液晶显示屏12864资料

住址: 407台中市中清路163號

華凌光電股份有限公司

WEB: http://www.winstar.com.tw

E-mail: winstar@winstar.com.tw

Tel:886-4-24262208 Fax：886-4-24262207

Winstar Display Co., LTD

No.163 Chung Ching RD., Taichune, Taiwan, R.O.C

SPECIFICATION

CUSTOMER : MODULE NO.:

WG12864A-YYH-V#

APPROVED BY: ( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA: SALES BY APPROVED BY CHECKED BY PREPARED BY ISSUED DATE:

Page 1 of 25 WS-EP-008 10(A)

Winstar Display Co., LTD MODLE NO： 華凌光電股份有限公司 RECORDS OF REVISION VERSION DATE DOC. FIRST ISSUE REVISED PAGE NO. SUMMARY 0 2006-2-17 First issue

Page 2 of 25 WS-EP-008 10(A)

Contents

1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Description

8.Contour Drawing & Block Diagram 9. Timing Characteristics 10.Display Control Instruction 11.Detailed Explanation 12.Reliability

13.Backlight Information 14. Inspection specification

15. Material List of Components for RoHs

Page 3 of 25 WS-EP-008 10(A)

1.Module Classification Information W G 1 2 8 6 4 A－Y Y H－ V# ? ? ? ? ? ? ? ? ? ? ? ? ?

Brand：WINSTAR DISPLAY CORPORATION

Display Type：H→Character Type, G→Graphic Type Display Font：Character 128 words, 64Lines. Model serials no.

Backlight Type： N→Without backlight

A→LED, Amber B→EL, Blue green

R→LED, Red D→EL, Green

O→LED, Orange W→EL, White

G→LED, Green F→CCFL, White

Y→LED, Yellow Green

? LCD Mode： B→TN Positive, Gray T→FSTN Negative

N→TN Negative,

G→STN Positive, Gray

Y→STN Positive, Yellow Green M→STN Negative, Blue F→FSTN Positive

? LCD Polarizer A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00

Type/ Temperature D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00 range/ View G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00 direction

J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00 B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00 E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00

? Special Code V : Build in Negative Voltage ;

# : LEAD-FREE;

Page 4 of 25 WS-EP-008 10(A)

2.Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD module.

(3)Don’t disassemble the LCM.

(4)Don’t operate it above the absolute maximum rating. (5)Don’t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals.

(7)Storage: please storage in anti-static electricity container and clean environment.

3.General Specification Item Number of Characters Module dimension View area Active area Dot size Dot pitch LCD type Duty View direction Backlight Type

Page 5 of 25 WS-EP-008 10(A)

Dimension 128 characters x 64 Lines 93.0 x 70.0 x 13.6(MAX) 72.0 x 40.0 66.52 x 33.24 0.48 x 0.48 0.52 x 0.52 STN, Positive, Transflective, Yellow Green 1/64 6 o’clock LED, Yellow Green Unit － mm mm mm mm mm

4.Absolute Maximum Ratings Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Supply Voltage For LCD

Symbol TOP TST VI VDD VDD-VLCD VDD-VOUT Min -20 -30 0 0 0 － Typ － － － － － － Max +70 +80 VDD 67 16.7 -10 Unit ℃ ℃ V V V V 5.Electrical Characteristics Item Supply Voltage For Logic Symbol VDD-VSS Condition － Ta=-20℃ Supply Voltage For LCD VDD-V0 Ta=25℃ Ta=+70℃ Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current

VIH VIL VOH VOL IDD － － － － － Min 4.5 － － 7.6 2.0 0 2.4 － － Typ 5.0 － 9.1 － － － － － 18 Max 5.5 10.6 － － VDD 0.8 VDD 0.4 － Unit V V V V V V V V mA Page 6 of 25 WS-EP-008 10(A)

6.Optical Characteristics Item View Angle Contrast Ratio Response Time

Symbol (V)θ (H)φ CR T rise T fall Condition CR≧2 CR≧2 － － － Min 20 -30 － － － Typ － － 5 200 200 Max 40 30 － 300 300 Unit deg deg － ms ms Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )

Intensity100％Selected WaveNon-selected WaveNon-selectedConitionIntensity10％Selected ConitionNon-selectedConitionCr MaxCr = Lon / Loff100％90％VopDriving Voltage(V)TrTf[positive type]

[positive type]

Conditions : Operating Voltage : Vop

Frame Frequency : 64 HZ

Viewing Angle(θ，φ) : 0°， 0° Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR≧2)

