rgbw规格书(英文版)

S50RGBX-XX SPECIFICATION

CHIP ARRAY ON TOP SMD TYPE LED

Document No.: SPC/ S50RGBX-XX Model No.: S50RGBX-XX

Description: 5.5x5.0x1.6mm Top SMD Type 4-chips 0.4 Watt Power RGBW Flash Color LED Material: InGaN or AlInGaP Chip Inside Rev. No.: 01

Date: 2014-10-07

S5050 provides the leading Chip on Ceramic type of LED technology for high efficiency solid-state light

ing solutions. It offers excellent uniformity, flexibility and cost efficiency along with compact size and wide range of color selections. All components are produced by packing high-performance LED chips and silicon resin with proprietary phosphors. 1. Features and Benefits

. Ideal for LED lighting application to avoid multi-shadows . Higher heat conductivity for better thermal management

. Provide variable and innovative array LED layout designs and combinations . Reduce the initial development cost and time . High lumen-performance per dollar cost

. Lead free reflow solder compatible with RoHS compliant 2. Applications

. Solid State Lighting

. Indoor/Outdoor/Decoration . Signal Light Engine . Commercial Display . Industrial Light Engine

3. Dimensions and Materials

. Dimensions: 5.5 mm x 5.0 mm x 1.6 mm . Packages: Top SMD

. Capsulated Resin: Silicone Resin with Aluminate Phosphor . Electrodes: Ag Plating

. Chips: Total 4 chips packed in a cavity

3. General Information

S50

RGBX –XX

S50: 5.5x5.0x1.6mm

RGBX: R G B 620-625NM 520-525NM

465-470NM X: W White Color Y 588-593nm

XX: BW Blue White 6000-6800K NW Natural White 3800-4200K WS Warm Sunlight 2700-3000K WT Warm Tone 2400-2600K WL Warm Lighting 2000-2200K

4. Absolute Maximum Ratings Pad Temperature @25℃) Note : Typical CRI for White (2000 K – 6800 K CCT)(Thermal is 80.

ITEM

SYMBOL

ABSOLUTE MAXIMUM RATING

UNIT

*1: Ifp conditi White 0.072 ons: 1/10 Red/Yellow 0.048 Duty Power Dissipation Pd Cycle Green 0.072 & 0.1ms Blue 0.072 for pulse width. D.C Forward Current If 20 *2: Rth test Pulse Forward Current (*1) Ifp 100 conditi on: Mounte Thermal Resistance , Junction-Case (*2) Rθj-c 230 d on PC Reverse Voltage Vr 5 Board FR 4 (pad Operating Temperature Topr - 20~+65 size≥4 0mm2) *3: Storage Temperature Tstg - 40~+100 Reflow method: 1.2mm Soldering Temperature (Reflow) (*3) Tsld max.240 < 5sec MCPC B from body for 5 seconds not exceeding the recommended maximum temperature.

W

mA

mA

℃/W

V

℃

℃

℃

5. Electrical/Optical Characteristics . Forward VoltageColor White Yellow Red Green Blue Vf SYMBOL TEST CONDITIONS If=20 mA If=20 mA If=20 mA If=20 mA If=20 mA

(Thermal Pad Temperature @25℃)MIN. 2.8 1.8 1.8 2.8 2.8 TYP. 3.3 2.0 2.0 3.3 3.3 MAX. 3.6 2.4 2.4 3.6 3.6 UNIT V V V V V

. Reverse CurrentColor White Yellow Red Green Blue IR SYMBOL TEST CONDITIONS VR=5 V VR=5 V VR=5 V VR=5 V VR=5 V

(Thermal Pad Temperature @25℃)MIN. -----TYP. -----MAX. 5 5 5 5 5 UNIT µA µA µA µA µA

. Luminous FluxColor White Yellow Red Green Blue Φv SYMBOL TEST CONDITIONS If=20 mA I

f=20 mA If=20 mA If=20 mA If=20 mA

(Thermal Pad Temperature @25℃)MIN. 5.0 1.0 1.0 3.0 1.0 TYP. 6.0 2.0 2.0 4.0 2.0 MAX. -----UNIT lm lm lm lm lm

. Color Temperature or Dominate WavelengthColor Yellow Red λd Green Blue If=20 mA If=20 mA SYMBOL TEST CONDITIONS If=20 mA If=20 mA

(Thermal Pad Temperature @25℃)MIN. ----TYP. 590 625 520 465 MAX. ----UNIT nm nm nm nm

