Philips QMP rev 1.2(54701)

QUALITY MANAGEMENT PLAN

PHILIPS DISPALY PRODUCTS

Family HP.XH2

AJ6B

3138 158 54701(Scaler Board) 3138 158 54581(Scaler Board) 3138 158 55451(Scaler Board) 3138 158 54161(Control Board) 3138 158 54191(Control Board)

APPROVALS

___________________________________ (Name) CTQ Supplier Quality Manager BU-Monitor PHILIPS

___________________________________ (Name) CTQ Manager BU-Monitor PHILIPS

___________________________________ (Name) BU-Monitor PHILPS

___________________________________ (Name) General Manager TSMT Elec BU-Monitor PHILPS

___________________________________ (Name)

BU-Monitor PHILPS

Ruiqi Tang __________________________ (Name) Joint Quality Engineer TSMT Elec. Honry Wang ________________________ (Name) Quality Department Manager TSMT Elec. Bill_Chang __________________________ (Name) Engineering Manager TSMT Elec. Gino-Wen __________________________ (Name)

___________________________________ (Name)

EXECUTIVE SUMMARY

Supplier to summarize the following information:

? Description of PCBA operation

? Describe major differences in Assembly Process ? Discuss the factory audit results of Supplier’s factory(s)

? Discuss if Supplier has met all PHILIPS BCUM CTQ expectations/requirements ? Risks to PHILIPS if this PCBA is released for use

? Quality concerns that might impact Delivery Quality and/or FCR ? Recommendation to management whether or not to proceed with RTS

QUALITY MANAGEMENT PLAN (QMP)

Documentation Revision History

Revision A Release Date Reporting from Remarks (Philips RTS Date:) QMP sign off

Note: The purpose of this agreement is to document the part number specific PHILIPS quality requirements that are not covered in the Terms and Conditions outlined in the Master Contract Agreement and the Quality Agreement.

CONTENTS

1. QUALITY GOALS 1.1. TOTAL DELIVERY QUALITY DPPM 1.2. CPK (PROCESS CAPABILITY INDEX) 1.3. AFR (ANNUAL FAILURE RATE) 1.4. SUPPLIER INTERNAL QUALITY

2. GENERAL 2.1. MANUFACTURING LOCATIONS 2.2. CRITICAL CONTACTS

2.3. QUALITY SYSTEMS AND PROCESS AUDITS 2.4. JQE PROGRAM

2.5. DIFFERENCE IN CURRENT PROCESS VS NEW PROCESS

3. QUALIFICATION 3.1. CRITICAL COMPONENTS 3.2. CRITICAL PARAMETERS

3.3. PRODUCT PROCESS FLOWS

3.4. GAUGE REPEATABILITY AND REPRODUCIBILITY 3.5. PROCESS CAPABILITY (CP/CPK)

3.6. FAILURE MODE EFFECT ANALYSIS (FMEA) 3.7. FIRST ARTICLE INSPECTION

4. CHANGE MANAGEMENT 4.1. ENGINEERING/PROCESS CHANGE NOTIFICATION

5. QUALITY CONTROL 5.1. INCOMING QUALITY CONTROL (IQC) 5.2. IN PROCESS QUALITY CONTROL 5.3. AGING TEST (BURN IN)

5.4. PQE/ONGOING RELIABILITY TEST (ORT) 5.5. OUT GOING QUALITY (OQC) 5.6. OUT OF BOX AUDIT (OBA)

5.7. LINE STOP AND STOP SHIP CRITERIA

5.8. CLOSED LOOP CORRECTIVE ACTION PROCESS 5.9. REWORK/SCREENING OF PRODUCT

6. NEW PRODUCT READINESS REVIEW

6.1. REQUIREMENTS

7. REPORTING 7.1. SUPPLIER

7.1.1. QMP REPORTING

7.1.2. MINIMUM REQUIREMENTS 7.1.3. LIST OF REPORT ITEMS 7.2. PHILIPS PAC FAILURE REPORT

8. EXCEPTIONS TO PHILIPS REQUIREMENTS 8.1. DETAILS

1. QUALITY GOALS

During the initial stage (within 6 weeks) for each family, the Line Reject will be 2200 DPPM, the Out-going and Sourcing inspection target will be 900 DPPM.

