可见光音频传输系统毕业设计说明书 - 图文

桂林电子科技大学毕业设计（论文）报告用纸 第 I 页 共 IV页

编号：

毕业设计说明书

题 目： 可见光音频传输系统 院 （系）： 信息与通信学院 专 业： 通信工程

题目类型： 理论研究 实验研究 √ 工程设计 工程技术研究 软件开发

桂林电子科技大学毕业设计（论文）报告用纸 第 II 页 共 IV页

摘 要

可见光通信技术，是利用荧光灯或发光二极管等发出的肉眼看不到的高速明暗闪烁信号来传输信息的，将高速因特网的电线装置连接在照明装置上，插入电源插头即可使用。利用这种技术做成的系统能够覆盖室内灯光达到的范围，电脑不需要电线连接，因而具有广泛的开发前景。

本次设计使音频信号通过NE555调制电路调制，用白色LED灯进行发射，转换为调频信号，接收端使用光敏二极管进行接收，首先进行滤波，然后用LM318运算放大器进行放大，并用NE564进行解调，被还原的信号通过TDA2822进行音频信号的放大并输出到喇叭，还原出音频信号，从而完成信息的传输。

关键词：可见光通信；调频；锁相环解调；

桂林电子科技大学毕业设计（论文）报告用纸 第 III 页 共 IV页

Abstract

Visible optical communication technology, using fluorescent or light emitting diode is the issue of the invisible to the naked eye twinkle light and shade to transmission of information signal.High speed Internet wire device is connected with the lighting device,Insert the power plug to use.Use of this technique made the system can cover the interior lighting reach, computer does not need to be electrically connected, so it has a wide prospect of development.

This design make audio signal through the NE555 modulation circuit modulation.With white LED lights for launch.Converts the frequency modulated signal,The receiving end photosensitive diode to receive use,The first filter, and thenLM318 operational amplifier for amplifying，and NE564 for demodulation,The signal through the TDA2822 reduction for audio signal amplifier and the output to horn,The audio signal reduction so as to complete the information transmission.

Key words: Visible optical communication;

桂林电子科技大学毕业设计（论文）报告用纸 第 IV 页 共 IV页

目 录

引言 ....................................................................................................................... 1 1绪论 .................................................................................................................... 1

1.1可见光音频传输研究现状 .................................................................................................. 1 1.2课题研究方向 ...................................................................................................................... 2

2方案论证 ............................................................................................................ 3 2.1运放的选择 ......................................................................................................... 3

2.1.1方案一采用LM318 .......................................................................................................... 3 2.1.2方案二采用三极管 ........................................................................................................... 3

3系统设计制作 .................................................................................................... 4

3.1系统框图 .............................................................................................................................. 4 3.2电路设计 .............................................................................................................................. 4 3.2.1稳压部分 ........................................................................................................................... 4 3.2.2 NE555FM调制部分 ......................................................................................................... 5 3.2.3 LED灯恒流驱动FM信号发射电路 .............................................................................. 8 3.2.4光敏接收装置及滤波器 ................................................................................................... 9 3.2.5运算放大器 ..................................................................................................................... 10 3.2.6 NE564解调 ..................................................................................................................... 11 3.2.7 音频信号放大部分 ........................................................................................................ 15 3.3 PCB设计 .......................................................................................................... 17 3.3.1 PCB设计软Protell99SE ................................................................................................ 17 3.3.2 PCB设计流程 ................................................................................................................ 18 3.4硬件制作 .......................................................................................................... 19 3.4.1铜板的整修 ..................................................................................................................... 19 3.4.2热转印 ............................................................................................................................. 20 3.4.3腐蚀铜板 ......................................................................................................................... 20 3.4.4打孔 ................................................................................................................................. 20 3.4.5焊接 ................................................................................................................................. 20

4硬件电路检查 .................................................................................................. 20 5硬件电路调试过程 .......................................................................................... 21 5.1硬件电路调试 ................................................................................................... 21

5.1.1直观检查 ......................................................................................................................... 21 5.1.2关键位置检查 ................................................................................................................. 21 5.1.3不安装重要芯片情况下的通电检查 ............................................................................. 21 5.1.4装上芯片后的检查 ......................................................................................................... 21

桂林电子科技大学毕业设计（论文）报告用纸 第 V 页 共 IV页

5.1.5发射部分整体调试 ......................................................................................................... 21 5.1.6接收部分整体调试 ......................................................................................................... 22 5.2电路调试中的问题及修改 .................................................................................. 22 5.2.1发光二极管的修改 ......................................................................................................... 22 5.2.2 LM339比较器的删减 .................................................................................................... 22 5.3调试完成后的结果 ............................................................................................ 22

6总结 .................................................................................................................. 26 谢 辞 ................................................................................................................. 27 参考文献 ............................................................................................................. 28 附 录 ................................................................................................................. 29

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