. Bin Code List For ReferenceItem Bin Code A2 SYMBOL

(Thermal Pad Temperature @25℃)TEST CONDITIONS MIN. MAX. UNIT

1.8 2.0 Vf If=20 mA 2.2 2.4 2.8 Vf If=20 mA 3.0 3.2

2.0 2.2 2.4 2.6 3.0 3.2 3.4

RED Yellow

A3

A4

Forward VoltageBLUE GREEN WHITE

A5

V

B2

B3

B4

B5

3.4

3.6

Note: Measurement tolerance of the forward voltage: ± 0.1V

6. Hue Bin Specification for Yellow、Red、Green、BlueName Code λd MIN (nm) λd MAX (nm)

YL1 YELLOW YL2 HR1 RED HR2 BL5 BLUE BL6 PG2 GREEN PG3

587 590 620 625 460 465 515

590 593 625 630 465 470 520

520

525

7. White Color Temperature Ranks & CIE Color Rank (Refer to CIE 1931 chromaticity diagram) CIE chromaticity coordinates (ANSI Blue White)C.A C1 X 0.3048 0.3130 0.3144 0.3068 0.3068 0.3144 0.3161 0.3093 0.3215 0.3290 0.3290 0.3222 0.3222 0.3290 0.3290 0.3231 0.3371 0.3451 0.3440 0.3366 0.3366 0.3440 0.3429 0.3361 Y 0.3207 0.3290 0.3186 0.3113 0.3113 0.3186 0.3059 0.2993 0.3350 0.3417 0.3300 0.3243 0.3243 0.3300 0.3180 0.3120 0.3490 0.3554 0.3427 0.3369 0.3369 0.3428 0.3307 0.3245 C.A C2 X 0.3028 0.3115 0.3130 0.3048 0.3005 0.3099 0.3115 0.3028 0.3207 0.3290 0.3290 0.3215 0.3196 0.3290 0.3290 0.3207 0.3376 0.3463 0.3451 0.3371 0.3381 0.3480 0.3463 0.3376 Y 0.3304 0.3391 0.3290 0.3207 0.3415 0.3509 0.3391 0.3304 0.3462 0.3538 0.3417 0.3350 0.3602 0.3690 0.3538 0.3462 0.3616 0.3687 0.3554 0.3490 0.3762 0.3840 0.3687 0.3616 C.A C3 X 0.3115 0.3205 0.3213 0.3130 0.3099 0.3196 0.3205 0.3115 0.3290 0.3376 0.3371 0.3290 0.3290 0.3381 0.3376 0.3290 0.3463 0.3551 0.3533 0.3451 0.3480 0.3571 0.3551 0.3463 Y 0.3391 0.3481 0.3373 0.3290 0.3509 0.3602 0.3481 0.3391 0.3538 0.3616 0.3490 0.3417 0.3690 0.3762 0.3616 0.3538 0.3687 0.3760 0.3620 0.3554 0.3840 0.3907 0.3760 0.3687 C.A C4 X 0.3130 0.3213 0.3221 0.3144 0.3144 0.3221 0.3231 0.3161 0.3290 0.3371 0.3366 0.3290 0.3290 0.3366 0.3361 0.3290 0.3451 0.3533 0.3515 0.3440 0.3440 0.3515 0.3495 0.3429 Y 0.3290 0.3373 0.3261 0.3186 0.3186 0.3261 0.3120 0.3059 0.3417 0.3490 0.3369 0.3300 0.3300 0.3369 0.3245 0.3180 0.3554 0.3620 0.3487 0.3427 0.3428 0.3487 0.3339 0.3307

C5

C6

C7

C8

D1

D2

D3

D4

D5

D6

D7

D8

E1

E2

E3

E4

E5

E6

E7

E8

ANSI Blue White Color bin structures

CIE chromaticity coordinates (ANSI Natural white)C.A F1 X 0.3530 0.3615 0.3590 0.3512 0.3512 0.359 0.3567 0.3495 0.367 0.3702 0.3825 0.3783 0.367 0.3783 0.3743 0.364 0.4054 0.4217 0.4146 0.3996 Y 0.3597 0.3659 0.3521 0.3465 0.3465 0.3521 0.3389 0.3339 0.3578 0.3722 0.3798 0.3646 0.3578 0.3646 0.3502 0.344 0.4191 0.4273 0.4089 0.4015 C.A F2 X 0.3548 0.3641 0.3615 0.3530 0.3571 0.3668 0.3641 0.3548 0.3702 0.3