1.1. Total Delivery Quality DPPM Goal:

Item Y2002 Q1 Y2002 Q2 Y2002 Q3 Y2002 Q4

Line Reject DPPM 2200 2050 1900 1800 (Philips – PA Sites)

Sourcing Inspection DPPM 900 700 500 400 (Philips – PCBA)

1.2. CPK Goal

Reject

Minimum

Goal

1.3. AFR Goal (Annual Failure Rate Verified Only)

Goal

1.4. SUPPLIER INTERNAL QUALITY GOAL

1st Quarter 1.4.1. Soldering DPPM

1.4.1.1. Reflow Oven 25 20 15 101.4.1.2. Wave solder 25 20 15 10

1.4.2. ICT In-Circuit Test(%) 99.5 99.6 99.7 99.8

1.4.3. Functional Test(%) 0.5 0.4 0.3 0.2

1.4.4. Out-going Quality – By Line Weekly

1.4.4.1. Lot reject rate(%) 2 1.8 1.6 1.51.4.4.2. Defect rate DPPM 900 700 500 400

<1.0 1.0-1.32 = > 1.33 0.8 % nd Quarter 3rd Quarter

th

Quarter

2 4

2. GENERAL

2.1. MANUFACTURING LOCATIONS (appendix A)

2.1.1. The supplier will complete the Manufacturing Location Matrix 1-WEEK after trial run

(see Appendix A). The Philips SQA must approve the Manufacturing Location Matrix before the manufacturing of any Philips product. Any changes to the matrix will require 90-day prior notification to the Philips SQA organization.

2.2. CRITICAL CONTACTS (appendix B)

2.2.1. The supplier will complete the Critical Contacts List 1-WEEK after trial run (see

Appendix B). The Philips SQA will approve any changes to the Critical Contacts List before the implementation is made.

2.3. QUALITY SYSTEMS AND PROCESS AUDITS (APPENDICES B1 , B2)

2.3.1. Factory Audit Results

2.3.1.1. As part of the Supplier Selection process the Philips LSQA will perform a

Quality Systems Audit and a Quality Process Audit (QPA will be completed Prior to RTS). An audit report(s) will be attached in this section of the QMP Prior to RTS.

2.3.2. Major Sub Assembly Suppliers (Appendix B3)

2.3.2.1. The supplier will identify all major sub-assembly manufacturing facilities and

will report to the Philips SQA the audit schedules/results of the audits Prior to RTS.

N/A

2.4. JQE PROGRAM (Joint Quality Engineer)

2.4.1. Supplier will support the JQE program. Supplier JQE’s will be staffed in all Supplier

manufacturing sites.

2.4.2. JQE ACTION PLANS (appendix C)

2.4.2.1. The JQE will develop SQA Action plan, the JQE action plan will be submitted

and approved by Philips SQA. These plans will contain the duties in which the JQE perform. The Supplier will report on the JQE activities on a Weekly basis.

2.5. DIFFERENCE IN CURRENT PROCESS VS NEW PROCESS.

2.5.1. The supplier will provide a summary of the current process vs. this new process. It

will be attached in this QMP 1-Week after the trial run.

3. QUALIFICATION 3.1. CRITICAL COMPONENTS (appendix D)

3.1.1. Critical Components Quality Monitoring (Appendices I & L)

3.1.1.1. Supplier will report quality performance of all critical components at incoming

inspection and in process. A corrective action plan will be required for those components that are producing a negative trend and/or yield result greater than the established quality goal.

