto3.2 1.6mmcanbeusedinreflowandwavesoldering,andtheproductsizeofover3.2 2.5mm,0.6 0.3mm,andcapacitorarrayscanbeusedinreflow.
Circuitshortageandsmokingcanbecreatedbyusingcapacitorswhichareusedneglectingtheabovecaution.3)Pleaseseeourrecommendedsolderingconditions.
Pleasecontactusifyouuseleadfreesolderbecausethepeaktemperatureofleadfreeisdifferentfromnon-leadfree.
Soderingiron
1)Temperatureofironchip2)Wattage
3)Tipshapeofsolderingiron4)SolderingTime
380°Cmax.80Wmax. 3.0mmmax.3sec.max.
5)Cautions
a)Pre-heatingisnecessaryRapidheatingmustbeavoided.
DeltaT 150°C.
b)Avoiddirecttouchingtocapacitors.
c)Avoidrapidcoolingaftersoldering.Naturalcoolingisrecommended.
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