736 0.3869 0.3825 0.3771 0.3916 0.3869 0.3736 0.3941 0.3996 0.4146 0.408 Y 0.3736 0.3804 0.3659 0.3597 0.3907 0.3957 0.3804 0.3736 0.3722 0.3874 0.3958 0.3798 0.4034 0.4127 0.3958 0.3874 0.3848 0.4015 0.4089 0.3916 C.A F3 X 0.3641 0.3736 0.3702 0.3615 0.3668 0.3771 0.3736 0.3641 0.3825 0.3869 0.4006 0.395 0.3916 0.4064 0.4006 0.3869 0.3889 0.3941 0.408 0.4017 Y 0.3804 0.3874 0.3722 0.3659 0.3957 0.4034 0.3874 0.3804 0.3798 0.3958 0.4044 0.3875 0.4127 0.4221 0.4044 0.3958 0.369 0.3848 0.3916 0.3751 C.A F4 X 0.3615 0.3702 0.3670 0.3590 0.359 0.367 0.364 0.3567 0.3783 0.3825 0.395 0.3898 0.3783 0.3898 0.3848 0.3743 0.3889 0.4017 0.3957 0.384 Y 0.3659 0.3722 0.3578 0.3521 0.3521 0.3578 0.344 0.3389 0.3646 0.3798 0.3875 0.3716 0.3646 0.3716 0.3565 0.3502 0.369 0.3751 0.3596 0.354

F5

F6

F7

F8

G1

G2

G3

G4

G5

G6

G7

G8

H6

H2

H1

H5

ANSI Natural

White Color bin structures

CIE chromaticity coordinates (ANSI Warm White)C.A H1 X 0.4082 0.3941 0.3889 0.4017 0.4344 0.4221 0.4147 0.4260 0.4586 0.4465 0.4373 0.4483 Y 0.3922 0.3848 0.3690 0.3752 0.4032 0.3984 0.3814 0.3853 0.4103 0.4071 0.3893 0.3918 C.A H2 X 0.4146 0.3996 0.3941 0.4082 0.4430 0.4299 0.4221 0.4344 0.4687 0.4562 0.4465 0.4586 Y 0.4089 0.4015 0.3848 0.3922 0.4212 0.4165 0.3984 0.4032 0.4289 0.4260 0.4071 0.4103 C.A H3 X 0.4299 0.4146 0.4082 0.4221 0.4562 0.4430 0.4344 0.4465 0.4813 0.4687 0.4586 0.4700 Y 0.4165 0.4089 0.3922 0.3984 0.4260 0.4212 0.4032 0.4071 0.4319 0.4289 0.4103 0.4126 C.A H4 X 0.4221 0.4082 0.4017 0.4147 0.4465 0.4344 0.4260 0.4373 0.4700 0.4586 0.4483 0.4593 Y 0.3984 0.3922 0.3752 0.3814 0.4071 0.4032 0.3853 0.3893 0.4126 0.4103 0.3918 0.3944

K1

K2

K3

K4

L1

L2

L3

L4

ANSI Warm White Color bin structures

CIE chromaticity coordinates (ANSI Warm Lighting)C.A WL1 X 0.4728 0.4813 0.4936 0.4855 0.4968 0.5053 0.5169 0.5081 0.5194 0.5286 0.5404 0.5308 Y 0.4174 0.4319 0.4306 0.4162 0.4151 0.4294 0.4281 0.4140 0.4130 0.4269 0.4256 0.4119 C.A WL2 X 0.4646 0.4728 0.4855 0.4778 0.4886 0.4968 0.5081 0.4995 0.5104 0.5194 0.5308 0.5212 Y 0.4034 0.4174 0.4162 0.4022 0.4012 0.4151 0.4140 0.4002 0.3992 0.4130 0.4119 0.3982 C.A WL3 X 0.4855 0.4936 0.5053 0.4968 0.5081 0.5169 0.5286 0.5194 Y 0.4162 0.4306 0.4294 0.4151 0.4140 0.4281 0.4269 0.4130 C.A WL4 X 0.4778 0.4855 0.4968 0.4886 0.4995 0.5081 0.5194 0.5104 Y 0.4022 0.4162 0.4151 0.4012 0.4002 0.4140 0.4130 0.3992

WL5

WL6

WL7

WL8

WL9

WL10

ANSI Warm Lighting Color bin structures

Color coordinates measurement allowance is ± 0.005

To order specify color temperature ranks, please contact OPSCO Lighting Holdings LTD. for further information. Thermal Pad Temperature @25℃ @ 20mA

8. 1 Optical-Electrical Characteristic Graphs (InGaN)

Typical Relative Luminous Flux vs. Forward Current150% 120%Normalized Luminous Flux Forward Current(mA)

Forward Voltage vs. Forward Current150

100% 80% 60% 40% 20% 0.00 0 10 15 20 50 150 Forward Current(mA)

20

10

1 0.0 1.0 2.0 3.0 4.0 5.0 Forward Voltage(V) Tj=25

° C

Thermal Pad Temperature vs. Relative Light Output120%Relative Emission Distribution Normalized Luminous Flux