3.2. CRITICAL PARAMETERS

3.2.1. Critical Parameter Listing (appendix E)

3.2.1.1. Philips and the Supplier will identify the critical parameters for the specific

product. The Supplier will provide a critical parameter test plan to the Philips SQA for approval Prior to RTS. The following are the minimum critical parameters that will be monitored see appendix E.

? Functional Test

o B+ Voltage

o HV (High Voltage)

o HV Shut Down (High Voltage)

3.2.2. Critical Parameters Quality Monitoring (appendix E)

3.2.2.1. These product performance parameters are controlled once process

capability has been established. Reference “Process Capability” section for requirements. Quality information will be submitted to the Philips SQA on a Weekly basis, see appendix E). Statistical variations will be reported, details include out of control situation, CA/PA responsibility and closure date.

3.3. PRODUCT PROCESS FLOWS

3.3.1. The supplier will provide Philips a detailed product/process flow chart Prior to RTS.

This flow chart will identify all process from receiving inspection to final shipping. The requirements include the following. ? Process flow by station ? Operation performed ? Critical Parameters ? Material Used ? Inspection Checkpoints ? Control Points/Specifications ? Tools and/or Equipment ? Inspection Methods ? Sampling plan or SPC type ? Process owner ? Process control reaction procedures

3.3.2. Changes to the Product Process Flows

3.3.2.1. All Changes to the Product Process Flows will be revision controlled and

processed via the EC/CP/FN control list (appendix G). Changes cannot be made without Philips approval and notification.

APPENDIX a – Process Flow

3.4. GAUGE REPEATABILITY AND REPRODUCIBILITY (appendix F)

Supplier will submit a listing of all gauges that will be controlled through the GR&R process Prior to RTS. Gauge R&R for manufacturing-measuring equipment will be performed prior to the follow occurrences. Raw data and summary results will be submitted to the Philips SQA prior to implementation.

N/A

New product introduction

Major changes to line configuration or equipment New line introductions

Statistical capability beyond control limits

The gauge will be removed from the process if the results of the Gauge R&R are greater than 30%. The GR&R worksheets and results will be reported to Philips SQA prior to RTS (product release) at Philips. ? R&R < 10% ? Acceptable. tolerance ? 10% > R&R =< 30% ? Conditionally acceptable dependent on importance of

application cost of gauge, engineering approval, etc. tolerance

? R&R > 30% ? Not acceptable. Repair, retrain, or use other

measurements means. tolerance

GR&R studies should be used to assist in determining the precision, major problems, amount of variation, and acceptability of all gauging systems used throughout the manufacturing process. It will also furnish a comparison of the accuracy of one measuring device against another.

Engineers may believe that they have an applicable and functional gauging system based on the perceived accuracy or design, but often the accuracy of the gauge is wrong because a major portion of the specification tolerance is lost to measurement errors, incorrect usage, or equipment variation.

Every piece of measuring equipment is subject to a certain amount of variation. It is then in our best interest to conduct a study of the measuring equipment to determine if it is both \

? ? ? ?

1. accuracy, 2. stability,

3. repeatability,

4. reproducibility.

The first two factors (accuracy and stability) are usually quite small, so we really do not need to concern ourselves with them. The opposite is true for the last two factors (repeatability and reproducibility). These are generally large, will cause problems with acceptance or rejection of product, and can be analyzed rather easily.

Note: May need to consider all 4 factors first time through. This will be a mutual decision by Philips SQA and supplier.

Gauge System Error - Is the combination of accuracy, repeatability, reproducibility and stability.

Percent Repeatability and Reproducibility (% R&R) - Is the percentage of the specification tolerance that is lost to gauging error.

3.5. PROCESS CAPABILITY (CP/CPK) (appendix E)

3.5.1.1. Equipment and processes will be qualified using sound statistical techniques.

CPK values will meet the goal as noted below. Processes that are below <1.0 CPK will be rejected for use in the manufacturing product for Philips without

approval from the Philips SQA. For those processes that meet the 1.0-1.32 CPK minimum a corrective action plan is required will enable the process to meet the stated goal and the appropriate quality process controls will be in place during the CA implementation period.

