HPD2F_REV_2_PRELIMINARY_DATASHEET_2010-03-03

2.25.2010

DATA SHEET

HPD2F PRELIMINARY REV 2

FEATURES APPLICATIONS

? High Power

? Low Profile Surface Mount Package ? Very Low Insertion Loss

? Excellent Amplitude and Phase Balance ? High Isolation ? RoHS

? Tape and Reel for High Volume Production

? Power Amplifiers

? Signal Distribution Networks ? Antenna Feeds ? Switch Networks

? High Power Combiners/Splitters ? Phase Shifters

GENERAL DESCRIPTION

The HPD2F is a high performance 3dB hybrid coupler in a surface mount package. This low profile coupler handles up to 25 watts of CW power. The HPD2F is designed for those demanding applications where low loss, excellent amplitude and phase balance are required.

The HPD2F is manufactured with materials that have thermal expansion characteristics compatible with industry

standard board materials like RO3003, RO4350, FR4 and others. The couplers are available in a RoHS complaint finish and packaged in both reel and tube.

ELECTRICAL SPECIFICATIONS*

Specification Notes:

* Measured on Florida RF Labs test fixture 008-40-074. Specifications are subject to change without notice. ** Power rating is specified at 85?C base temperature

3dB HYBRID COUPLER

Frequency MHz

Isolation dB (min)

Insertion Loss dB (max)

VSWR

Amplitude Balance dB (max)

Phase Error ° (max)

Power Handling ** Watts CW

ΘJC °C/Watt

Operating Temperature

°C

800 - 1000

17

0.45

1.40

± 0.35

90 ± 3.5

25

40.8

-55 to +85

REV -

2.25.20102.26.2010

DATA SHEET

HPD2F PRELIMINARY REV 2

2 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified

700MHZ - 1100MHZ RF PERFORMANCE AT 25°C

0.7

0.8

0.9

1

1.1

Frequency (GHz)

COUPLING

-4.5

-4

-3.5

-3

-2.5

-20.7

0.8

0.9

1

1.1

Frequency (GHz)

VSWR

1

1.11.2

1.3

1.4

1.51.60.7

0.8

0.9

1

1.1

Frequency (GHz)

ISOLATION

-40

-35

-30

-25

-20

-15

0.7

0.8

0.9

1

1.1

Frequency (GHz)

INSERTION LOSS

-0.7

-0.65

-0.6-0.55

-0.5-0.45-0.4

-0.35-0.3

-0.250.7

0.8

0.9

1

1.1

Frequency (GHz)

AMPLITUDE DIFFERENCE

00.10.20.30.40.50.60.70.80.910.7

0.8

0.9

1

1.1

Frequency (GHz)

PHASE ERROR

1

2

3

4

5

REV -

2.25.20102.26.2010

DATA SHEET

HPD2F PRELIMINARY REV 2 5 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified POWER POWER DERATING

23 W

y = -0.2174x + 43.4780

5

10

15

20

25

30

-55-54595

145195245

Base Temperature, C P o w e r , W

REV -

2.25.20102.26.2010

DATA SHEET

HPD2F PRELIMINARY REV 2 6 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified COUPLER PIN CONFIGURATION AND MECHANICAL OUTLINE

REV -

2.25.20102.26.2010

DATA SHEET

HPD2F PRELIMINARY REV 2 7 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified MOUNTING INSTRUCTIONS

To ensure proper operation, all transmission lines must have a characteristic impedance of 50?. Grounding is also vital for proper performance. Grounding can be improved by increasing the number of vias to minimize ground inductance. In creased vias allow for low impedance ground connection and good thermal conduction. The device is attached to the PCB by using solder paste positioned at the location where RF terminals come into contact with the trace and where the device contact ground. The coupler is then positioned in such a way that the RF terminals must come into contact and align with the PCB trace and solder. In addition, the device ground plane must align with the solder to have good connection to ground. The conventional reflow method, where controlled temperature hot air is used to cause solder reflow, is the recommended to attach the device to the PCB. The max reflow temperature should never exceed 260°C. The use of conventional irons may cause damage to the device and should be avoided.

REV -

2.25.20102.26.2010

DATA SHEET HPD2F PRELIMINARY REV 2

8 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified

COMMONLY USED ATTACHMENT MATERIALS

Material

Composition

Thermal Conductivity ( Watts/cm/°C )

Melting Temperature

( °C )

Gold-Tin Solder 80% Gold / 20% Tin 0.58 280 Lead-Free Solder 99.3% Tin – 0.7% Copper N/A 227 Lead-Free Solder 96.5% Tin / 3.5% Silver 0.33 221 Lead-Free Solder 96.5% Tin / 3% Silver / 0.5% Copper

N/A 217 - 220 Sn63 Solder 63% Tin / 37% Lead

0.49 183 Conductive Epoxy

Silver Filled

0.01 to 0.29

N/A

CIRCUIT BOARD LAYOUT

In order to achieve the specified RF performance, an optimized RF test board must be used for testing this hybrid coupler. Florida RF Labs test board (008-40-074) constructed with Rogers RO3003 high frequency board material is shown below.

REV -

2.25.20102.26.2010

DATA SHEET HPD2F PRELIMINARY REV 2

9 90f41d4808a1284ac85043b6 ? 90f41d4808a1284ac85043b6 ? 772-286-9300

AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified

SOLDERING PROFILE

280240200160

120

80

40

A I

R

C O

O

L

RAMP-UP

160 ± 5?

C

60 sec REFLOW 220 ± 5?C

60 sec

PRE-FLOW 180 ± 5?C 60 –

90 sec

PEAK

240 ± 5?

C

30 sec

A I R C O O L

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