Wavelength Characteristics100% BLUE 80% 60% 40% 20% 0.00 400

GREEN WL WT NW BW

100% 80% 60% 40% 20% 0.00 0 20 40 60 80 100 120 Thermal Pad Temperature (T=25° C)

450

500

550

600

650

700

750 800

Wavelength (nm)

Thermal Pad Temperature vs. Forward Current100 80 60 60° 40 20 0 0 20 40 60 80 100 120 Thermal Pad Temperature (° C) 90 75 60 45 30 15 0 90° 0.2 0.4 0.6 0.8 1.0

Typical Radiation Pattern 120°0 30°

Forward Current (mA)

Radiation Angle

8.2 Optical-Electrical Characteristic Graphs (AlInGaP)

Typical Relative Luminous Flux vs. Forward Current150% 120%Normalized Luminous Flux Forward Current(mA)

Forward Voltage vs. Forward Current150

100% 80% 60% 40% 20% 0.00 0 10 15 20 30 50 Forward Current(mA)

20

10

1 0.0 1.5

3.0

4.5

Forward Voltage(V) Tj=25 ° C

Thermal Pad Temperature vs. Relative Light Output120%Relative Emission Distribution Normalized Luminous Flux

Wavelength Characteristics100% 80% 60% 40% 20% 0.00 400 Yellow

100% 80% 60% 40% 20% 0.00 0 20 40 60 80 100 120 Thermal Pad Temperature (T=25° C)

Red

450

500

550

600

650

700

750

800

Wavelength (nm)

Thermal Pad Temperature vs. Forward Current50 40 30 20 10 0 0 20 40 60 80 100 120 90 75 60 45 30 15 Thermal Pad Temperature (° C) 90° 0 0.2 0.4 0.6 0.8 1.0 60°

Typical Radiation Pattern 120°0 30°

Forward Current (mA)

Radiation Angle

9. Packaging Standard

TOP SMD LED Application Notes

1. Features

The Purposes of making OPSCO’s customers and users to have a clear understanding on the ways how to use the LED. 2. Description

Generally. The LED can be used the same way as other general purposed semiconductors. When using OPSCO’s TOP SMD LED, the following precautions must be taken to protect the LED. 3. Cautions

3.1. Dust & Cleaning

This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps should be taken to keep the emitter free of dust.

These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in an enclosed area after installing the emitters.

Surface condition of this device may change when organic solvents such as trichloroethylene or acetone were applied. Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.

3.2. Moisture Proof Package

In order to avoid the absorption of moisture during transportation and storage, LED are packed in the aluminum envelop, A desiccant is included in the aluminum envelop as it absorbs moisture. When moisture is absorbed into the AMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. 3.3. Storage

In order to avoid the absorption of moisture, It is recommended to store SMD LED (in bulk or taped) in the dry box (or the desiccator ) with a desiccant, Otherwise to store them in the following environment as recommended.

a. Temperature: 5℃~30℃ b. Humidity: 60% RH Max

It is recommended to solder the LED as soon as possible after unpacking the aluminum envelop, But in case that the LED have to be left unused after unpacking envelop again is requested.

The LED should be soldering within 1 hours after opening the package. If baking is required, A baking treatment should be performed as follows: 70℃±5℃ for more than 24 hours.

3.4. Reflow Soldering Characteristics

In testing, OPSCO has found S50 LEDs to be compatible with JEDEC J-STD-020C,using the parameters listed below. As a general guideline OPSCO recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used.

Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and Configurations of reflow soldering equipment

16 / 17

3.5. Heat Generation

Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as components. It is necessary to avoid in tense heat generation and operate within the maximum rating given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs

3.6. Electrostatic Discharge & Surge Current

Electrostatic discharge (ESD) or surge current (EOS) may damage LED.

Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of LED.

All devices, equipment and machinery must be properly grounded. It is recommended to per form electrical test to screen out ESD failures at final inspection. It is important to eliminate the possibility of surge current during circuitry design.

3.7. Other Can not take any responsibility for any trouble that are caused by using the LEDs at conditions exceeding our specifications. These LEDs are designed and manufactured for standard applications such as electric home appliances, communication equi pment, office equipment, electronic equipment and so on. It is recommended to consult us in advance if user’s application requires any particular quality or reliability which concerns hu man life. Examples would be medical equipment, aerospace applications, traffic signals, safety system equipment and so on. Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LED s with unaided eyes for more than a few seconds. The formal specification must be exchanged and signed by both parties before large volume purchase begins. The appearance and specifications of the product may be modified for improvement without notice.

Change HistoryFCN No. Date 2014-10-07 Rev. No. 01 Changes/Reason of changes Initial Document

Items Prepared by Checked by Approved by FCN#

Signatures Kevin Zhu

Date 2014-10-07

Note

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