3.6. FMEA (appendix E1)

3.6.1. FMEA: Process FMEA’s will be conducted to identify high-risk areas. Once high-risk

areas are identified a corrective action plans must be instituted to ensure risks are resolved. FMEA’s will be sent to the Philips SQA Prior to Mass Production of each manufacturing facility. Additional manufacturing lines that are not “copy exact” will require a process FMEA.

N/A

3.7. FIRST ARTICLE INSPECTION ( FAI )

3.7.1. The supplier will provide a test plan for IQC of critical components and product level

inspection Prior to RTS. Suppliers are required to perform a First Article Inspection (FAI) to assure all products meet design-engineering parameters. FAI will be completed based on the following:

? New Product Introduction

? New Manufacturing facility/Site

? EC/CP/FN as required by the Philips LSQA on critical components ? As requested by the Philips LSQA ? Changes to Critical Components ? New Sub-Supplier/Sub-Supplier Site ? New tool/mold/dies

? Major tooling or equipment refurbishment ? Relocated tooling or production equipment

? Revised or modified process flow or production sequence ? Changes in materials or material sources

? Product following a stop-ship order due to a quality issue

First Article Inspection may include verification of mechanical dimensions, chemical finishes, solder workmanship verification, configuration, and test data. A First Article inspection report is generated that defines the Supplier, part number, and revision.

Included in this report is a list of inspection characteristics to be verified, either visually or through the use of standard inspection tools. An inspector or quality engineer will perform the First Article. Final approval of the success of the First Article Inspection will be the responsibility of the Philips SQA. The supplier will submit FAI data to the Philips SQA for approval Prior to RTS. Approval will be given from the Philips SQA prior to the implementation.

3.7.2. IQC Data for Critical Components (Appendix E3)

3.7.2.1. The purpose of the FAI is to verify compliance of a part produced in a normal

production environment to the Supplier’s design specifications. Supplier to provide documented proof that critical components were inspected and meet Supplier design specifications.

3.7.3. Test Data at the Product Level (appendix E2)

3.7.3.1. FAI will be performed using the latest revision design and product

specification. FAI will be performed at the Supplier’s site or equivalent Philips approved configuration center. Each Manufacturing site will require product level

st

FAI. Supplier to use validated test procedures/software to provide data that 1 pilot lot meets product specification.

4. CHANGE MANAGEMENT 4.1. ENGINEERING/PROCESS CHANGE NOTIFICATION (appendix G)

4.1.1. The supplier will submit EC/CP/FN to Philips PAC Engineer and LSQA that affect

Internal changes to improve yields. All appropriate documentation will be provided to ensure the change is qualified for implementation. The supplier will submit an EC/CP/FN log on a Weekly basis giving visibility to the proposed changes see appendix G.

5. QUALITY CONTROL 5.1. IQC/Incoming Quality Control (appendices H, I)

5.1.1. The supplier will provide for incoming quality controls for Critical Component.

5.1.1.1. The Supplier will utilize sound statistical techniques at IQC. The supplier will

provide a matrix that indicates the critical components and sampling plan criteria Prior to RTS see appendix H. The Philips SQA must give prior approval of IQC plan. Any changes to the plan will be processed via EC/CP/FN process. On a Weekly basis the supplier will submit an IQC report that details the product performance as compared to the goal. In instances where components are beyond the set goal containment and corrective action will be completed see appendix I.

5.2. In-Process (appendices J, K, L)

5.2.1. The Supplier will provide the Philips SQA with a listing of critical inspection

checkpoints. Only sound statistical techniques will be utilized. Statistical Process Control (SPC) will be used wherever applicable. The supplier will submit an SPC test plan that includes containment, corrective action if the trend is negative and/or out of goal. Within the listing of checkpoints the supplier will provide the control limits and set goals by quarter. The Philips SQA prior to implementation must approve this information. The Philips SQA must also approve any changes to the in-process

controls via EC/CP/FN process. In instances where in-process goals are beyond the set goal containment and corrective action will be completed. The Supplier will report in-process results Weekly & Monthly and critical component results on a Weekly basis see appendices J, K, L.