θbθfφ= 180°θlθrφ= 27°0φ= 90°

φ= 0°

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7.Interface Description

Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

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Symbol GND VDD Vo D/I R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS1 CS2 RST Vout A K Level 0V 5.0V H/L H/L H H/L H/L H/L H/L H/L H/L H/L H/L H H L － － － Description Ground Supply voltage for logic H: Data , L : Instruction H: Read (MPU←Module) , L: Write (MPU→Module) Enable signal Data bit 0 Data bit 1 Data bit 2 Data bit 3 Data bit 4 Data bit 5 Data bit 6 Data bit 7 Select Column 1~ Column 64 Select Column 65~ Column 128 Reset signal Negative Voltage Power Supply for LED backlight ( + ) Power Supply for LED backlight ( - ) (Variable) Operating voltage for LCD 8.Contour Drawing &Block Diagram 7.010.513.249.915.018.3870.00.550.240.0(VA)33.24(AA)K4-1.0 PTH2020-1.0 PTH1.8P2.54*19=48.2688.015.0814.065.0A32.4628.02.593.00.580.072.0(VA)66.52(AA)1.513.6 MAX9.014.02.52.54-2.5 PTH4-6.5 PADLED B/L1.61234567891011121314151617181920VssVddVoD/IR/WEDB0DB1DB2DB3DB4DB5DB6DB7CS1CS2RESVoutAK0.520.48The non-specified tolerance of dimension is 0.3mm.0.520.48DOT SIZELED B/L Drive Method1.Drive from A,K KS0107Com1~64Com DriverR128X64 DOTKS0108Seg1~64KS0108Seg65~128AKB/LFR,M,CL,CLK1,CLK22.Drive from pin19, pin20RRBias andPower CircuitSeg DriverD/IR/WEDB0~DB7CS1CS2RESSeg DriverAB/LKMPU80 seriesor68 seriesVddVoVssLCMVR10K~20K(Will never get Vee output from pin19)3.Drive from Vdd,VssRN.V.GeneratorVoutAB/LKLCM(Contrast performance may go down.)External contrast adjustment.

Page 9 of 25 WS-EP-008 10(A)

9.Timing Characteristics MPU Interface (T=25℃, VDD=+5.0V±0.5)

Characteristic E cycle E high level width E low level width E rise time E tall time Address set-up time Address hold time Data set-up time Data delay time Data hold time (write) Data hold time (read) Symbol tcyc twhE twlE tr tf tas tah tdsw tddr tdhw tdhr Min 1000 450 450 － － 140 10 200 － 10 20 Typ － － － － － － － － － － － Max － － － 25 25 － － － 320 － － Unit ns ns ns ns ns ns ns ns ns ns ns tcyc2.0V0.8VtwIEtrtastastwhEtahtah2.0VEtfR/WCS1,CS2,D/IDB0 to DB70.8VtdswtdhwMPU Write Timing

tcyctwIEE2.0V0.8VtwhEtr2.0V0.8Vtftahtah2.0VR/WtastasCS1,CS2,D/IDB0 to DB70.8VtddrtdhrMPU Read Timing

Page 10 of 25 WS-EP-008 10(A)

10.Display Control Instruction The display control instructions control the internal state of the KS0108B. Instruction is received

from MPU to KS0108B for the display control. The following table shows various instructions Instruction D/I R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function Controls the display on or Display ON/OFF off. Internal status and 0 0 0 0 1 1 1 1 1 0/1 display RAM data are not affected. 0:OFF, 1:ON Sets the Y address in the Y address counter. Sets the X address at the X address register. Indicates the display data 0 0 1 1 Display start line(0~63) RAM displayed at the top of the screen. Read status. B R 0 ON/OFF E S E T 0 0 0 0 BUSY 0:Ready 1:In operation ON/OFF 0:Display ON 1:Display OFF RESET 0:Normal 1:Reset Writes data (DB0:7)into display data RAM. After 1 0 Display Data writing instruction, Y address is increased by 1 automatically. Set Address Set Page (X address) Display Start Line 0 0 0 0 0 1 1 0 Y address (0~63) 1 1 1 Page (0 ~7) Status Read 0 1 U S Y Write Display Data Read Display Data Reads data (DB0:7) from 1 1 Display Data display data RAM to the data bus. Page 11 of 25 WS-EP-008 10(A)

11.Detailed Explanation Display On/Off

0 0 0 0 1 1 1 1 1 D

The display data appears when D is and disappears when D is 0. Though the data is not on the screen with D = 0, it remains in the display data RAM. Therefore, you can make it appear by changing D = 0 into D = 1.

Display Start Line

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 1 A A A A A A

Z address AAAAAA ( binary ) of the display data RAM is set in the display start line register

and displayed at the top of the screen. Figure 2. shows examples of display ( 1/64 duty cycle ) when the start line = 0-3. When the display duty cycle is 1/64 or more ( ex. 1/32, 1/24 etc. ), the data of total line number of LCD screen, from the line specified by display start line instruction, is displayed

Set Page ( X Address )

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 1 1 1 A A A

X address AAA ( binary ) of the display data RAM is set in the X address register. After that,

writing or reading to or from MPU is executed in this specified page until the next page is set. See Figure 1.

Set Y Address

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 A A A A A A

Y address AAAAAA ( binary ) of the display data RAM is set in the Y address counter. After

that, Y address counter is increased by 1 every time the data is written or read to or from MPU.