5.3. PQE/ONGOING RELIABILITY TEST (appendix M)

5.3.1. The Supplier will develop a PQE process that will meet the following requirements. A

test plan will be provided to the Philips SQA prior to RTS. A report of the results will be submitted to the Philips SQA on a Monthly basis on appendix M. The supplier will measure all SPC parameters before and after reliability testing. Supplier will also provide acceptable drift limits for each of the test parameters.

N/A

TEST

MINIMUM FREQUENCY, SAMPLE SIZE

? PQE Test 25/day/line/shift ? ESD Testing 1/week/line

5.4. OQC /OUT GOING QUALITY CONTROL (appendices N, O)

5.4.1. The Supplier will provide a quality plan for out going quality inspection to the Philips

SQA Prior to RTS. The Philips SQA will approve the plan prior to implementation. Any change to the OQC plan must be processed via the EN/CP/FN change request. This will include critical inspection points, sampling plan, out of control procedures, limits of lot reject rates and DPPM levels. The supplier will provide containment and corrective action for critical out of control situations. A Weekly and Monthly report will be generated and submitted to the Philips SQA appendices N, O.

5.5. OBA/OUT OF BOX AUDIT (appendix P)

5.5.1. The Supplier will provide a quality plan for out of box audits to the Philips SQA Prior

to RTS. The Philips SQA will approve the plan prior to implementation. Any change to the OBA plan must be processed via the EC/CP/FN change request. The product sampled will be from finished goods inventory. The following are the requirements: ? Inspection Characteristics ? Packaging Inspection ? Contents Inspections

? All Test Measurements performed in OQC ? Sample Size is 1 piece per lot

The Supplier will provide the Philips SQA a summary report of the OBA data on a

Weekly basis see appendix P. In cases where the performance is beyond the set goal the supplier will implement containment, corrective and preventive action.

5.6. LINE STOP AND STOP SHIP CRITERIA (appendix Q)

The supplier will provide the Philips SQA their Line Stop and Stop Ship processes for approval Prior to RTS. Only after Philips has approved it can it be implemented. Changes to the process will be requested through an EC/CP/FN. When the

procedures are invoked a summary will be submitted to the Philips SQA on a Weekly basis see appendix Q. Containment CA and PA requirements apply. The Philips SQA will be immediately notified of line stop or excessive line down situations. N/A

5.7. CLOSED LOOP CORRECTIVE ACTION PROCESS (appendix R, S)

The Supplier will use the CLCA approach to resolve all problem issues including failure to meet monthly DPPM goals, Purges, OBA failures, and ORT failures. All CLCA issues will be documented in the CLCA log and provided by the Philips SQA on a Weekly basis see appendix R. The supplier will use the standard 7/8D format (steps noted below, see

appendix S). All Philips CLCA timelines will be adhered to as noted below. For high priority failures and/or that are initiated by the SQA the Supplier should provide 7/8D to Philips SQA.

N/A Timelines

? Problem identification and action plan within 48 hours of problem notification. ? Containment plan within 24 hours of problem identification.

? Corrective action plan within 48 hours of root cause identification. ? Problem closure verification within 24 hours of corrective action

CLCA Process

Issue description Containment Root Cause

Corrective action Preventive Action Verification

Effectiveness Review

5.8. REWORK/SCREENING OF PRODUCT

The supplier will provide for rework/screening operations at each of the Philips Manufacturing locations. The Philips SQA must approve rework/screening operations prior to use.

Rework and screening procedures will be documented and validated to ensure product form, fit and function is maintained. The supplier will submit any rework and screening

process/procedures along with validation documentation to the Philips SQA for approval before implementation.