Status Read

Page 12 of 25 WS-EP-008 10(A)

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

R/W 0 D/I 1 DB7 Busy DB6 0 DB5 DB4 DB3 0 DB2 0 DB1 0 DB0 0 On/Off RESET Busy

When busy is 1, the LSI is executing internal operations. No instruction are accepted

while busy is 1, so you should make sure that busy is 0 before writing the next instruction. ON/OFF

Shows the liquid crystal display condition: on condition or off condition. When on/off is 1, the display is in off condition. When on/off is 0, the display is in on condition

RESET

RESET = 1 shows that the system is being initialized. In this condition, no instructions

except status read can be accepted.

RESET = 0 shows that initializing has system is in the usual operation condition. Write Display Data

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 D D D D D D D D

Writes 8-bit data DDDDDDDD ( binary ) into the display data RAM. The Y address is

increased by 1 automatically. Read Display Data

R/W D/I DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

1 1 D D D D 1 D D D

Reads out 8-bit data DDDDDDDD ( binary ) from the display data RAM. Then Y address is

increased by 1 automatically.

One dummy read is necessary right after the address setting. For details, refer to the

Y Address012page 0616263X = 0DB0toDB7DB0toDB7page 1X = 1DB0toDB7DB0toDB7page 6X = 6page 7X = 7Figure 1. explanation of output register in ―Function of Each Block‖.

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12.Reliability Content of Reliability Test (wide temperature, -20℃~70℃)

Environmental Test Test Item High Temperature storage Low Temperature storage Content of Test Endurance test applying the high storage temperature for a long time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress High Temperature (Voltage & Current) and the thermal stress to the Operation element for a long time. Low Temperature Endurance test applying the electric stress under Operation low temperature for a long time. The module should be allowed to stand at 60℃,90%RH max High Temperature/ For 96hrs under no-load condition excluding the Humidity Operation polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20℃ 25℃ 70℃ Thermal shock resistance 30min 5min 30min 1 cycle Test Condition 80℃ 200hrs -30℃ 200hrs 70℃ 200hrs -20℃ 200hrs 60℃,90%RH 96hrs Note 2 1,2 —— 1 1,2 -20℃/70℃ 10 cycles —— Total fixed amplitude : 15mm Vibration Frequency : Endurance test applying the vibration during 10~55Hz Vibration test 3 transportation and using. One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5kEndurance test applying the electric stress to the Ω Static electricity test —— terminal. CS=100pF 1 time Note1: No dew condensation to be observed.

Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber.

Note3: Vibration test will be conducted to the product itself without putting it in a container.

Page 14 of 25 WS-EP-008 10(A)

13.Backlight Information Specification

PARAMETER Supply Current Supply Voltage SYMBOL MIN ILED V 264 4.0 － 148.8 ─ － TYP 330 4.2 － 186 573 MAX 420 4.4 8 － － UNIT mA V V TEST CONDITION V=4.2V － － Reverse Voltage VR Luminous Intensity Wave Length Life Time Color

IV λp － CD/M2 ILED=330mA nm Hr. ILED=330mA V≦4.6V 100000 － Yellow Green Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).

Page 15 of 25 WS-EP-008 10(A)

14. Inspection specification

NO Item Criterion AQL 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 0.65 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. 01 Electrical Testing 02 Black or white 2.1 White and black spots on display ≦0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE 0.10＜Φ≦0.20 2.5 Acceptable Q TY 2 2.5 Φ≦0.10 Accept no dense 0.20＜Φ≦0.25 1 LCD black 0.25＜Φ 0 spots, white spots, contamination (non-display) 3.2 Line type : (As following drawing) Length Width Acceptable Q TY --- W≦0.02 Accept no dense L≦3.0 0.02＜W≦0.03 2 L≦2.5 0.03＜W≦0.05 --- 0.05＜W As round type If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Φ≦0.20 0.20＜Φ≦0.50 0.50＜Φ≦1.00 1.00＜Φ Total Q TY Acceptable Q TY Accept no dense 3 2 0 3 03 2.5 04 Polarizer bubbles 2.5

Page 16 of 25 WS-EP-008 10(A)

NO 05 Item Scratches Criterion Follow NO.3 LCD black spots, white spots, contamination AQL Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels: z: Chip thickness 06 Chipped glass Z≦1/2t 1/2t＜z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a 2.5 ☉If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack: z: Chip thickness Z≦1/2t 1/2t＜z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip.

Page 17 of 25 WS-EP-008 10(A)

NO Item Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : AQL y: Chip width y≦0.5mm x: Chip length x≦1/8a z: Chip thickness 0 ＜ z ≦ t 6.2.2 Non-conductive portion: 06 Glass crack 2.5 y: Chip width y≦ L x: Chip length x≦1/8a z: Chip thickness 0 ＜ z ≦ t ☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y≦1/3L x: length x ≦ a

Page 18 of 25 WS-EP-008 10(A)

NO 07 Item Criterion AQL 2.5 0.65 2.5 0.65 Cracked glass The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn’t light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB X 08 Backlight elements 09 Bezel 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 10 PCB、COB Y X * Y<=2mm2 2.5 2.5 2.5 0.65 11 Soldering 11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

Page 19 of 25 WS-EP-008 10(A)

NO Item Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet. AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65 12 General appearance

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