6. NEW PRODUCT READINESS REVIEW (appendix T)

6.1. Each Supplier manufacturing line will require a New Products Readiness Review Prior to

Mass Production. Any deficiencies that are found during the review will require the supplier to develop a corrective action plan, date to complete and person responsible. All CA’s will

be closed and approved by the SQA prior to mass production.

6.2. New Manufacturing Lines

6.2.1. The supplier will provide 30-day notification to the Philips SQA of any new

manufacturing line that will be implemented. An NPRR will be require and closed Prior to Mass Production.

7. REPORTING 7.1. SUPPLIER

7.1.1. QMP REPORTING

7.1.1.1. The supplier will provide the Philips SQA the appropriate reports as outline in

this QMP.

? Weekly reports will be submitted no later than Tuesday for the Prior Week. ? Monthly report will be submitted no later that the First Week for the Prior

Month.

? Other updates such as Critical Contacts will be provided to the Philips SQA

when changes occur

7.2. PHILIPS PAC FAILURE REPORT

7.2.1. The Philips SQA will provide Delivery Quality performance reporting to the Supplier

on a Monthly basis. The following reports will be generated. ? PIC Chungli

? PAC Suzhou\\Dalinsan\\PMJ\\PMMH

N/A

7.2.2 . Each subcontractor should provide CAR for above line reject by weekly and monthly for Quality Continually Improvement. APPENDIX f – Report format

N/A

8. EXCEPTIONS TO PHILIPS REQUIREMENTS

8.1.1. Any exceptions to this QMP will be noted in this section.

9. GLOSSARY OF ACRONYMS

AFR CA CP CTQ

Annualized Failure Rate Corrective Action Change Proposal

Component Technology & Quality

BCUM Business Creation Unit Monitors

CLCA Closed Loop Corrective Action DPPM Defect Parts Per Million EC FAI FN

Engineering Change First Article Inspection Factory Notice

FMEA Failure Mode Effect Analysis FCR Field Call Rate

GR&R Gauge Repeatability and Reproducibility IQC IP JQE OBA OQC

Incoming Quality Control Initial Purchasing Joint Quality Engineer Out of Box Audit Outgoing Quality Control

LSQA Local Supplier Quality Assurance

ORT Ongoing Reliability Test MP Mass Production

NPRR New Product Readiness Review PA PQE QMP QPA QSA SPC SQA

Preventive Action

Product Quality Evaluation Quality Management Plan Quality Process Audit Quality System Audit Statistical Process Control Supplier Quality Assurance

PCBA Printed Circuit Board Assembly

Appendices

APPENDIX A

APPENDIX a Process Flow Supplier Manufacturing Site Locations

APPENDIX B

APPENDIX C

APPENDIX D

APPENDIX E

APPENDIX E1

APPENDIX E2

APPENDIX E3

APPENDIX F

APPENDIX f – Quality Report format

Critical Contact Matrix

JQE Audit Report & Schedule

Critical Components

Statistical Data for Key Parameters

Process FMEA Product FAI Critical Components FAI List of Gauges/ Gauge R&R

APPENDIX G

APPENDIX H

APPENDIX I

APPENDIX J

APPENDIX K

APPENDIX L

APPENDIX M

APPENDIX N

APPENDIX O

APPENDIX P

APPENDIX Q

APPENDIX R

EC/CP/FN Log Sheet

IQC Sampling Plan Matrix

Critical Component Incoming Quality Report

Weekly In-Process Quality Report

Monthly In-Process Quality Report

In Process Critical Component Quality Status

ORT Monthly Quality Report

Weekly Out-Going Quality Report

Monthly Out-Going Quality Report

OBA Weekly Report

Line Stop & Stop Ship Report

CLCA Log

APPENDIX S

APPENDIX T

CLCA Manual Form

New Product Readiness Checklist

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